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Materials Science
DualBeam FIB Cross Sectioning
FIB cross section generation with DualBeam tools for automated and high throughput subsurface characterization.
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Site-specific cross-section for scratch testing and adhesion of a paint coating,
performed on a Helios G4 PFIB DualBeam.
performed on a Helios G4 PFIB DualBeam.
Modern materials characterization is increasingly reliant on sub-surface characterization for a more comprehensive understanding of the material’s structure and physical properties. Cross-sectioning with a DualBeam instrument, which combines a focused ion beam with a scanning electron microscope (FIB-SEM), allows you to mill the material with FIB and perform high-resolution SEM imaging at nanometer scale. In failure analysis, for instance, this allows for defects to be located under the surface, making DualBeams instruments ideal for identification of the root cause of failures.
Along with high-resolution SEM imaging, cross-section characterization on the DualBeam can be expanded with back-scattered electron (BSE) imaging for maximum materials contrast, energy-dispersive X-ray spectroscopy (EDS) for compositional information, and electron backscatter diffraction (EBSD) for microstructural and crystallographic information.
Additionally, with the introduction of the Thermo Scientific Helios 5 Hydra DualBeam, we now offer the flexibility of argon, oxygen, xenon, and nitrogen ion species in one instrument, allowing you to choose the best FIB type for each of your experiments. Xenon ions are well suited for high-throughput removal of various materials, like metals and ceramics, whereas oxygen ions provide superior milling quality for carbon-based samples. In case extremely large volume characterization is needed, the Thermo Scientific Helios 5 Laser PFIB System is an additional solution. It enables high-throughput cross-sectioning up to millimeter scale, as well as processing of materials that are typically challenging for ion beams (e.g. charging or beam sensitive samples). We combine these unique DualBeam capabilities with our versatile software solutions to bring you a range of workflows for advanced 3D characterization and high-resolution analysis at the nanometer scale.
Curtain-free large-area cross section of a silicon sample performed on the Helios Hydra DualBeam in less than one minute. This process was completed without a protective capping layer, showcasing the high-quality round beam to achieve superior cross-section quality with the argon focused ion beam.
Comparison of cross-section quality when milled using different ion types. For carbon-based materials, the oxygen ion beam typically shows improved cut face quality, as is shown for this automotive oil filter casing (polymer/glass-fiber composite). Horizontal field width is 350 µm.
Cross section of an additive manufacturing powder (CuAgAl) using the Scios DualBeam. EBSD map (inset) shows grains size distribution and orientation within the particle.
Large-area cross section of a solder bump completed in 15 minutes. The curtain-free, high-quality cut face is suitable for XHR (extreme high resolution) SEM imaging.
Curtain-free large-area cross section of a silicon sample performed on the Helios Hydra DualBeam in less than one minute. This process was completed without a protective capping layer, showcasing the high-quality round beam to achieve superior cross-section quality with the argon focused ion beam.
Comparison of cross-section quality when milled using different ion types. For carbon-based materials, the oxygen ion beam typically shows improved cut face quality, as is shown for this automotive oil filter casing (polymer/glass-fiber composite). Horizontal field width is 350 µm.
Cross section of an additive manufacturing powder (CuAgAl) using the Scios DualBeam. EBSD map (inset) shows grains size distribution and orientation within the particle.
Large-area cross section of a solder bump completed in 15 minutes. The curtain-free, high-quality cut face is suitable for XHR (extreme high resolution) SEM imaging.
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