As I discussed in my 2024 year-end article, the semiconductor industry’s growth has highlighted the critical need for precise TEM (transmission electron microscopy) metrology. As devices shrink and become more complex, the necessity for atomic-scale imaging and measurement grows. The industry is approaching a 10× increase in the amount of TEM analysis needed compared to previous levels. To control manufacturing processes, TEM metrology provides essential measurement data, which gives engineers a clear view of fabrication results at the atomic level.
Metrology accuracy is maintained because the TEM is calibrated to the silicon lattice. It serves as a “ground truth” reference for process control, ensuring early detection of deviations in semiconductor fabrication while helping to validate new designs, enabling iterative prototype refinement, and accelerating development cycles. As sampling needs increase, automated TEM systems handling high sample volumes become indispensable.

TEM metrology data showing height and width of DRAM structures
Customers face several challenges in TEM metrology, including the difficulty of scaling operations quickly, improving data quality (accuracy, reliability, repeatability), and managing the sample preparation and TEM imaging processes effectively. The high reliance on skilled labor makes it hard to reduce operational expenses, while long data cycle times hinder efficiency. Additionally, the gap between lab operations and semiconductor fabrication facilities (fabs) complicates the timely delivery of quality data to the fab.
The industry can no longer rely on traditional methods. To accelerate time to data, the old ways of TEM metrology need to change. We need to streamline TEM metrology data collection between the lab and the fab. This is precisely what we’ve been developing: a revolutionary, fully integrated, TEM metrology lab solution. Stay tuned for the announcement on March 18, 2025, to experience the start of a new era in automated TEM metrology.
Leave a Reply