{"id":53,"date":"2021-11-18T11:16:01","date_gmt":"2021-11-18T11:16:01","guid":{"rendered":"https:\/\/admin.acceleratingscience.com\/semiconductors\/2021\/11\/18\/process-metrology-examination-display-technology-2\/"},"modified":"2023-07-27T15:51:48","modified_gmt":"2023-07-27T15:51:48","slug":"process-metrology-examination-display-technology-2","status":"publish","type":"post","link":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/","title":{"rendered":"How Advanced Process Metrology Enables Crucial Layer Examination of Display Technology"},"content":{"rendered":"

Process metrology and the development of display technology<\/strong><\/h2>\n

Developers of display technology<\/a> face a host of opportunities and challenges. Opportunities exist across the growing range of screens we view all day, every day. Challenges arise in the pursuit of ever-better picture quality.<\/p>\n

Achieving next-generation performance demands innovation in areas such as backplane technology and light-conversion efficiency. The nature of these innovations places a greater dependency on reliable and accurate measurements from process metrology tools.<\/p>\n

Within a typical display stack, process metrology often focuses on two parts: thin-film transistor (TFT) backplanes and light-emitting units (red, green and blue elements; Figure 1).<\/p>\n

\"Display

Figure 1: The display stack in a mobile device illustrates the layers of interest that affect yield, quality and performance.<\/p><\/div>\n

In an organic LED (OLED) display, the light-emitting units reside within the thin-film transistor backplane and are comprised of molecular layers 100 to 200 nanometers thick. In this core display technology, optical properties are the key area of interest. The surrounding thin-film transistor backplane contains inorganic layers totaling 1 to 5 microns thick. Crucial failures occur here, and electrical properties are of primary interest.<\/p>\n

Imaging the thin-film transistor backplane<\/strong><\/h2>\n

As display resolution increases, features get smaller and structures become more complex. Consequently, it is increasingly important to control both the lateral and vertical critical dimensions. Here, process metrology relies on reliable and repeatable measurements.<\/p>\n

Measuring lateral critical dimensions depends on the resolution of the imaging tool. A versatile solution such as the Thermo Scientific Apreo 2 SEM<\/a> also provides imaging modes that highlight surface features under different contrast settings.<\/p>\n

Measuring vertical critical dimensions is more challenging because backplane manufacturing involves thin-film deposition at the atomic level. Traditionally, such measurements have required a cross-sectional workflow: cleave the sample, perform chemical etching of the cross-section, and then view with an SEM.<\/p>\n

Thermo Fisher Scientific offers the industry\u2019s benchmark workflow based on dual-beam technology: perform a site-specific cut, apply a fine polish with a focused ion beam (FIB), and view the cross-section using high-resolution SEM (Figure 2). The system is also equipped with an automated process metrology solution that ensures the highest repeatability in measurements.<\/p>\n

\"Resolving

Figure 2. The Thermo Scientific Helios 5 DualBeam<\/a> can resolve individual layers of a TFT backplane and measure the thickness of each.<\/p><\/div>\n

Resolving the organic layers with <\/strong>process metrology<\/strong><\/h2>\n

Process metrology is more challenging in light-emitting units that have features and layers at nanometer scale. Organic LED brings additional challenges because organic materials are low-contrast under microscopic view. The materials are also sensitive to moisture and oxygen, such that they may quickly degrade when exposed to air.<\/p>\n

There are two ways to measure an organic LED stack: with dual-beam sample prep combined with transmission electron microscopy (TEM) analysis, or with a dual-beam alone (e.g., Helios 5 FX DualBeam). For both, the key to success is the ability to control the sample quality (e.g., thickness and surface condition).<\/p>\n

For TEM analysis, preparation of thin samples should cause only minimal damage, and our Helios 5 DualBeam is the best choice due to its extraordinary low-kV performance. Further, software-based automation ensures sample repeatability by controlling processes such as lift out and sample thinning. Once a sample has been processed to the desired thickness, it is transferred to a TEM for viewing and measurement.<\/p>\n

In the alternative approach, a workflow that uses Helios 5 FX keeps the sample in vacuum during the transfer onto the in-chamber scanning or transmission electron microscopy (S\/TEM) rod. This prevents degradation due to exposure to air. Performing S\/TEM analysis at 30 kV can also be used to highlight the contrast of organic layers (Figure 3).<\/p>\n

