{"id":1047,"date":"2026-07-01T13:17:18","date_gmt":"2026-07-01T13:17:18","guid":{"rendered":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/?p=1047"},"modified":"2026-07-01T20:15:43","modified_gmt":"2026-07-01T20:15:43","slug":"non-destructive-semiconductor-defect-detection-advanced-packaging-technology","status":"publish","type":"post","link":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/non-destructive-semiconductor-defect-detection-advanced-packaging-technology\/","title":{"rendered":"Non-Destructive Semiconductor Defect Detection\u00a0in\u00a0Advanced Packaging\u00a0Technology"},"content":{"rendered":"<h3 style=\"font-size: 100%\"><span class=\"SCXW227383815 BCX0\" lang=\"EN-US\" xml:lang=\"EN-US\" data-contrast=\"auto\"><span class=\"NormalTextRun SCXW227383815 BCX0\">Key highlights<\/span><\/span><\/h3>\n\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"42\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"1\" data-aria-level=\"1\"><span data-contrast=\"auto\">Compared to conventional package designs, semiconductor defect detection\u00a0is\u00a0more difficult\u00a0for\u00a0advanced packaging\u00a0because failure sites are smaller,\u00a0more deeply embedded, and\u00a0are\u00a0distributed across more material interfaces<\/span><span data-ccp-props=\"{&quot;201341983&quot;:0,&quot;335559740&quot;:278}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"42\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"2\" data-aria-level=\"1\"><span data-contrast=\"auto\">Non-destructive techniques such as X-ray computed tomography, scanning acoustic microscopy, and lock-in thermography provide critical information on advanced\u00a0packages\u00a0that can\u00a0facilitate\u00a0higher-resolution analysis with destructive techniques<\/span><span data-ccp-props=\"{&quot;201341983&quot;:0,&quot;335559740&quot;:278}\">\u00a0<\/span><\/li>\n<\/ul>\n<ul>\n<li data-leveltext=\"\uf0b7\" data-font=\"Symbol\" data-listid=\"42\" data-list-defn-props=\"{&quot;335552541&quot;:1,&quot;335559685&quot;:720,&quot;335559991&quot;:360,&quot;469769226&quot;:&quot;Symbol&quot;,&quot;469769242&quot;:[8226],&quot;469777803&quot;:&quot;left&quot;,&quot;469777804&quot;:&quot;\uf0b7&quot;,&quot;469777815&quot;:&quot;hybridMultilevel&quot;}\" data-aria-posinset=\"3\" data-aria-level=\"1\"><span data-contrast=\"auto\">A full workflow that integrates non-destructive localization with higher-resolution imaging and elemental analysis is becoming increasingly\u00a0critical\u00a0for\u00a0the development of advanced semiconductor packages<\/span><span data-ccp-props=\"{&quot;201341983&quot;:0,&quot;335559740&quot;:278}\">\u00a0<\/span><\/li>\n<\/ul>\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<div class=\"wp-block-group is-layout-constrained wp-block-group-is-layout-constrained\">\n<h2 style=\"font-size: 100%\"><strong><span class=\" SCXW263610809 BCX0\">Understanding the<\/span><span class=\"NormalTextRun SCXW263610809 BCX0\">\u00a0complexity of advanced packaging technology<\/span><\/strong><\/h2>\n<\/div>\n\n\n\n<p>Compared to other semiconductor devices, the advanced packages\u00a0used\u00a0for\u00a0AI and\u00a0other\u00a0high-performance computing applications integrate more dies, interconnects, and metal layers into smaller, denser architectures.\u00a0This\u00a0complexity makes defects harder to see, localize, and characterize; as a result, non-destructive inspection techniques\u00a0are becoming\u00a0an\u00a0increasingly critical first step in defect and failure analysis\u00a0workflows.\u00a0The challenge is not simply finding a\u00a0defect;\u00a0it is connecting electrical\u00a0and thermal\u00a0behavior\u00a0with\u00a0structural\u00a0data\u00a0into a complete\u00a0picture of the\u00a0root\u00a0cause.\u00a0Methods\u00a0such as\u00a0X-ray computed tomography\u00a0(XCT), scanning acoustic microscopy\u00a0(SAM), and lock-in thermography\u00a0(LIT)\u00a0can\u00a0all\u00a0contribute to\u00a0non-destructive\u00a0analysis of\u00a0advanced structures,\u00a0supporting failure analysis of\u00a0dense 2.5D, 3D, high-bandwidth memory\u00a0(HBM), and chiplet-based packages.\u00a0<\/p>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n<h2 style=\"font-size: 100%\"><strong><span class=\"TextRun SCXW92385977 BCX0\" lang=\"EN-US\" xml:lang=\"EN-US\" data-contrast=\"auto\"><span class=\"NormalTextRun SCXW92385977 BCX0\">Why\u00a0<\/span><span class=\"NormalTextRun SCXW92385977 BCX0\">are\u00a0<\/span><span class=\"NormalTextRun SCXW92385977 BCX0\">advanced packag<\/span><span class=\"NormalTextRun SCXW92385977 BCX0\">ing defects\u00a0<\/span><span class=\"NormalTextRun SCXW92385977 BCX0\">difficult<\/span><span class=\"NormalTextRun SCXW92385977 BCX0\">\u00a0to detect?