{"id":369,"date":"2025-08-14T08:13:00","date_gmt":"2025-08-14T08:13:00","guid":{"rendered":"https:\/\/admin.acceleratingscience.com\/semiconductors\/?p=369"},"modified":"2026-03-02T22:52:58","modified_gmt":"2026-03-02T22:52:58","slug":"tem-analysis-semiconductor-development","status":"publish","type":"post","link":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/","title":{"rendered":"Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights"},"content":{"rendered":"<h2 style=\"font-size: 100%\"><strong>What is the current state of TEM in semiconductor analysis?<\/strong><\/h2>\n<p>Transmission electron microscopy (TEM) has become a crucial tool in semiconductor manufacturing. Modern semiconductor fabrication requires atomic-scale imaging and analysis capabilities, particularly for complex three-dimensional (3D) structures, such as gate-all-around (GAA) logic transistors and 3D NAND memory channels.<\/p>\n<h2 style=\"font-size: 100%\"><strong>How does TEM technology work?<\/strong><\/h2>\n<p>TEM operates by directing an electron beam through an ultra-thin sample. The transmitted electrons interact with various filters, detectors, and cameras below the sample. Key operational aspects include:<\/p>\n<ul>\n<li>Acceleration voltages\u201460 kV to 300 kV range for semiconductor applications<\/li>\n<li>Resolution capability\u2014down to individual atom visualization<\/li>\n<li>Analysis modes\u2014TEM and STEM (scanning TEM)<\/li>\n<\/ul>\n<div id=\"attachment_829\" style=\"width: 1075px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-829\" class=\"size-full wp-image-829\" title=\"Diagram comparing optical microscope with light source and lenses to TEM with electron source and lenses\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/tundra-educational-blog-image-2.jpg\" alt=\"Diagram comparing optical microscope with light source and lenses to TEM with electron source and lenses\" width=\"1065\" height=\"855\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/tundra-educational-blog-image-2.jpg 1065w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/tundra-educational-blog-image-2-300x241.jpg 300w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/tundra-educational-blog-image-2-1024x822.jpg 1024w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/tundra-educational-blog-image-2-768x617.jpg 768w\" sizes=\"auto, (max-width: 1065px) 100vw, 1065px\" \/><p id=\"caption-attachment-829\" class=\"wp-caption-text\">Fig 1: Comparison diagram of optical microscope and TEM configurations.<\/p><\/div>\n<h2 style=\"font-size: 100%\"><strong>What are the key differences between TEM and STEM modes?<\/strong><\/h2>\n<p>TEM mode:<\/p>\n<ul>\n<li>Uses a focused beam on the sample<\/li>\n<li>Captures transmitted electrons in a single snapshot<\/li>\n<li>Employs high-speed, high-resolution cameras<\/li>\n<li>Offers faster, simpler operation<\/li>\n<\/ul>\n<div id=\"attachment_830\" style=\"width: 747px\" class=\"wp-caption alignnone\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-830\" class=\"wp-image-830 size-full\" title=\"Schematic of TEM mode operation displaying electron source, lenses, specimen holder, and viewing screen in sequence.\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-overview.jpg\" alt=\"Schematic of TEM mode operation displaying electron source, lenses, specimen holder, and viewing screen in sequence.\" width=\"737\" height=\"655\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-overview.jpg 737w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-overview-300x267.jpg 300w\" sizes=\"auto, (max-width: 737px) 100vw, 737px\" \/><p id=\"caption-attachment-830\" class=\"wp-caption-text\">Fig 2: Schematic illustration of TEM mode operation.<\/p><\/div>\n<p>STEM mode:<\/p>\n<ul>\n<li>Utilizes electromagnetic scan coils<\/li>\n<li>Scans a focused beam across the sample<\/li>\n<li>Multiple detector configurations available<\/li>\n<li>Provides flexible, high-contrast imaging<\/li>\n<\/ul>\n<div id=\"attachment_833\" style=\"width: 763px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-833\" class=\"size-full wp-image-833\" title=\"Schematic of STEM mode operation displaying electron source, lenses, scanning coils, specimen holder, detector, and viewing screen in sequence\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/STEM-overview.jpg\" alt=\"Schematic of STEM mode operation displaying electron source, lenses, scanning coils, specimen holder, detector, and viewing screen in sequence\" width=\"753\" height=\"577\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/STEM-overview.jpg 753w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/STEM-overview-300x230.jpg 300w\" sizes=\"auto, (max-width: 753px) 100vw, 753px\" \/><p id=\"caption-attachment-833\" class=\"wp-caption-text\">Fig 3: Schematic illustration of STEM mode operation.<\/p><\/div>\n<h2 style=\"font-size: 100%\"><strong>How has automation enhanced TEM analysis?