\"FIB

Figure 3. Using FIB-SEM alone, 30 kV S\/TEM can resolve more than 10 layers of an OLED stack.<\/p><\/div>\n

Enhancing your <\/strong>process metrology <\/strong>workflow<\/strong><\/h2>\n

From organic LED to quantum dot to future architectures, advanced process metrology is essential to innovation in display technology. Whether examining a thin-film transistor backplane at micron scale or light-emitting units at nanoscale levels, Thermo Fisher systems provide rapid, efficient and simple solutions that ensure high quality sample preparation and highly repeatable imaging and metrology.<\/p>\n

To be continued<\/em><\/strong><\/p>\n

This post is the second in our series of four focused on display technology<\/a>. The next post will cover the failure analysis of backplanes, panels and modules; and our final post will focus on the technology roadmap as it relates to R&D in materials science.<\/p>\n

\"Subscribe<\/a><\/p>\n

\/\/<\/p>\n

Xiaoting Gu is a product marketing manager at Thermo Fisher Scientific<\/em><\/p>\n","protected":false},"excerpt":{"rendered":"

Process metrology and the development of display technology Developers of display technology face a host of opportunities and challenges. Opportunities exist across the growing range of screens we view all day, every day. Challenges arise in the pursuit of ever-better picture quality. Achieving next-generation performance demands innovation in areas such as backplane technology and light-conversion<\/p>\n","protected":false},"author":1518,"featured_media":60,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_monsterinsights_skip_tracking":false,"_genesis_hide_title":false,"_genesis_hide_breadcrumbs":false,"_genesis_hide_singular_image":false,"_genesis_hide_footer_widgets":false,"_genesis_custom_body_class":"","_genesis_custom_post_class":"","_genesis_layout":"","_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_post_was_ever_published":false},"categories":[1],"tags":[16],"division":[],"class_list":{"0":"post-53","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-uncategorized","8":"tag-electronics-semiconductors","9":"entry"},"_selected_authors":"","_selected_reviewers":"","acf":[],"yoast_head":"\nProcess Metrology - Semiconductor Metrology - Illuminating Semiconductors<\/title>\n<meta name=\"description\" content=\"From organic LED to quantum dots and beyond, advanced semiconductor process metrology is essential to innovation in display technology.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"How Advanced Process Metrology Enables Crucial Layer Examination of Display Technology\" \/>\n<meta property=\"og:description\" content=\"From organic LED to quantum dots and beyond, advanced semiconductor process metrology is essential to innovation in display technology.\" \/>\n<meta property=\"og:url\" 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content=\"@thermofisher\" \/>\n<meta name=\"twitter:site\" content=\"@thermofisher\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Xiaoting Gu\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"5 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/\"},\"author\":{\"name\":\"Xiaoting Gu\",\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#\\\/schema\\\/person\\\/c458b7294b0a978d6cfc33e886ec90c6\"},\"headline\":\"How Advanced Process Metrology Enables Crucial Layer Examination of Display Technology\",\"datePublished\":\"2021-11-18T11:16:01+00:00\",\"dateModified\":\"2023-07-27T15:51:48+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/\"},\"wordCount\":757,\"commentCount\":0,\"image\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2022\\\/04\\\/process-metrology-1200x630-gray-scaled-1.jpg\",\"keywords\":[\"Electronics\\\/Semiconductors\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/\",\"url\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/\",\"name\":\"Process Metrology - Semiconductor Metrology - Illuminating Semiconductors\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2022\\\/04\\\/process-metrology-1200x630-gray-scaled-1.jpg\",\"datePublished\":\"2021-11-18T11:16:01+00:00\",\"dateModified\":\"2023-07-27T15:51:48+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#\\\/schema\\\/person\\\/c458b7294b0a978d6cfc33e886ec90c6\"},\"description\":\"From organic LED to quantum dots and beyond, advanced semiconductor process metrology is essential to innovation in display technology.