{"id":892,"date":"2025-10-06T15:13:35","date_gmt":"2025-10-06T15:13:35","guid":{"rendered":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/?p=892"},"modified":"2026-08-21T22:54:05","modified_gmt":"2026-08-21T22:54:05","slug":"faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib","status":"publish","type":"post","link":"https:\/\/www.thermofisher.com\/blog\/semiconductors\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\/","title":{"rendered":"Faster time to data in the fab with multi-ion species plasma FIB"},"content":{"rendered":"<p>This quarter, I am excited to share the news about a newly released system from Thermo Fisher Scientific that will help accelerate yield ramp and address bottlenecks in fab process control.<\/p>\n<p>Process engineers are under intense pressure to tune fab equipment to maximize yield, but things do not always go according to plan. Innovations in device architecture are adding complexity while demanding tighter control. For example, the 3D NAND roadmap is approaching 1,000 layers, and understanding CD trends throughout the device height is becoming imperative. With continued semiconductor 3D scaling, structures that are tens or hundreds of microns beneath the wafer surface often require SEM-based characterization to qualify a process for yield ramp. Typical fab-based techniques have reached their limits.<\/p>\n<p>This is why we are introducing the Thermo Scientific Helios MX1 PFIB-SEM.<\/p>\n<p>Semiconductor development moves fast, and the Helios MX1 PFIB-SEM is designed with this in mind, offering the ability to place the system in the fab for immediate in-line data. \u00a0Outsourcing metrology or defect analysis to the lab can add several days to the turnaround time. Now, fab engineers can quickly generate, access, and act on data directly.<\/p>\n<p>The ability to perform 3D analysis of structures buried beneath the wafer surface is at the core of Helios MX1 PFIB-SEM technology. To maximize throughput, we have incorporated a multi-ion species plasma FIB column that rapidly removes material to reveal buried features. By using the argon plasma FIB, we have improved throughput by 20x compared to traditional gallium-based milling.<\/p>\n\n\n<figure class=\"wp-block-image aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"356\" src=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Body-Image_1024x356.png\" alt=\"Diagonal mill with plot\" class=\"wp-image-893\" srcset=\"https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Body-Image_1024x356.png 1024w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Body-Image_1024x356-300x104.png 300w, https:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Body-Image_1024x356-768x267.png 768w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p class=\"has-text-align-center has-small-font-size\"><strong>(Left)<\/strong> Argon plasma FIB mill revealing through-volume NAND devices. <strong>(Center)<\/strong> SEM image with nanometer-scale measurements of NAND channel CDs. <strong>(Right)<\/strong> Plot showing individual channel diameters vs. height through the stack.<\/p>\n\n\n<p>We developed the Helios MX1 PFIB-SEM to offer a high-precision workflow for sequential imaging through large-volume samples.\u00a0 These image stacks are automatically reconstructed into detailed 3D models. For metrology, virtual cross-sections can be extracted in any orientation from the 3D dataset to measure profiles such as diameter and shape in individual NAND channels across layers. This approach delivers statistically meaningful data on multi-channel variability and process consistency throughout the device volume.<\/p>\n<p>Our solutions go below the surface to uncover hidden insights within increasingly complex architectures. With a worldwide network of experienced support teams, Thermo Fisher Scientific is a trusted partner in semiconductor development and manufacturing. We are here to help streamline your fab process control.