<\/span><\/span><span class=\"EOP SCXW92385977 BCX0\" data-ccp-props=\"{}\">\u00a0<\/span><\/strong><\/h2>\n\n\n<p>High-performance computing workloads, such as AI,&nbsp;move&nbsp;large amounts&nbsp;of data quickly between&nbsp;logic, memory, and specialized&nbsp;compute&nbsp;elements. To support&nbsp;this, semiconductor manufacturers increasingly&nbsp;rely on&nbsp;advanced packaging architectures such as 3D stacks, HBM, through-silicon vias (TSVs),&nbsp;microbumps,&nbsp;or&nbsp;chiplet-based heterogeneous&nbsp;structures.&nbsp;<\/p>\n\n\n\n<p>While these&nbsp;architectures&nbsp;can help increase bandwidth&nbsp;and&nbsp;integrate more functionality into a smaller footprint,&nbsp;they also make failure analysis more difficult. Critical failure sites may be buried inside stacked structures, hidden below dense metal layers, or distributed across multiple material interfaces. Defects may occur across TSVs,&nbsp;microbumps,&nbsp;and any number of heterogeneous&nbsp;interfaces.&nbsp;<\/p>\n\n\n\n<p>For&nbsp;failure analysis&nbsp;teams, this means inspection results need to be interpreted as part of larger&nbsp;analytical&nbsp;workflows.&nbsp;The identification of&nbsp;hotspots, void-like features,&nbsp;or&nbsp;acoustic reflections&nbsp;may&nbsp;not fully elucidate the failure, and could only provide&nbsp;an indication&nbsp;of&nbsp;where to investigate next.&nbsp;<\/p>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"460\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/defects-1024x460-1.png\" alt=\"Illustration of semiconductor advanced package technology with examples of defects across dies, devices, and metrology layers. \" class=\"wp-image-1051\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/defects-1024x460-1.png 1024w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/defects-1024x460-1-300x135.png 300w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/defects-1024x460-1-768x345.png 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><figcaption class=\"wp-element-caption\"><strong>Figure 1<\/strong>.\u00a0Advanced packaging architectures introduce\u00a0the potential for\u00a0multiple defect locations across dies, interconnects, package structures,\u00a0or\u00a0other\u00a0layers.<\/figcaption><\/figure>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n<h2 style=\"font-size: 100%\"><strong><span class=\"NormalTextRun SCXW129354009 BCX0\">The benefits of\u00a0<\/span><span class=\"NormalTextRun SCXW129354009 BCX0\">n<\/span><span class=\"NormalTextRun SCXW129354009 BCX0\">on-destructive\u00a0<\/span><span class=\"NormalTextRun SCXW129354009 BCX0\">defect localization<\/span><\/strong><\/h2>\n\n\n<p>No single method can reveal every defect type, and a combination of\u00a0XCT, SAM, and LIT\u00a0data is often necessary\u00a0to fully understand and localize defects.\u00a0As they are non-destructive, they can all be applied prior to follow-up root-cause analysis, although this\u00a0could\u00a0substantially slow\u00a0down the overall analytical workflow.\u00a0Non-destructive inspection\u00a0is therefore most beneficial\u00a0as a way to\u00a0quickly\u00a0identify\u00a0regions of interest for\u00a0subsequent\u00a0sample preparation\u00a0and\/or\u00a0destructive\u00a0higher-resolution\u00a0characterization, which can consist\u00a0of\u00a0targeted cross-sectioning, TEM\u00a0imaging,\u00a0elemental analysis, and more.<\/p>\n\n\n<h2 style=\"font-size: 100%\"><strong><span class=\"NormalTextRun SCXW235550380 BCX0\">What\u00a0<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">can\u00a0<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">X-ray CT\u00a0<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">reveal\u00a0<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">about<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">\u00a0<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">advanced\u00a0<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">semiconductor\u00a0<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">packages<\/span><span class=\"NormalTextRun SCXW235550380 BCX0\">?