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#primaryimage\",\"url\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2022\\\/04\\\/process-metrology-1200x630-gray-scaled-1.jpg\",\"contentUrl\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2022\\\/04\\\/process-metrology-1200x630-gray-scaled-1.jpg\",\"width\":2560,\"height\":1344,\"caption\":\"Process metrology cross-sectional TEM image of display backplane stack\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/process-metrology-examination-display-technology-2\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"How Advanced Process Metrology Enables Crucial Layer Examination of Display Technology\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#website\",\"url\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/\",\"name\":\"Illuminating Semiconductors\",\"description\":\"Semiconductor manufacturing stories and solutions about a more connected, more autonomous, and smarter world\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#\\\/schema\\\/person\\\/c458b7294b0a978d6cfc33e886ec90c6\",\"name\":\"Xiaoting Gu\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/dcf6f47b319fb3008c86429264ffa1536eb51265f4dc6861759e105b0f4e8c25?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/dcf6f47b319fb3008c86429264ffa1536eb51265f4dc6861759e105b0f4e8c25?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/dcf6f47b319fb3008c86429264ffa1536eb51265f4dc6861759e105b0f4e8c25?s=96&d=mm&r=g\",\"caption\":\"Xiaoting Gu\"},\"url\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/author\\\/xiaotinggu\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO Premium plugin. -->","yoast_head_json":{"title":"Process Metrology - Semiconductor Metrology - Illuminating Semiconductors","description":"From organic LED to quantum dots and beyond, advanced semiconductor process metrology is essential to innovation in display technology.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/","og_locale":"en_US","og_type":"article","og_title":"How Advanced Process Metrology Enables Crucial Layer Examination of Display Technology","og_description":"From organic LED to quantum dots and beyond, advanced semiconductor process metrology is essential to innovation in display technology.","og_url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/","og_site_name":"Illuminating Semiconductors","article_publisher":"https:\/\/www.facebook.com\/thermofisher","article_published_time":"2021-11-18T11:16:01+00:00","article_modified_time":"2023-07-27T15:51:48+00:00","og_image":[{"width":2560,"height":1344,"url":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/process-metrology-1200x630-gray-scaled-1.jpg","type":"image\/jpeg"}],"author":"Xiaoting Gu","twitter_card":"summary_large_image","twitter_creator":"@thermofisher","twitter_site":"@thermofisher","twitter_misc":{"Written by":"Xiaoting Gu","Est. reading time":"5 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#article","isPartOf":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/"},"author":{"name":"Xiaoting Gu","@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#\/schema\/person\/c458b7294b0a978d6cfc33e886ec90c6"},"headline":"How Advanced Process Metrology Enables Crucial Layer Examination of Display Technology","datePublished":"2021-11-18T11:16:01+00:00","dateModified":"2023-07-27T15:51:48+00:00","mainEntityOfPage":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/"},"wordCount":757,"commentCount":0,"image":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#primaryimage"},"thumbnailUrl":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/process-metrology-1200x630-gray-scaled-1.jpg","keywords":["Electronics\/Semiconductors"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/","url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/","name":"Process Metrology - Semiconductor Metrology - Illuminating Semiconductors","isPartOf":{"@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#primaryimage"},"image":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#primaryimage"},"thumbnailUrl":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/process-metrology-1200x630-gray-scaled-1.jpg","datePublished":"2021-11-18T11:16:01+00:00","dateModified":"2023-07-27T15:51:48+00:00","author":{"@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#\/schema\/person\/c458b7294b0a978d6cfc33e886ec90c6"},"description":"From organic LED to quantum dots and beyond, advanced semiconductor process metrology is essential to innovation in display technology.","breadcrumb":{"@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#primaryimage","url":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/process-metrology-1200x630-gray-scaled-1.jpg","contentUrl":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/process-metrology-1200x630-gray-scaled-1.jpg","width":2560,"height":1344,"caption":"Process metrology cross-sectional TEM image of display backplane stack"},{"@type":"BreadcrumbList","@id":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/process-metrology-examination-display-technology-2\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/admin.acceleratingscience.com\/semiconductors\/"},{"@type":"ListItem","position":2,"name":"How