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Thermo Scientific™
Helios MX1 PFIB-SEM
Introducing the Thermo Scientific Helios MX1 PFIB-SEM, designed to accelerate time-to-data for semiconductor yield ramp and fab process control. This automated system enables rapid, high-throughput analysis of full 300 mm wafers, whether in the fab or the lab.
Catalog number HELIOS-MX1
Price (EUR)
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Introducing the Thermo Scientific Helios MX1 PFIB-SEM, designed to accelerate time-to-data for semiconductor yield ramp and fab process control. This automated system enables rapid, high-throughput analysis of full 300 mm wafers, whether in the fab or the lab. With new multi-ion species plasma FIB technology, ultra-high-resolution SEM imaging, and powerful automation, the Helios MX1 PFIB-SEM facilitates fast, accurate, through volume critical dimension profiles (3D metrology) and defect analysis of buried structures beyond the reach of traditional fab systems.
Key features
- New multi-ion species plasma source (Xe+ / Ar+) for outstanding performance in high-volume removal and precision milling supporting diagonal mill, delayering, and cross section applications.
- New Metrology Studio user interface with flexible SMART targeted activities provides faster time to recipe and simplifies automated metrology development.
- Thermo Scientific MultiChem™ Gas Delivery System provides advanced capabilities for electron and ion beam-induced deposition and etching.
- ECS enables host-driven factory automation.
- iFast Software provides full orchestration of automated wafer navigation, milling, imaging, metrology, 3D reconstruction, virtual slice metrology, and data reporting.
- New Job History Services and web-based unified user interface, Cortex, provide a seamless user experience navigating to process images, designing metrology recipes, viewing metrology results, and 3D reconstructions.
- High-performance server to support accelerated
computation. - New in-chamber, fixed sample calibration standards enable tool calibration and monitoring between wafer loads for improved availability.
- Standardized validation process for metrology performance matching and verification.
Specifications
Resolution920 µm FOV
TypePFIB Wafer DualBeam
Unit SizeEach