<\/p>\n<p><a href=\"https:\/\/www.thermofisher.com\/content\/lifetech\/global\/en\/home\/electron-microscopy\/products\/dualbeam-fib-sem-microscopes\/helios-mx1-pfib-sem.html?allowwp=true\" target=\"_blank\" rel=\"noopener\"><strong><em>Check out the Helios MX1 PFIB-SEM launch page<\/em><\/strong><\/a><strong><em> \u00a0<\/em><\/strong><\/p>\n\n\n<p><\/p>\n","protected":false},"excerpt":{"rendered":"<p>This quarter, I am excited to share the news about a newly released system from Thermo Fisher Scientific that will help accelerate yield ramp and address bottlenecks in fab process control. Process engineers are under intense pressure to tune fab equipment to maximize yield, but things do not always go according to plan. Innovations in<\/p>\n","protected":false},"author":1809,"featured_media":894,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"_kad_blocks_custom_css":"","_kad_blocks_head_custom_js":"","_kad_blocks_body_custom_js":"","_kad_blocks_footer_custom_js":"","_monsterinsights_skip_tracking":false,"_genesis_hide_title":false,"_genesis_hide_breadcrumbs":false,"_genesis_hide_singular_image":false,"_genesis_hide_footer_widgets":false,"_genesis_custom_body_class":"","_genesis_custom_post_class":"","_genesis_layout":"","_jetpack_newsletter_access":"","_jetpack_dont_email_post_to_subs":false,"_jetpack_newsletter_tier_id":0,"_jetpack_memberships_contains_paywalled_content":false,"_jetpack_feature_clip_id":0,"_jetpack_memberships_contains_paid_content":false,"footnotes":"","jetpack_post_was_ever_published":false},"categories":[25,19],"tags":[],"division":[],"class_list":{"0":"post-892","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-general","8":"category-semiconductor","9":"entry"},"_selected_authors":[1909],"_selected_reviewers":[],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO Premium plugin v27.8 (Yoast SEO v27.8) - https:\/\/yoast.com\/product\/yoast-seo-premium-wordpress\/ -->\n<title>Faster time to data in the fab with multi-ion species plasma FIB - Illuminating Semiconductors<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.thermofisher.com\/blog\/semiconductors\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Faster time to data in the fab with multi-ion species plasma FIB\" \/>\n<meta property=\"og:description\" content=\"This quarter, I am excited to share the news about a newly released system from Thermo Fisher Scientific that will help accelerate yield ramp and address bottlenecks in fab process control. Process engineers are under intense pressure to tune fab equipment to maximize yield, but things do not always go according to plan. Innovations in\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.thermofisher.com\/blog\/semiconductors\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\/\" \/>\n<meta property=\"og:site_name\" content=\"Illuminating Semiconductors\" \/>\n<meta property=\"article:publisher\" content=\"https:\/\/www.facebook.com\/thermofisher\" \/>\n<meta property=\"article:published_time\" content=\"2025-10-06T15:13:35+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-08-21T22:54:05+00:00\" \/>\n<meta property=\"og:image\" content=\"http:\/\/admin.acceleratingscience.com\/semiconductors\/wp-content\/uploads\/sites\/23\/2025\/10\/MX1-POV-Blog-Header_1920x450.png\" \/>\n\t<meta property=\"og:image:width\" content=\"1920\" \/>\n\t<meta property=\"og:image:height\" content=\"450\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"author\" content=\"Swarnim Rawat\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@thermofisher\" \/>\n<meta name=\"twitter:site\" content=\"@thermofisher\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Swarnim Rawat\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\\\/\"},\"author\":{\"name\":\"Swarnim Rawat\",\"@id\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/#\\\/schema\\\/person\\\/cdde30b329dd299358e60b712d525a44\"},\"headline\":\"Faster time to data in the fab with multi-ion species plasma FIB\",\"datePublished\":\"2025-10-06T15:13:35+00:00\",\"dateModified\":\"2026-08-21T22:54:05+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\\\/\"},\"wordCount\":412,\"commentCount\":1,\"image\":{\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/admin.acceleratingscience.com\\\/semiconductors\\\/wp-content\\\/uploads\\\/sites\\\/23\\\/2025\\\/10\\\/MX1-POV-Blog-Header_1920x450.png\",\"articleSection\":[\"General\",\"Semiconductor\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\\\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\\\/\",\"url\":\"https:\\\/\\\/www.thermofisher.com\\\/blog\\\/semiconductors\\\/faster-time-to-data-in-the-fab-with-multi-ion-species-plasma-fib\\\/\",\"name\":\"Faster time to data in the fab with multi-ion species plasma FIB - 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