Increase productivity, repeatability and save time.
To support semiconductor manufacturing needs, Thermo Fisher Scientific continues to bring new capabilities to our industry-leading failure analysis, metrology and characterization solutions.
In our Thermo Fisher Scientific PFA Demo Days, we showcased our latest innovations for sample preparation and FinFET logic circuit delayering. The event featured the following live demonstrations:
- Automatic in-situ lift-out lamella sample preparation with AutoTEM5: Achieving high quality sample preparation repeatability can be challenging. Automating the process can reduce these challenges and increase operator productivity. Featuring the Helios 5 UX, this demonstration will show how simple it is to perform a fully automated in-situ lift-out TEM sample preparation process using AutoTEM5.
- Dx gas assisted FinFET logic circuit delayering: Semiconductor failure analysis often requires removing layers from the chip to expose regions of interest for defect isolation or nanoprobe testing. Due to different sputter rates of metals and oxides, the basic top to bottom milling box cannot achieve a uniform region. Featuring the Helios 5 PFIB UXe, this demonstration will show how uniform layer-by-layer delayering can be achieved.
- Large scale cross-section sample preparation and auto rocking polish: Large scale cross-section sample preparation is a common requirement in the backend-of-the-line (BEOL) and packaging stages. Different from traditional Gallium source FIBs, a Plasma FIB can increase the ion beam current to greatly improve large-scale milling efficiency. Featuring the Helios 5 PFIB UXe, this demonstration will show how auto rocking polish can automatically mill a cross-section from different angles and reduce the curtaining effect, caused by a large milling current, to deliver a curtain free cross-section.
Register below to view the on-demand recordings.
Jiashi Zhou graduated from University of Manchester with a Master Degree in Materials Science and Engineering.He currently manages the Shanghai nanoport application team at Thermo Fisher Scientific. His team is responsible for SEM, FIB and TEM demonstration for semiconductor industries in APAC.He has worked at chip manufacturing company SMIC as failure analysis engineer for 5 years and joined Thermo Fisher Scientific for 3 years.
Bingxing Wu received the M.S. and Ph.D. degrees in electrical engineering from University of Idaho (UI), Moscow, ID, USA, in 2014 and 2018, respectively. His Ph.D. thesis involved designing multi-pixel CMOS image sensor for traffic monitoring applications.He currently manages the PFA field application team at Thermo Fisher Scientific mainly supporting key/strategy customers in China. His team is responsible for SEM, focused ion beam (FIB) system, Plasma FIB (PFIB), inline large FIB, and TEM products.He has worked at Thermo Fisher Scientific for 3 years.