<\/strong><\/h2>\n<p>Modern semiconductor TEM systems feature significant automation improvements:<\/p>\n<ul>\n<li>Simplified parameter selection<\/li>\n<li>Automated alignment and calibration<\/li>\n<li>Reduced data distortion risk<\/li>\n<li>Atomic-scale image calibration<\/li>\n<li>Streamlined operation for various sample types<\/li>\n<\/ul>\n<h2 style=\"font-size: 100%\"><strong><br \/>\nWhy is TEM critical for semiconductor manufacturing?<\/strong><\/h2>\n<p>TEM serves as the primary source for reference data in semiconductor design and fabrication due to:<\/p>\n<ul>\n<li>Increased 3D device complexity<\/li>\n<li>Shrinking critical dimensions<\/li>\n<li>EUV lithography requirements<\/li>\n<li>Need for atomic interface analysis<\/li>\n<li>Strain and magnetic field measurements<\/li>\n<\/ul>\n<h2 style=\"font-size: 100%\"><strong><br \/>\nWhat are the key applications and the industry impact?<\/strong><\/h2>\n<p>Leading semiconductor manufacturers now generate tens of thousands of TEM datasets monthly for:<\/p>\n<ul>\n<li>Process variation analysis<\/li>\n<li>Wafer fab tool calibration<\/li>\n<li>Defect mechanism investigation<\/li>\n<li>Quality control<\/li>\n<\/ul>\n<div id=\"attachment_834\" style=\"width: 1205px\" class=\"wp-caption aligncenter\"><img loading=\"lazy\" decoding=\"async\" aria-describedby=\"caption-attachment-834\" class=\"size-full wp-image-834\" title=\"Line graph depicting the increasing trend in semiconductor TEM analysis usage\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-sample-volumes.jpg\" alt=\"Line graph depicting the increasing trend in semiconductor TEM analysis usage\" width=\"1195\" height=\"629\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-sample-volumes.jpg 1195w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-sample-volumes-300x158.jpg 300w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-sample-volumes-1024x539.jpg 1024w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/TEM-sample-volumes-768x404.jpg 768w\" sizes=\"auto, (max-width: 1195px) 100vw, 1195px\" \/><p id=\"caption-attachment-834\" class=\"wp-caption-text\">Fig 4: Graph showing growth trend in semiconductor TEM analysis usage.<\/p><\/div>\n<h2 style=\"font-size: 100%\"><strong><br \/>\nSummary<\/strong><\/h2>\n<ul>\n<li>TEM technology provides atomic-level imaging and analysis capabilities<\/li>\n<li>Dual-mode operation (TEM\/STEM) offers flexible analysis options<\/li>\n<li>Automation advances have simplified operation and improved reliability<\/li>\n<li>Critical role in semiconductor manufacturing quality control<\/li>\n<li>Essential for next-generation device development<\/li>\n<\/ul>\n<p><a href=\"https:\/\/ter.li\/rke9vg\" target=\"_blank\" rel=\"noopener\"><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-518 size-full\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172.jpg\" alt=\"Subscribe to Thermo Fisher Scientific's semiconductor updates and resources\" width=\"1000\" height=\"172\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172.jpg 1000w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172-300x52.jpg 300w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/07\/Opt-in-Banner_1000x172-768x132.jpg 768w\" sizes=\"auto, (max-width: 1000px) 100vw, 1000px\" \/><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>What is the current state of TEM in semiconductor analysis? Transmission electron microscopy (TEM) has become a crucial tool in semiconductor manufacturing. Modern semiconductor fabrication requires atomic-scale imaging and analysis capabilities, particularly for complex three-dimensional (3D) structures, such as gate-all-around (GAA) logic transistors and 3D NAND memory channels. How does TEM technology work? TEM operates<\/p>\n","protected":false},"author":1391,"featured_media":835,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_monsterinsights_skip_tracking":false,"_genesis_hide_title":false,"_genesis_hide_breadcrumbs":false,"_genesis_hide_singular_image":false,"_genesis_hide_footer_widgets":false,"_genesis_custom_body_class":"","_genesis_custom_post_class":"","_genesis_layout":"","_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_post_was_ever_published":false},"categories":[25,19,23],"tags":[16,97],"division":[],"class_list":{"0":"post-369","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-general","8":"category-semiconductor","9":"category-transmission-electron-microscopy","10":"tag-electronics-semiconductors","11":"tag-transmission-electron-microscope","12":"entry"},"_selected_authors":[1449],"_selected_reviewers":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v27.8 (Yoast SEO v27.8) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>TEM Analysis - Semiconductor - Illuminating Semiconductors<\/title>\n<meta name=\"description\" content=\"Explore how TEM&#039;s dual-mode operation, atomic-level imaging, flexible analysis and automation enable next-gen semiconductor development.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights\" \/>\n<meta property=\"og:description\" content=\"Explore how TEM&#039;s dual-mode operation, atomic-level imaging, flexible analysis and automation enable next-gen semiconductor development.