Thermo Scientific™

Celestron™ TLP/VF-TLP Test System

Catalog number: 10133210
Thermo Scientific™

Celestron™ TLP/VF-TLP Test System

Catalog number: 10133210

The Thermo Scientific™ Celestron™ TLP/VF-TLP Test System can be configured for both Standard TLP and VF-TLP for testing at the wafer level and/or package level. Optional probes can also be used to measure signals on pins or pads other than the ones being stressed. The Celestron system software is the most comprehensive in the industry and utilizes graphics to assist in system setup and connection to the DUT. During test operations, it displays the recorded TLP pulse voltage and current waveforms, compiled pulsed I-V curve, leakage current measurements, and DC I-V curve trace data. The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.

 
Catalog Number
10133210
Unit Size
Each
Description
Celestron TLP/VF-TLP Test System
Price (USD)
Full specifications
Electrical Requirements120/240 VAC 50/60 Hz
Test Voltage RangeUp to 2000 V
TypeTest System
Voltage100/240 V
DescriptionCelestron TLP/VF-TLP Test System
Humidity Range10 - 80% non-condensing
Size (English)23 in.(l) x 22 in. (w) x 24.5 in. (h)
Size (Metric)58.5cm (l) x 56cm (w) x 62.25cm (h)
Specifications DetailsOptions:
Bias supply up to ±50V and 2A DUT test fixture boards
Semi-automatic prober interface software
Custom charge lines (pulse width): 30ns to 200ns
VF-TLP charge lines: 1.2 to 10ns
Custom time delay/TDR-S cables: 10ns to 200ns
Variable pulse widths and rise times from 0.2 to 20ns
Computer switching between 3 pulse widths
Computer switching between 3 rise times
Coaxial and solid wafer probe needles
Kelvin probes to remove wafer contact resistance
Additional ground wafer probes (for TDR and TDT only)
Wafer probes of various radius tips in tungsten and copper
Temperature Range40° to 112°F (5° to 44°C)
Weight (English)Standard system weight: 85 lbs; Shipping weight: 200 lbs
Weight (Metric)Standard system weight: 38.6kg; Shipping weight: 91kg
Hertz50/60 Hz
Certifications/ComplianceTransmission Line Pulse (TLP): Designed in compliance with the current ESD Association Standard Practice Document
Unit SizeEach
Showing 1 of 1
Catalog NumberSpecificationsUnit SizeDescriptionPrice (USD)
10133210Full specifications
EachCelestron TLP/VF-TLP Test SystemRequest A Quote
Electrical Requirements120/240 VAC 50/60 Hz
Test Voltage RangeUp to 2000 V
TypeTest System
Voltage100/240 V
DescriptionCelestron TLP/VF-TLP Test System
Humidity Range10 - 80% non-condensing
Size (English)23 in.(l) x 22 in. (w) x 24.5 in. (h)
Size (Metric)58.5cm (l) x 56cm (w) x 62.25cm (h)
Specifications DetailsOptions:
Bias supply up to ±50V and 2A DUT test fixture boards
Semi-automatic prober interface software
Custom charge lines (pulse width): 30ns to 200ns
VF-TLP charge lines: 1.2 to 10ns
Custom time delay/TDR-S cables: 10ns to 200ns
Variable pulse widths and rise times from 0.2 to 20ns
Computer switching between 3 pulse widths
Computer switching between 3 rise times
Coaxial and solid wafer probe needles
Kelvin probes to remove wafer contact resistance
Additional ground wafer probes (for TDR and TDT only)
Wafer probes of various radius tips in tungsten and copper
Temperature Range40° to 112°F (5° to 44°C)
Weight (English)Standard system weight: 85 lbs; Shipping weight: 200 lbs
Weight (Metric)Standard system weight: 38.6kg; Shipping weight: 91kg
Hertz50/60 Hz
Certifications/ComplianceTransmission Line Pulse (TLP): Designed in compliance with the current ESD Association Standard Practice Document
Unit SizeEach
Showing 1 of 1
  • Wafer and package level TLP testing
  • Integrated WINDOWS® - based system controller
  • High current TLP pulse generator
  • Integrated +/-200V source/meter unit
  • Optional bias supplies (up to 5) under computer control for powered testing and measurements
  • Can be interfaced with semiautomatic probers
  • Advanced, intuitive software for control and report generation
  • Small bench top footprint

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