Shop All Electrical Failure Analysis Systems (EFA)

Meridian™ 7 System for Semiconductors Thermo Scientific™

The Thermo Scientific™ Meridian™ 7 system provides visible laser voltage imaging and probing and dynamic laser stimulation on sub-10nm devices. By avoiding a requirement for ultra-thin substrates, it preserves the integrity and functionality of the device under test to provide a reliable and practical production solution. It offers a 25 percent optical resolution enhancement over the previous-generation system and has a smaller spot size for better fault localization. In addition, the new Meridian 7 system offers more certainty in navigation and computer-aided design (CAD) overlay, less cross-talk and higher waveform signal-to-noise.

Hyperion™ System for Semiconductors Thermo Scientific™

The Thermo Scientific™ Hyperion II System offers fast, accurate transistor probing for electrical characterization and fault localization in support of semiconductor technology development, yield engineering and device reliability improvement. The unparalleled stability of the Hyperion II System enables nanoprobing down to the 10nm technology node and beyond. The Hyperion II System’s SPM technology enables PicoCurrent imaging, which is a technique to rapidly identify shorts, opens, leakage paths and resistive contacts with more than 1,000 times the sensitivity of passive voltage contrast. The scanning capacitance microscopy (SCM) module provides image-based fault localization for SOI wafers, as well as high-resolution dopant profiling.

Meridian™ IV System for Semiconductors Thermo Scientific™

Meridian-IV system is the preferred choice for developers of advanced, low-voltage, high-density semiconductor devices requiring best-in-class performance and the ability to diagnose wide ranging failure modes, including parametric failures and those resulting from design-process marginalities.

Capabilities include standard best-in-class InGaAs-based emission detection or High sensitivity extended-wavelength DBX-based emission detection; Patented, industry-proven "Point & Click" Solid Immersion Lens (SIL); Inverted platform for easy ATE direct docking; Compatibility with most popular third-party EDA applications; Optional laser scanning microscope (LSM) for static and dynamic analysis; Works easily with packaged parts and wafer/die backside samples; Optional 350x long working distance SIL.

Centrios Advanced Circuit Edit System for Integrated Circuits Thermo Scientific™

The Thermo Scientific™ Centrios™ Advanced Circuit Edit System enables rapid prototyping and first silicon debug and repair for 14 nm and above design rule devices. It enables advanced front and backside edits with unparalleled editing control and precision. Using an innovative simultaneous dual nozzle gas delivery system, with the broadest portfolio of chemistries and the latest FIB technology, the Centrios System offers fast, efficient, and cost-effective editing on advanced integrated circuits for reduced time to market.

Meridian™ M System for Semiconductors Thermo Scientific™

Thermo Scientific™ Meridian™ M system system uses high sensitivity broadband DBX™ photon emission and Static Laser Stimulation techniques to pinpoint the location of electrical faults. Given results from wafer sort / chip probe, the Meridian M system delivers localization suitable for nanoprobing or imaging techniques such as SEM or TEM.

Custom-designed optics, a set of user-selectable wavelength ranges and low background noise allow Meridian M to be optimized for a variety of routine or challenging fault types, like large-area process variation in advanced memory devices that leads to anomalous leakage; high resistivity wordline to wordline or bitline to bitline shorts within memory cells; resistive faults in low voltage GPUs and other low-voltage logic circuits; and any weakly emitting faults requiring long integration time.

The Meridian M system accommodates full wafers in addition to packaged die, allowing FA engineers to compare good die to bad die, aiding interpretation of complex emission images.

Capabilities include highest sensitivity emission detection, for low VDD and low leakage; advanced constant-current and constant-voltage Static Laser Stimulation (SLS) techniques; Ability to detect thermal faults, including challenging high-ohmic shorts and electromigration.

Meridian S Inverted Static Optical Fault Isolation System Thermo Scientific™

The Thermo Scientific™ Meridian™ S Inverted Static Optical Fault Isolation System enables Failure Analysis engineers in fabs and service labs to localize electrical faults in semiconductor devices. It offers high-sensitivity Static Laser Stimulation (IR-OBIRCH) and Photon Emission capabilities for the identification of electrical shorts and areas of leakage, in addition to the characterization of device activity via non-destructive analysis. The Meridian S System was designed for upgradability to higher sensitivity Photon Emission and Dynamic OFI techniques to maximize value and productivity.

Meridian™ WS-DP System for Semiconductors Thermo Scientific™

With time-to-yield being critical to profitability, it is too costly for advanced foundries, integrated device manufacturers and fabless companies to wait until after dicing and packaging to identify the source of electrical faults. The Thermo Scientific™ Meridian™ WS-DP system enables faster defect localization by using production testers, load boards, and probe cards. All diagnostic options from the Meridian product line are available for the Meridian WS-DP, including: LVx, emission, LADA, and OBIRCH.

Falcon 4 Direct Electron Detector

Find additional information here:  Thermo Scientific™ Falcon™ 4 Direct Electron Detector

The Thermo Scientific™ Falcon™ 4 Direct Electron Detector is the ideal solution for your single particle analysis and cryo electron tomography needs. By combining a 10x shorter exposure time (as compared to the Falcon 3 Detector) with an improved detector quantum efficiency (DQE) over the entire spatial frequency range, the Falcon 4 Detector has a significantly increased internal framerate (250 fps), allowing you to collect the best quality images with the highest throughput possible. In fact, the unsurpassed DQE at low frequencies makes it ideally suited for small or difficult to detect proteins.

Meridian™ V System for Semiconductors Thermo Scientific™

Optimized dynamic LSM platform

  • Performance optical path for best imaging
  • Architecture supports automated test equipment (ATE) docking and back-side (B/S) analysis
  • Mobility for the lab; high power cooling options

Best-in-class performance

  • Laser voltage probing (LVP) and laser voltage imaging (LVI) for timing and functional analysis
  • Dynamic laser simulation (DLS) for critical path analysis
  • Powerful and easy-to-use Sierra Software GUI

Dynamic electrical fault isolation

  • Transistor- and cell-level fault localization
  • Isolate design-process marginalities
  • Based on Ruby optics

flexProber System for Semiconductors Thermo Scientific™

The Thermo Scientific™ flexProber™ is our newest SEM-based nanoprobing platform, providing electrical characterization and fault isolation capabilities for process development, device design debug, and failure analysis. flexProber’s Thermo Scientific™ SteadFast™ nano-manipulators, along with the Thermo Scientific™ LEEN™ high-resolution scanning electron microscope column and advanced control software, allow for precise, repeatable, and stable probe placement on critical level features.

nProber III System for Semiconductors Thermo Scientific™

The Thermo Scientific™ nProber III system allows users to characterize individual transistor performance down to the 7nm node. nProber III system can also be used to localize a wide variety of electrical faults prior to extracting thin sectional samples for physical failure analysis in a transmission electron microscope (TEM). The high accuracy fault localization provided by the nProber III system can dramatically increase TEM fault imaging success rates. nProber III system productivity and ease of use make it an ideal solution for optimized failure analysis workflows.