{"id":262,"date":"2022-09-28T09:31:56","date_gmt":"2022-09-28T09:31:56","guid":{"rendered":"https:\/\/admin.acceleratingscience.com\/semiconductors\/?p=262"},"modified":"2026-03-03T00:13:48","modified_gmt":"2026-03-03T00:13:48","slug":"new-laser-ablation-solution-helios-pfib-semiconductor-packaging","status":"publish","type":"post","link":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/new-laser-ablation-solution-helios-pfib-semiconductor-packaging\/","title":{"rendered":"New Ablation Solution for Advanced Semiconductor Packaging Increases Helios PFIB Throughput and Precision"},"content":{"rendered":"

Advanced semiconductor packaging calls for advanced failure analysis solutions<\/strong><\/h2>\n

Today\u2019s semiconductors<\/a> are a marvel to behold for anyone that appreciates intricate structures. For example, 2.5D and 3D packages<\/a> contain multiple die types of hard and soft, insulating and conducting materials. Within each die bonded to interposers, substrates, or another die, high-density circuits and beam-sensitive materials coexist to create an increasingly sophisticated device.<\/p>\n

While these devices enable superior performance, they also create a more challenging inspection, metrology<\/a>, and testing environment. The ability to accurately target and remove materials in bulk without damage to sensitive regions of interest with high throughput is essential. In many cases, the region of interest (ROI) is a one-of-a-kind defect where the success rate needs to be at 100%.<\/p>\n

Faced with these challenges, large volume analysis approaches have been developed to supplement the capabilities of a Focused Ion Beam (FIB) with a 1) standalone semiconductor ablation tool or 2) with an ablation laser in a second chamber accessible via a transfer portal. These solutions are effective for bulk milling, but both approaches have shortcomings when faced with precision failure analysis applications such as advanced semiconductor devices.<\/p>\n

Watch our Spark Webinar now on-demand to learn about new laser ablation solutions<\/em><\/a><\/p>\n

Sample navigation accuracy is limited when transferring a sample between a semiconductor ablation tool<\/a> (either a stand-alone laser or one within a separate chamber) to a FIB. This error leads to larger processing times to reach the ROI. Since the initial laser-ablated cut-face is often as large as ~1 mm2<\/sup>, any error in its placement leads to additional large volumes the FIB must remove to selectively reach the ROI or defect. The maximum FIB current available is directly related to the removal rate making the plasma focused ion beam (PFIB) the preferred choice compared to the traditional FIB.<\/p>\n

\"Bulk

Bulk material removal<\/p><\/div>\n

Making a DualBeam a TriBeam with integrated semiconductor laser ablation <\/strong><\/h2>\n

To address current solutions\u2019 deficiencies and provide flexibility in processing and analyzing a broad range of materials, Thermo Fisher Scientific has expanded its DualBeam product line<\/a> with a fully integrated femtosecond laser in a single chamber.<\/p>\n

Thermo Fisher Scientific Helios 5 Laser PFIB integrates a plasma focused ion beam (PFIB), a femtosecond laser, and a scanning electron beam in a single chamber for maximum throughput and precision. Furthermore, the three beams are at a single coincident axis for the highest throughput, success rate, and precision for semiconductor packaging failure analysis.<\/p>\n

Benefits of a plasma beam, femtosecond laser, and single coincident axis\u00a0 <\/strong><\/h2>\n