<\/span><\/strong><\/h2>\n\n\n<p>Non-destructive&nbsp;X-ray computed tomography&nbsp;can&nbsp;provide&nbsp;3D structural insight&nbsp;that&nbsp;help engineers inspect internal package features such as TSVs,&nbsp;microbumps,&nbsp;and&nbsp;solder joints,&nbsp;as well as any&nbsp;voids, cracks,&nbsp;and package-level defects&nbsp;that these may&nbsp;contain. XCT is especially useful when critical structures are buried inside the package.&nbsp;<\/p>\n\n\n\n<p>The capabilities of&nbsp;XCT&nbsp;are, however,&nbsp;limited by&nbsp;the&nbsp;density of&nbsp;AI-focused packages, as their metal-rich structures can strongly absorb X-rays, which can create artifacts, limit penetration, and reduce image quality. Low-density materials such as polymers and oxides can&nbsp;also&nbsp;be difficult to distinguish when contrast is limited. Higher-resolution scans can provide more details, but&nbsp;these&nbsp;likely&nbsp;require&nbsp;longer scan times, making them less practical for high-volume analysis.<\/p>\n\n\n<h2 style=\"font-size: 100%\"><strong><span class=\"TextRun SCXW55675598 BCX0\" lang=\"EN-US\" xml:lang=\"EN-US\" data-contrast=\"auto\"><span class=\"NormalTextRun SCXW55675598 BCX0\">What\u00a0<\/span><span class=\"NormalTextRun SCXW55675598 BCX0\">is the role of<\/span><span class=\"NormalTextRun SCXW55675598 BCX0\">\u00a0scanning acoustic microscopy\u00a0<\/span><span class=\"NormalTextRun SCXW55675598 BCX0\">in<\/span><span class=\"NormalTextRun SCXW55675598 BCX0\">\u00a0defect detection<\/span><span class=\"NormalTextRun SCXW55675598 BCX0\">?<\/span><\/span><span class=\"EOP SCXW55675598 BCX0\" data-ccp-props=\"{}\">\u00a0<\/span><\/strong><\/h2>\n\n\n<p>Scanning acoustic microscopy detects&nbsp;changes at material interfaces,&nbsp;using&nbsp;ultrasound to&nbsp;identify&nbsp;internal discontinuities such as&nbsp;delamination, adhesion failures,&nbsp;and&nbsp;bond integrity issues.&nbsp;Interfacial&nbsp;defects&nbsp;have a particularly significant impact on&nbsp;advanced packages&nbsp;because AI-driven architectures combine materials that respond differently to thermal and mechanical stress.&nbsp;<\/p>\n\n\n\n<p>Similar to XCT,&nbsp;scanning acoustic microscopy&nbsp;faces a&nbsp;tradeoff between&nbsp;resolution&nbsp;and&nbsp;penetration.&nbsp;Lower-frequency SAM can inspect deeper into a package, but with lower resolution. Higher-frequency SAM can improve resolution for thinner layers,&nbsp;microbumps, or bonding interfaces, but penetration depth decreases. This makes&nbsp;scanning acoustic microscopy&nbsp;valuable for detecting interface-related defects, especially delamination and voiding, but less effective when the issue involves fine interconnect defects, deeply buried features, or metal-dense structures.&nbsp;<\/p>\n\n\n<h2 style=\"font-size: 100%\"><strong><span class=\"NormalTextRun SCXW159322409 BCX0\">How lock-in thermography helps localize electrical failures<\/span><span class=\"NormalTextRun SCXW159322409 BCX0\">\u00a0in advanced packages<\/span><\/strong><\/h2>\n\n\n<p>Lock-in thermography helps localize defects by detecting abnormal thermal changes across a device, which can be associated with electrical or material failures such as shorts, joint failures, and resistive defects. Lock-in thermography is particularly useful for failure analysis of advanced packaging, because many failures first appear as electrical symptoms that result in localized heating.&nbsp;<\/p>\n\n\n\n<p>Lock-in thermography helps you pursue fine structural insight with greater confidence by showing where abnormal thermal activity occurs. It does not, however, reveal detailed geometry, composition, or the nanoscale failure mechanism behind hotspots; these necessitate\u202fadditional\u202fanalysis.&nbsp;<\/p>\n\n\n<h2 style=\"font-size: 100%\"><strong><span class=\"NormalTextRun SCXW211693423 BCX0\">Why<\/span><span class=\"NormalTextRun SCXW211693423 BCX0\">\u00a0semiconductor<\/span><span class=\"NormalTextRun SCXW211693423 BCX0\">\u00a0root<\/span><span class=\"NormalTextRun SCXW211693423 BCX0\">\u00a0<\/span><span class=\"NormalTextRun SCXW211693423 BCX0\">cause<\/span><span class=\"NormalTextRun SCXW211693423 BCX0\">\u00a0identification<\/span><span class=\"NormalTextRun SCXW211693423 BCX0\">\u00a0requires\u00a0<\/span><span class=\"NormalTextRun SCXW211693423 BCX0\">multi-modal failure analysis<\/span><\/strong><\/h2>\n\n\n<p>The&nbsp;limitations&nbsp;of these various non-destructive methods&nbsp;can affect yield learning, reliability assessment, and production timelines, as&nbsp;they could require&nbsp;multiple inspection passes&nbsp;to&nbsp;correlate&nbsp;electrical, thermal, structural, and material data. This is&nbsp;especially&nbsp;important&nbsp;for&nbsp;AI-driven packages because&nbsp;they&nbsp;consist&nbsp;of&nbsp;many tightly integrated components and interconnect paths.