Diamond Cut-Off Blade
Buehler™

Diamond Cut-Off Blade

Buehler's Diamond Wafering Blades are the preferred blade type when precise sectioning is needed. They perform better than traditional abrasive blades when cutting certain materials, especially very hard materials.
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Número de catálogoCantidad
114714Ec/u
Número de catálogo 114714E
Precio (USD)
-
Cantidad:
c/u
Buehler's Diamond Wafering Blades are the preferred blade type when precise sectioning is needed. They perform better than traditional abrasive blades when cutting certain materials, especially very hard materials.
Especificaciones
Longitud (imperial)14 in.
Longitud (métrico)350 mm
Cantidadc/u
Anchura (imperial)0.059 in.
Anchura (métrico)Thickness: 1.5 mm
Tipo de productoDiamond Blade
Unit SizeEach