Advanced Process Metrology Enables Crucial Layer Examination of Display Technology"}]},{"@type":"WebSite","@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#website","url":"https:\/\/admin.acceleratingscience.com\/semiconductors\/","name":"Illuminating Semiconductors","description":"Semiconductor manufacturing stories and solutions about a more connected, more autonomous, and smarter world","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/admin.acceleratingscience.com\/semiconductors\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/admin.acceleratingscience.com\/semiconductors\/#\/schema\/person\/c458b7294b0a978d6cfc33e886ec90c6","name":"Xiaoting Gu","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/dcf6f47b319fb3008c86429264ffa1536eb51265f4dc6861759e105b0f4e8c25?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/dcf6f47b319fb3008c86429264ffa1536eb51265f4dc6861759e105b0f4e8c25?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/dcf6f47b319fb3008c86429264ffa1536eb51265f4dc6861759e105b0f4e8c25?s=96&d=mm&r=g","caption":"Xiaoting Gu"},"url":"https:\/\/admin.acceleratingscience.com\/author\/xiaotinggu\/"}]}},"taxonomy_info":{"category":[{"value":1,"label":"Uncategorized"}],"post_tag":[{"value":16,"label":"Electronics\/Semiconductors"}]},"featured_image_src_large":["https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/process-metrology-1200x630-gray-scaled-1-1024x538.jpg",760,399,true],"author_info":{"display_name":"Xiaoting Gu","author_link":"https:\/\/admin.acceleratingscience.com\/author\/xiaotinggu\/"},"comment_info":0,"category_info":[{"term_id":1,"name":"Uncategorized","slug":"uncategorized","term_group":0,"term_taxonomy_id":1,"taxonomy":"category","description":"","parent":0,"count":1,"filter":"raw","meta":[],"cat_ID":1,"category_count":1,"category_description":"","cat_name":"Uncategorized","category_nicename":"uncategorized","category_parent":0}],"tag_info":[{"term_id":16,"name":"Electronics\/Semiconductors","slug":"electronics-semiconductors","term_group":0,"term_taxonomy_id":16,"taxonomy":"post_tag","description":"","parent":0,"count":25,"filter":"raw","meta":[]}],"jetpack-related-posts":[{"id":625,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/dram-device-dram-fabrication-tem-metrology\/","url_meta":{"origin":53,"position":0},"title":"Enhancing High-Volume DRAM Manufacturing with Automated TEM Metrology and Characterization","author":"Xiaoting Gu","date":"November 6, 2025","format":false,"excerpt":"Dynamic random-access memory (DRAM) plays a crucial role in computing devices, providing fast access to essential data and allowing them to operate at peak performance. For DRAM device manufacturers, scaling is important as it enables lower cost per unit area by enabling reductions in DRAM cell size. However, as DRAM\u2026","rel":"","context":"In "Failure Analysis"","block_context":{"text":"Failure Analysis","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/failure-analysis\/"},"img":{"alt_text":"DRAM memory","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2024\/04\/DRAM-TEM-Metrology-Blog-Social_1200x630.jpg?resize=1050%2C600&ssl=1 3x"},"classes":[]},{"id":892,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\/","url_meta":{"origin":53,"position":1},"title":"Faster time to data in the fab with multi-ion species plasma FIB","author":"Swarnim Rawat","date":"October 6, 2025","format":false,"excerpt":"This quarter, I am excited to share the news about a newly released system from Thermo Fisher Scientific that will help accelerate yield ramp and address bottlenecks in fab process control. Process engineers are under intense pressure to tune fab equipment to maximize yield, but things do not always go\u2026","rel":"","context":"In "General"","block_context":{"text":"General","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/general\/"},"img":{"alt_text":"","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=1050%2C600&ssl=1 3x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png?resize=1400%2C800&ssl=1 4x"},"classes":[]},{"id":471,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/tem-lamella-preparation-dictates-semiconductor-data-quality\/","url_meta":{"origin":53,"position":2},"title":"High-Quality TEM Lamella Preparation: Critical Factors and Best Practices","author":"David Akerson","date":"September 2, 2025","format":false,"excerpt":"Introduction: The quality of transmission electron microscopy (TEM) lamella preparation directly determines the accuracy and reliability of semiconductor characterization, metrology, and failure analysis data. This article examines the key challenges and solutions in creating high-quality TEM samples for advanced semiconductor applications. Why is TEM sample quality so critical now? The\u2026","rel":"","context":"In "DualBeam (FIB-SEM)"","block_context":{"text":"DualBeam (FIB-SEM)","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/dualbeam-fib-sem\/"},"img":{"alt_text":"TEM lamella preparation","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/06\/Helios-5-Fam-Social-Three_1200x630-no-text-no-logo.