Thermo Scientific™

Quasor II™ EBSD System

Quasor II™ EBSD System
Related applications:

Industrial & Applied Science

Perform simultaneous acquisitions of EBSD data and EDS/WDS spectral images with ease using the Thermo Scientific™ Quasor II™ Electron Backscatter Diffraction. The Quasor II EBSD characterizes crystalline structures which affect physical properties in a wide range of materials examined with scanning electron microscopes (SEMs) and X-ray microanalysis.

A fully integrated extension of the Thermo Scientific™ Pathfinder™ X-ray Microanalysis Software, the Quasor II system includes a full suite of acquisition and analysis capabilities.
Back to top

The Quasor II EBSD system features:

Making EBSD a reality

  • Collection rates up to 600 frames per second with > 99% pixels indexed
  • Three times better signal-to-noise than other CMOS cameras
  • Integrated with Pathfinder X-ray microanalysis for simultaneous EDS/WDS and EBSD data collection
  • One measurement provides both structural and chemical information about the sample
Diffraction pattern processing and Band detect
  • Background removal by subtraction or division
  • Image cropping
  • Flat Fielding with FFT or parabolic
  • Choice of number of bands detected up to 30
  • Image normalization by line length or Hough background
    • Hough filtering with sharp, balanced or smoothed image
    • Hough clipping diameter adjustment to screen pattern quality
    • Hough transform display with editable line selection
    • Choice of number of lines to index up to 30
    • Allow elimination of bands from index scheme up to 25%
    • Automatic ranked index by band intensity
    • Crystal selection from pre-established library with over 10,000 crystals
    • Re-processing of saved diffraction patterns
    • Pattern center calibration search
    • Ability to save diffraction patterns for later reanalysis

Designed for metallurgy

  • Develop SEM-based methods for quality control and failure analysis
  • Perform phase identification and transformation analysis following heating and cooling
  • Identify phases and size grains
  • Monitor heat affected zones after welding
  • Run predictive fracture analysis in metals
  • Validate additive manufacturing processes