&nbsp;Even a&nbsp;small defect in a buried interconnect can&nbsp;have a substantial impact on&nbsp;electrical performance&nbsp;and&nbsp;long-term reliability.&nbsp;<\/p>\n\n\n\n<p>As a result, advanced packaging teams should think about defect detection as a connected workflow rather than a single inspection event. Strong failure analysis combines non-destructive testing and localization with high-resolution, 3D imaging and elemental analysis that leverages technologies such as FIB-SEM and TEM. Together, these methods can span the entire investigative process from localization to root-cause confirmation.\u00a0<\/p>\n\n\n<h2 style=\"font-size: 100%\"><strong><span class=\"NormalTextRun SCXW197943164 BCX0\">What<\/span><span class=\"NormalTextRun SCXW197943164 BCX0\">\u00a0are critical considerations for<\/span><span class=\"NormalTextRun SCXW197943164 BCX0\">\u00a0advanced packaging manufacturers<\/span><span class=\"NormalTextRun SCXW197943164 BCX0\">?<\/span><\/strong><\/h2>\n\n\n<p>As AI-driven semiconductor packaging continues to scale, inspection challenges will likely become more complex. Failure analysis workflows that combine non-destructive localization with precise sample preparation and high-resolution analysis can help engineers move more efficiently from a suspected defect location to root-cause confirmation.&nbsp;<\/p>\n\n\n\n<p>Thermo Fisher Scientific supports advanced packaging failure analysis across wafer, die, and device levels, from defect localization and site-specific sample preparation to high-resolution imaging and elemental analysis. These connected workflows reveal buried defects and failure mechanisms, supporting yield and reliability improvements in complex 2.5D, 3D, HBM, and chiplet-based architectures.&nbsp;<\/p>\n\n\n\n<p>For more information on advanced packaging failure analysis, including common failure mechanisms, inspection techniques, and multi-level workflows from wafer to die and device, explore our <a href=\"https:\/\/documents.thermofisher.com\/TFS-Assets\/MSD\/Reference-Materials\/innovative-failure-analysis-solutions-for-advanced-packaging-wp.pdf\" target=\"_blank\" rel=\"noreferrer noopener\"><em>&#8220;Innovative failure analysis solutions for advanced packaging&#8221; whitepaper &gt;<\/em><\/a>&nbsp;<\/p>\n\n\n\n<p><a href=\"https:\/\/www.thermofisher.com\/us\/en\/home\/semiconductors\/defect-localization.html\" target=\"_blank\" rel=\"noreferrer noopener\">Learn more about other Thermo Scientific failure analysis solutions for the semiconductor industry &gt;<\/a>&nbsp;<\/p>\n\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Key highlights Compared to conventional package designs, semiconductor defect detection\u00a0is\u00a0more difficult\u00a0for\u00a0advanced packaging\u00a0because failure sites are smaller,\u00a0more deeply embedded, and\u00a0are\u00a0distributed across more material interfaces\u00a0 Non-destructive techniques such as X-ray computed tomography, scanning acoustic microscopy, and lock-in thermography provide critical information on advanced\u00a0packages\u00a0that can\u00a0facilitate\u00a0higher-resolution analysis with destructive techniques\u00a0 A full workflow that integrates non-destructive localization with higher-resolution<\/p>\n","protected":false},"author":1809,"featured_media":1048,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_monsterinsights_skip_tracking":false,"_genesis_hide_title":false,"_genesis_hide_breadcrumbs":false,"_genesis_hide_singular_image":false,"_genesis_hide_footer_widgets":false,"_genesis_custom_body_class":"","_genesis_custom_post_class":"","_genesis_layout":"","_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_post_was_ever_published":false},"categories":[186,187,20,19],"tags":[],"division":[],"class_list":{"0":"post-1047","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-advanced-packaging","8":"category-ai-semiconductor-manufacturing","9":"category-failure-analysis","10":"category-semiconductor","11":"entry"},"_selected_authors":[1442],"_selected_reviewers":[],"acf":[],"yoast_head":"<!-- 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