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MK.1TE ESD and Static Latch-up Test System Thermo Scientific™

The Thermo Scientific™ MK.1TE ESD and Static Latch-up Test System provides users with advanced capabilities to test midrange pin count devices to today’s Human Body Model (HBM) and Machine Model (MM) ESD standards. The system’s pulse delivery design ensures recently identified waveform hazards in the standards, such as the trailing pulse and the pre-discharge voltage rise are addressed. Trailing pulses were shown to cause non-ESD related failures by exposing the DUT to an electrical overstress after the main HBM event. Pre-discharge voltage can cause voltage-triggered protection structures to fail, as the pin under test may not be at zero volts when the HBM event occurs. A user-selectable 10K Shunt can be connected during the pulse to eliminate any voltage prior to the actual HBM event. A combination test system, today’s MK.1 test system also performs Static Latch-Up testing per JEDEC’s EIA/JESD 78 method.

Pegasus 2-pin ESD Test System Thermo Scientific™

The Thermo Scientific™ Pegasus™ ESD Test System is a low parasitic 2-pin tester which is used to characterize protection structures at wafer, die, or package level. The Pegasus can also be used as part of your device qualification routine, providing supplemental data to the results gathered when using an automated (relay based) high pin count ESD test system.  Testing is available to the latest industry standards for Human Body Model (HBM), Machine Model (MM) waveforms, as well as offering a true System Level (150pF/330#8486;) IEC like waveform based on the EOS/ESD Association’s Human Metal model (HMM). The system’s pulse source design and pulse source delivery method ensures waveform fidelity directly at the device under test, not only at the generator output. Current waveforms can be automatically captured and analyzed for each ESD event.  In addition, Voltage waveforms can be captured and used to determine the turn-on level of protection structures. They can also be used as a means of failure determination, as the voltage waveforms will generally show changes after ESD events.

Test Fixture Boards Thermo Scientific™

Thermo Scientific™ Test Fixture Boards are custom designed to your devices precise specifications. Years of experience in constructing these boards ensures the highest quality waveforms. Designs can be turned around quickly allowing minimal delays in beginning qualification. All boards are guaranteed to operate correctly or we will repair or replace them free of charge.

Celestron™ TLP/VF-TLP Test System Thermo Scientific™

The Thermo Scientific™ Celestron™ TLP/VF-TLP Test System can be configured for both Standard TLP and VF-TLP for testing at the wafer level and/or package level. Optional probes can also be used to measure signals on pins or pads other than the ones being stressed. The Celestron system software is the most comprehensive in the industry and utilizes graphics to assist in system setup and connection to the DUT. During test operations, it displays the recorded TLP pulse voltage and current waveforms, compiled pulsed I-V curve, leakage current measurements, and DC I-V curve trace data. The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.

MK.2TE ESD and Latch-up Test System Thermo Scientific™

The Thermo Scientific™ MK.2TE ESD and Latch-up Test System provides users with advanced capabilities to test high pin count devices to today’s Human Body Model (HBM) and Machine Model (MM) ESD standards. The system’s pulse delivery design ensures waveform hazards in the standards, such as the trailing pulse and the pre-discharge voltage rise, are addressed. Trailing pulses have been shown to cause non-ESD related failures by exposing the DUT to an electrical overstress after the main HBM event. Predischarge voltage can cause voltage-triggered protection structures to fail, as the pin under test may not be at zero volts when the HBM event occurs. A user-selectable 10K Shunt can be connected during the pulse to eliminate any voltage prior to the actual HBM event. The MK.2 combination test system also performs Latch-Up testing per the JEDEC EIA/JESD 78 Method. Its enhanced data set features provide the flexibility to meet the testing needs of today’s system-on-chip designs.

MK.4TE ESD and Latch-Up Test System Thermo Scientific™

Thirty years in the making - IC structure designers and QA program managers in manufacturing and test house facilities worldwide have embraced the Thermo Scientific™ MK.4, a versatile, powerful, and flexible, high yield test system. Easily upgradeable, the MK.4 is fully capable of taking your test operations through ever evolving regulatory and quality standards. The advanced rapid relay-based (modular matrix) hardware of the MK.4 is on average ten times faster than mechanically driven ESD testers. The switching matrix, while providing consistent ESD paths, also allows any pin to be grounded, floated, vectored or connected to any of the installed V/I supplies. Furthermore, advanced algorithms ensure accurate switching of HV, in support of pulse source technology, per recent JEDEC/ESDA trailing pulse standards. A powerful, extraordinarily fast embedded VME controller drives the highest Speed-of-Test execution available. Data transfer between the embedded controller and the testers PC server, is handled through TCP/IP communication protocols, minimizing data transfer time. The testers PC server can be accessed through internal networks, as well as through the Internet allowing remote access to the system to determine the systems status or to gather result information

Orion3™ Charged Device Model (CDM) tester Thermo Scientific™

The Thermo Scientific™ Orion3™ is designed to test for potentially destructive effects of ESD, enabling the identification and hardening of sensitive structures prior to full-scale production.  Given the extremely high cost of IC production, as well as customer demands for precisely timed component delivery schedules, the Orion3 can save substantial costs in terms of time, material and lost opportunity (time to market).  The high resolution dual cameras permit easy and rapid discharge pin alignment during the test setup routine. Both the x and y axis are displayed simultaneously. The cameras may be left on during the test to monitor the pin alignment. Vacuum hold-down enables device testing regardless of device types and sizes.  
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