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/\" \/>\n<meta property=\"og:site_name\" content=\"Illuminating Semiconductors\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/thermofisher\" \/>\n<meta property=\"article:published_time\" content=\"2025-08-14T08:13:00+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-03-02T22:52:58+00:00\" \/>\n<meta property=\"og:image\" content=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450.png\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" content=\"450\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"Brianna Radicioni\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@thermofisher\" \/>\n<meta name=\"twitter:site\" content=\"@thermofisher\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Brianna Radicioni\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/\"},\"author\":{\"name\":\"Brianna Radicioni\",\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#\\\/schema\\\/person\\\/2bd9f2cd8f714e3113d94c1612205906\"},\"headline\":\"Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights\",\"datePublished\":\"2025-08-14T08:13:00+00:00\",\"dateModified\":\"2026-03-02T22:52:58+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/\"},\"wordCount\":377,\"commentCount\":0,\"image\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2025\\\/08\\\/Semi-APJ-3-Blog-Header_1920x450.png\",\"keywords\":[\"Electronics\\\/Semiconductors\",\"transmission electron microscope\"],\"articleSection\":[\"General\",\"Semiconductor\",\"Transmission Electron Microscopy\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/\",\"url\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/\",\"name\":\"TEM Analysis - Semiconductor - Illuminating Semiconductors\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2025\\\/08\\\/Semi-APJ-3-Blog-Header_1920x450.png\",\"datePublished\":\"2025-08-14T08:13:00+00:00\",\"dateModified\":\"2026-03-02T22:52:58+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#\\\/schema\\\/person\\\/2bd9f2cd8f714e3113d94c1612205906\"},\"description\":\"Explore how TEM's dual-mode operation, atomic-level imaging, flexible analysis and automation enable next-gen semiconductor development.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#primaryimage\",\"url\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2025\\\/08\\\/Semi-APJ-3-Blog-Header_1920x450.png\",\"contentUrl\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2025\\\/08\\\/Semi-APJ-3-Blog-Header_1920x450.png\",\"width\":1920,\"height\":450},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/tem-analysis-semiconductor-development\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#website\",\"url\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/\",\"name\":\"Illuminating Semiconductors\",\"description\":\"Semiconductor manufacturing stories and solutions about a more connected, more autonomous, and smarter world\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#\\\/schema\\\/person\\\/2bd9f2cd8f714e3113d94c1612205906\",\"name\":\"Brianna Radicioni\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e8b33a5e67ca0918f85bde6cbe97f1d1c2e947932e5e7240aefa9feb0ba728b8?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e8b33a5e67ca0918f85bde6cbe97f1d1c2e947932e5e7240aefa9feb0ba728b8?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/e8b33a5e67ca0918f85bde6cbe97f1d1c2e947932e5e7240aefa9feb0ba728b8?s=96&d=mm&r=g\",\"caption\":\"Brianna Radicioni\"},\"url\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/author\\\/bradicioni\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"TEM Analysis - Semiconductor - Illuminating Semiconductors","description":"Explore how TEM's dual-mode operation, atomic-level imaging, flexible analysis and automation enable next-gen semiconductor development.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/","og_locale":"en_US","og_type":"article","og_title":"Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights","og_description":"Explore how TEM's dual-mode operation, atomic-level imaging, flexible analysis and automation enable next-gen semiconductor development.","og_url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/","og_site_name":"Illuminating Semiconductors","article_publisher":"https:\/\/www.facebook.com\/thermofisher","article_published_time":"2025-08-14T08:13:00+00:00","article_modified_time":"2026-03-02T22:52:58+00:00","og_image":[{"width":1920,"height":450,"url":"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450.png","type":"image\/png"}],"author":"Brianna Radicioni","twitter_card":"summary_large_image","twitter_creator":"@thermofisher","twitter_site":"@thermofisher","twitter_misc":{"Written by":"Brianna Radicioni","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#article","isPartOf":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/"},"author":{"name":"Brianna