Capabilities

• The highest sensitivity thermal emission system available in the market
• Real-time lock-in measurement
• Differential temperature resolution of < 1 mK after a few seconds; < 10 μK after a few hours
• Contactless absolute temperature mapping
• Through-package and stacked die analysis
• Six position turret with custom lenses optimized for MWIR emission

Key Features

• Stacked die analysis
  Stacked-die present a unique challenge to the analyst. Whether dealing with a bonded or TSV die stack, LIT may be used to locate defects in X, Y and Z deep within the die stack on fully packaged devices.
• "Unlimited" data accumulation time for better resolution
  The higher the lock-in frequency, the higher the resulting spatial resolution. However, the higher frequency tends to reduce significantly the thermal emission to be detected. This is a limitation for many LIT systems. ELITE system overcomes this limitation by offering a unique system architecture in which higher frequency LIT data can be accumulated for an "unlimited" amount of time. Data resolution improves the longer data acquisition continues.
• Longer acquisition time results in better sensitivity
  The longer the system acquires data, the better the sensitivity. This is particularly valuable when attempting to acquire data at very low power levels or when one must acquire data from a weak failure mode.
• Optional lens flexibility
  The ELITE system is available with either a single lens and camera configuration or with the flexibility of a 6-position turret. A variety of custom, high-quality, MWIR microscope objectives are available including: 28 mm wide angle, 1x, 5x, and 10x yield an effective magnification of 20x, coupled with the 15 μm pixel pitch of the 640 InSb camera.