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/06\/Helios-5-Fam-Social-Three_1200x630-no-text-no-logo.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/06\/Helios-5-Fam-Social-Three_1200x630-no-text-no-logo.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/06\/Helios-5-Fam-Social-Three_1200x630-no-text-no-logo.jpg?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2023\/06\/Helios-5-Fam-Social-Three_1200x630-no-text-no-logo.jpg?resize=1050%2C600&ssl=1 3x"},"classes":[]},{"id":1047,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/non-destructive-semiconductor-defect-detection-advanced-packaging-technology\/","url_meta":{"origin":53,"position":3},"title":"Non-Destructive Semiconductor Defect Detection\u00a0in\u00a0Advanced Packaging\u00a0Technology","author":"Swarnim Rawat","date":"July 1, 2026","format":false,"excerpt":"Key highlights Compared to conventional package designs, semiconductor defect detection\u00a0is\u00a0more difficult\u00a0for\u00a0advanced packaging\u00a0because failure sites are smaller,\u00a0more deeply embedded, and\u00a0are\u00a0distributed across more material interfaces\u00a0 Non-destructive techniques such as X-ray computed tomography, scanning acoustic microscopy, and lock-in thermography provide critical information on advanced\u00a0packages\u00a0that can\u00a0facilitate\u00a0higher-resolution analysis with destructive techniques\u00a0 A full workflow that\u2026","rel":"","context":"In "Advanced Packaging"","block_context":{"text":"Advanced Packaging","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/semiconductor\/advanced-packaging\/"},"img":{"alt_text":"Advanced packaging","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/07\/advanced-packaging-social-1080x1080-1.jpg?resize=1050%2C600&ssl=1 3x"},"classes":[]},{"id":1025,"url":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/advanced-packaging-failure-mechanisms-in-the-ai-era-why-reliability-is-shifting-in-2-5d-and-3d-designs\/","url_meta":{"origin":53,"position":4},"title":"Advanced Packaging Failure Mechanisms in the AI Era: Why Reliability Is Shifting in 2.5D and 3D Designs","author":"Vinay S","date":"May 4, 2026","format":false,"excerpt":"Artificial intelligence (AI) is reshaping semiconductor design. As transistor scaling slows, performance gains are increasingly driven by advanced packaging, especially 2.5D interposers, 3D stacking, hybrid bonding, and high-bandwidth memory (HBM) integration. But this shift is doing more than increasing compute density. This move towards advanced packaging is also fundamentally changing\u2026","rel":"","context":"In "Advanced Packaging"","block_context":{"text":"Advanced Packaging","link":"https:\/\/admin.acceleratingscience.com\/semiconductors\/semiconductor\/advanced-packaging\/"},"img":{"alt_text":"Advanced Packaging Failure Mechanisms in the AI Era: Why Reliability Is Shifting in 2.5D and 3D Designs","src":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=350%2C200&ssl=1","width":350,"height":200,"srcset":"https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=350%2C200&ssl=1 1x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=525%2C300&ssl=1 1.5x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=700%2C400&ssl=1 2x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=1050%2C600&ssl=1 3x, https:\/\/i0.wp.com\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2026\/05\/why-ai-demands-blog-header-1920x450-1.png?resize=1400%2C800&ssl=1 4x"},"classes":[]}],"jetpack_sharing_enabled":true,"jetpack_featured_media_url":"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2022\/04\/process-metrology-1200x630-gray-scaled-1.jpg","_links":{"self":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/posts\/53","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/users\/1518"}],"replies":[{"embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/comments?post=53"}],"version-history":[{"count":0,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/posts\/53\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/media\/60"}],"wp:attachment":[{"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/media?parent=53"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/categories?post=53"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/tags?post=53"},{"taxonomy":"division","embeddable":true,"href":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/wp-json\/wp\/v2\/division?post=53"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}