{"id":108,"date":"2020-12-02T16:12:28","date_gmt":"2020-12-02T16:12:28","guid":{"rendered":"https:\/\/admin.acceleratingscience.com\/semiconductors\/2020\/12\/02\/looking-to-increase-semiconductor-sample-success-rates\/"},"modified":"2023-07-27T20:59:10","modified_gmt":"2023-07-27T20:59:10","slug":"looking-to-increase-semiconductor-sample-success-rates","status":"publish","type":"post","link":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/looking-to-increase-semiconductor-sample-success-rates\/","title":{"rendered":"Looking to Increase Semiconductor Sample Success Rates?"},"content":{"rendered":"<p>In our <a href=\"https:\/\/www.thermofisher.com\/blog\/microscopy\/semiconductor-failure-analysis-takes-daysit-should-take-hours\/\">previous blog<\/a>, we talked about how failure analysis has become a tedious and time-consuming job. FA engineers work with larger sample volumes and more complex device architectures, making it challenging to obtain precise data from every sample. FA engineers demand, fast, repeatable, high-quality milling and imaging to reduce bottlenecks caused by inefficient failure analysis workflows and increase time-to-data. The right instrument for the job is one that automates key workflows with high quality imaging to collect data from every sample.<\/p>\n<h2 style=\"color: white;font-size: 50%\">Failure analysis of semiconductor samples with the Helios 5 PFIB DualBeam<\/h2>\n<p>Our new Thermo Fisher Scientific <strong>Helios 5 PFIB DualBeam FIB-SEM<\/strong> provides unique, site-specific, delayering and failure analysis workflows for advanced logic, 3D NAND, and 2.5\/3D packaging. It also provides high speed, large area cross-sectioning, high-resolution TEM sample preparation, sub-nanometer low energy SEM performance, and automated deprocessing with end pointing for the shortest time to nanoscale information.<\/p>\n<div style=\"width: 528px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" style=\"vertical-align: middle;margin: 10px\" title=\"High resolution, top down view of deprocessed 3D NAND\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/3d20nand20deprocessing.png\" alt=\"High resolution image of 3D NAND\" width=\"518\" height=\"446\" \/><p class=\"wp-caption-text\">High resolution, top down view of deprocessed 3D NAND<\/p><\/div>\n<p>We also understand efficient sample analysis relies on optimum tool alignment to provide the highest performance under any circumstances. The SmartAlign feature included in the Helios 5 PFIB simplifies the process and eliminates the need to micro-monitor SEM alignments for automated delayering, TEM prep and slice and view cross-sectioning<\/p>\n<p>Both automation and high-throughput, high-resolution analysis are crucial for time-strapped FA engineers and lab managers. The advanced capabilities of the Helios 5 PFIB speeds up time-to-data and increases productivity. Our <a href=\"https:\/\/www.thermofisher.com\/us\/en\/home\/about-us\/events\/industrial\/helios-5-pfib-webinar.html\">webinar<\/a> includes more details on how the Helios 5 PFIB enables higher sample throughput and better automation for semiconductor failure analysis, reducing your time-to-data to <strong>hours instead of days or weeks<\/strong>.<\/p>\n<p><a href=\"https:\/\/ter.li\/rke9vg\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-518 size-full\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172.jpg\" alt=\"Subscribe to Thermo Fisher Scientific's semiconductor updates and resources\" width=\"1000\" height=\"172\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172.jpg 1000w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172-300x52.jpg 300w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172-768x132.jpg 768w\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" \/><\/a><\/p>\n<p><em>David Akerson is a Senior Global Market Development Manager for semiconductors at Thermo Fisher Scientific.<\/em><\/p>\n<p>\/\/\/<\/p>\n","protected":false},"excerpt":{"rendered":"<p>In our previous blog, we talked about how failure analysis has become a tedious and time-consuming job. FA engineers work with larger sample volumes and more complex device architectures, making it challenging to obtain precise data from every sample. FA engineers demand, fast, repeatable, high-quality milling and imaging to reduce bottlenecks caused by inefficient failure<\/p>\n","protected":false},"author":1346,"featured_media":110,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_monsterinsights_skip_tracking":false,"_genesis_hide_title":false,"_genesis_hide_breadcrumbs":false,"_genesis_hide_singular_image":false,"_genesis_hide_footer_widgets":false,"_genesis_custom_body_class":"","_genesis_custom_post_class":"","_genesis_layout":"","_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_post_was_ever_published":false},"categories":[25],"tags":[],"division":[],"class_list":{"0":"post-108","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-general","8":"entry"},"_selected_authors":"","_selected_reviewers":"","acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v27.8 (Yoast SEO v27.8) - 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