Radicioni","@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#\/schema\/person\/2bd9f2cd8f714e3113d94c1612205906"},"headline":"Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights","datePublished":"2025-08-14T08:13:00+00:00","dateModified":"2026-03-02T22:52:58+00:00","mainEntityOfPage":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/"},"wordCount":377,"commentCount":0,"image":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#primaryimage"},"thumbnailUrl":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450.png","keywords":["Electronics\/Semiconductors","transmission electron microscope"],"articleSection":["General","Semiconductor","Transmission Electron Microscopy"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/","url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/","name":"TEM Analysis - Semiconductor - Illuminating Semiconductors","isPartOf":{"@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#primaryimage"},"image":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#primaryimage"},"thumbnailUrl":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450.png","datePublished":"2025-08-14T08:13:00+00:00","dateModified":"2026-03-02T22:52:58+00:00","author":{"@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#\/schema\/person\/2bd9f2cd8f714e3113d94c1612205906"},"description":"Explore how TEM's dual-mode operation, atomic-level imaging, flexible analysis and automation enable next-gen semiconductor development.","breadcrumb":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#primaryimage","url":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450.png","contentUrl":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450.png","width":1920,"height":450},{"@type":"BreadcrumbList","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-analysis-semiconductor-development\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/admin.acceleratingscience.com\/semiconductors\/"},{"@type":"ListItem","position":2,"name":"Transmission Electron Microscopy in Semiconductors: Generating Ground Truth Insights"}]},{"@type":"WebSite","@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#website","url":"https:\/\/admin.acceleratingscience.com\/semiconductors\/","name":"Illuminating Semiconductors","description":"Semiconductor manufacturing stories and solutions about a more connected, more autonomous, and smarter world","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/admin.acceleratingscience.com\/semiconductors\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#\/schema\/person\/2bd9f2cd8f714e3113d94c1612205906","name":"Brianna Radicioni","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/e8b33a5e67ca0918f85bde6cbe97f1d1c2e947932e5e7240aefa9feb0ba728b8?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/e8b33a5e67ca0918f85bde6cbe97f1d1c2e947932e5e7240aefa9feb0ba728b8?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/e8b33a5e67ca0918f85bde6cbe97f1d1c2e947932e5e7240aefa9feb0ba728b8?s=96&d=mm&r=g","caption":"Brianna Radicioni"},"url":"https:\/\/admin.acceleratingscience.com\/author\/bradicioni\/"}]}},"taxonomy_info":{"category":[{"value":25,"label":"General"},{"value":19,"label":"Semiconductor"},{"value":23,"label":"Transmission Electron Microscopy"}],"post_tag":[{"value":16,"label":"Electronics\/Semiconductors"},{"value":97,"label":"transmission electron microscope"}]},"featured_image_src_large":["https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450-1024x240.png",760,178,true],"author_info":{"display_name":"Brianna Radicioni","author_link":"https:\/\/admin.acceleratingscience.com\/author\/bradicioni\/"},"comment_info":0,"category_info":[{"term_id":25,"name":"General","slug":"general","term_group":0,"term_taxonomy_id":25,"taxonomy":"category","description":"","parent":0,"count":13,"filter":"raw","meta":[],"cat_ID":25,"category_count":13,"category_description":"","cat_name":"General","category_nicename":"general","category_parent":0},{"term_id":19,"name":"Semiconductor","slug":"semiconductor","term_group":0,"term_taxonomy_id":19,"taxonomy":"category","description":"","parent":0,"count":27,"filter":"raw","meta":[],"cat_ID":19,"category_count":27,"category_description":"","cat_name":"Semiconductor","category_nicename":"semiconductor","category_parent":0},{"term_id":23,"name":"Transmission Electron Microscopy","slug":"transmission-electron-microscopy","term_group":0,"term_taxonomy_id":23,"taxonomy":"category","description":"","parent":0,"count":11,"filter":"raw","meta":[],"cat_ID":23,"category_count":11,"category_description":"","cat_name":"Transmission Electron Microscopy","category_nicename":"transmission-electron-microscopy","category_parent":0}],"tag_info":[{"term_id":16,"name":"Electronics\/Semiconductors","slug":"electronics-semiconductors","term_group":0,"term_taxonomy_id":16,"taxonomy":"post_tag","description":"","parent":0,"count":25,"filter":"raw","meta":[]},{"term_id":97,"name":"transmission electron microscope","slug":"transmission-electron-microscope","term_group":0,"term_taxonomy_id":97,"taxonomy":"post_tag","description":"","parent":0,"count":4,"filter":"raw","meta":[]}],"jetpack-related-posts":[{"id":625,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/dram-device-dram-fabrication-tem-metrology\/","url_meta":{"origin":369,"position":0},"title":"Enhancing High-Volume DRAM Manufacturing