Thermo Scientific™

Meridian S Inverted Static Optical Fault Isolation System

The Thermo Scientific™ Meridian™ S Inverted Static Optical Fault Isolation System enables Failure Analysis engineers in fabs and service labs to localize electrical faults in semiconductor devices. It offers high-sensitivity Static Laser Stimulation (IR-OBIRCH) and Photon Emission capabilities for the identification of electrical shorts and areas of leakage, in addition to the characterization of device activity via non-destructive analysis. The Meridian S System was designed for upgradability to higher sensitivity Photon Emission and Dynamic OFI techniques to maximize value and productivity.

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Key Benefits:

Building on the long-standing success of the Meridian family, the next-generation Meridian S Inverted Static Optical Fault Isolation System enables localization of electrical fault root causes.

FDx with Active Probe

  • Next-gen static laser stimulation (SLS) amplifier for applications such as OBIRCH
  • Higher sensitivity: picoamp level detectability
  • Broader application space: expanded Forced Voltage and Forced Current ranges
  • 4-Quadrant operability with the capability to run OBIRCH applications at positive and negative current and voltage
  • New noise-cancellation architectures
  • Proprietary Active Probe architecture for enhanced low-ohmic fault detection
  • Lock-In capability supported across the entire SLS operation range up to 100 kHz

New probing architectures

  • Static OFI analysis on a broad range of device architectures and package types
  • Top-side micro-probing for flip chip packages and wafer pieces
  • Backside micro-probing for conventionally packaged devices
  • Dual-side probe card setup option enables electrical stimulation by rectangular or cantilevered probe cards
  • Selectable eyepiece or CCD camera image navigation

Ease of Use

  • Built upon the stability and maturity of Sierra Software
  • Static OFI analysis: Smart defaults, automatic SLS channel selection, and easy-to-navigate GUI
  • Photon Emission mode: Analysis tools such as Centroid feature, Background subtraction, Good die / Bad die analysis, Multi-tile mosaic and Live Emission mode

Laser Marker option

  • Physical marking of a hotspot or fault location to enable fault redetection from EFA to PFA, without requiring the use of GDS CAD information
  • Accuracy better than <2 μm
  • Automated stage motion and multiple marking options