Thermo Scientific™

Helios™ G4 FX DualBeam™ for Semiconductors

The Thermo Scientific™ Helios™ G4 FX DualBeam™ microscope is Thermo Fisher Scientific's most advanced failure analysis DualBeam platform, capable of creating high-quality, ultra-thin TEM lamellae for 7nm process development and ramp. Containing the all-new, high-performance Phoenix focused ion beam (FIB) column, the Helios G4 FX DualBeam allows operators to quickly and efficiently create ultra-thin lamellae with minimal damage and maximum cut fidelity. Combining the highest-resolution Elstar+UC scanning electron microscope (SEM) column and the EasyLift Nanomanipulator, the Helios G4 FX DualBeam makes endpointing and in-situ sample lift-out easier than ever. Thermo Scientific's unique MultiChem Gas Delivery System provides optimized beam-assisted deposition and etching capabilities. In addition to simplifying the process for advanced failure analysis and TEM sample preparation, EasyLift and MultiChem improve operator confidence and consistency, reducing overall system Cost of Ownership. The Helios G4 FX DualBeam is also the first DualBeam system to include sub 3Å-resolution STEM imaging, providing advanced Pathfinding Labs with much shorter turnaround times to high quality data. The ability to quickly produce high-quality, actionable 30kV STEM images within the DualBeam provides a clear advantage to FA labs and process developers.
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The world's most advanced DualBeam platform for imaging, analysis, and TEM sample preparation in semiconductor pathfinding and process development laboratories.

The FEI Helios G4 FX DualBeam combines the industry-leading, highest-resolution Elstar+UC SEM with the most advanced Phoenix FIB for best-in-class imaging and milling performance. Added to this field-proven, fourth-generation Helios platform is the most advanced in-situ lift-out and sample manipulation components, an innovative multiple gas delivery system, a dramatically improved 3Å-resolution, low-kV STEM detector, and customizable recipes, creating the most capable and flexible failure analysis instrument available today.