with Automated TEM Metrology and Characterization","author":"Xiaoting Gu","date":"November 6, 2025","format":false,"excerpt":"Dynamic random-access memory (DRAM) plays a crucial role in computing devices, providing fast access to essential data and allowing them to operate at peak performance. For DRAM device manufacturers, scaling is important as it enables lower cost per unit area by enabling reductions in DRAM cell size. However, as DRAM\u2026","rel":"","context":"In &quot;Failure Analysis&quot;","block_context":{"text":"Failure Analysis","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/failure-analysis\/"},"img":{"alt_text":"DRAM memory","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=1050%2C600&ssl=1 3x"},"classes":[]},{"id":1047,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/non-destructive-semiconductor-defect-detection-advanced-packaging-technology\/","url_meta":{"origin":369,"position":1},"title":"Non-Destructive Semiconductor Defect Detection\u00a0in\u00a0Advanced Packaging\u00a0Technology","author":"Swarnim Rawat","date":"July 1, 2026","format":false,"excerpt":"Key highlights Compared to conventional package designs, semiconductor defect detection\u00a0is\u00a0more difficult\u00a0for\u00a0advanced packaging\u00a0because failure sites are smaller,\u00a0more deeply embedded, and\u00a0are\u00a0distributed across more material interfaces\u00a0 Non-destructive techniques such as X-ray computed tomography, scanning acoustic microscopy, and lock-in thermography provide critical information on advanced\u00a0packages\u00a0that can\u00a0facilitate\u00a0higher-resolution analysis with destructive techniques\u00a0 A full workflow that\u2026","rel":"","context":"In &quot;Advanced Packaging&quot;","block_context":{"text":"Advanced Packaging","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/semiconductor\/advanced-packaging\/"},"img":{"alt_text":"Advanced packaging","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=1050%2C600&ssl=1 3x"},"classes":[]},{"id":1025,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/advanced-packaging-failure-mechanisms-in-the-ai-era-why-reliability-is-shifting-in-2-5d-and-3d-designs\/","url_meta":{"origin":369,"position":2},"title":"Advanced Packaging Failure Mechanisms in the AI Era: Why Reliability Is Shifting in 2.5D and 3D Designs","author":"Vinay S","date":"May 4, 2026","format":false,"excerpt":"Artificial intelligence (AI) is reshaping semiconductor design. As transistor scaling slows, performance gains are increasingly driven by advanced packaging, especially 2.5D interposers, 3D stacking, hybrid bonding, and high-bandwidth memory (HBM) integration. But this shift is doing more than increasing compute density. This move towards advanced packaging is also fundamentally changing\u2026","rel":"","context":"In &quot;Advanced Packaging&quot;","block_context":{"text":"Advanced Packaging","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/semiconductor\/advanced-packaging\/"},"img":{"alt_text":"Advanced Packaging Failure Mechanisms in the AI Era: Why Reliability Is Shifting in 2.5D and 3D Designs","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=1050%2C600&ssl=1 3x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=1400%2C800&ssl=1 4x"},"classes":[]},{"id":892,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\/","url_meta":{"origin":369,"position":3},"title":"Faster time to data in the fab with multi-ion species plasma FIB","author":"Swarnim Rawat","date":"October 6, 2025","format":false,"excerpt":"This quarter, I am excited to share the news about a newly released system from Thermo Fisher Scientific that will help accelerate yield ramp and address bottlenecks in fab process control. Process engineers are under intense pressure to tune fab equipment to maximize yield, but things do not always go\u2026","rel":"","context":"In &quot;General&quot;","block_context":{"text":"General","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/general\/"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=1050%2C600&ssl=1 3x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=1400%2C800&ssl=1 4x"},"classes":[]}],"jetpack_sharing_enabled":true,"jetpack_featured_media_url":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/08\/Semi-APJ-3-Blog-Header_1920x450.png","_links":{"self":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/posts\/369","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/users\/1391"}],"replies":[{"embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/comments?post=369"}],"version-history":[{"count":0,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/posts\/369\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/media\/835"}],"wp:attachment":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/media?parent=369"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/categories?post=369"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/tags?post=369"},{"taxonomy":"division","embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/division?post=369"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}