Thermo Fisher Scientific SPARK Seminar 2024

Analytical solutions that drive semiconductor innovation

June 19, 2024, Sydney, Australia
June 25, 2024, Bangkok, Thailand

We look forward to seeing you at SPARK Seminar 2024, where you will have the opportunity to engage with industry experts and gain valuable insights into the latest developments and trends in semiconductor defect analysis and metrology workflows.

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June 19, 2024, Sydney, Australia
June 25, 2024, Bangkok, Thailand

This SPARK Seminar will also provide excellent networking and collaboration opportunities.

 

Through your participation in this year’s SPARK Seminar, we aim to help you understand the defect analysis and metrology challenges facing the global semiconductor industry.

Location: A31, Sydney Nanoscience Hub | The University of Sydney Nano Institute
Wednesday, 19th of June 2024
9:00 a.m. - 8:00 p.m. Australian Eastern Standard Time

Time

Duration

Presentation Title/Activity

 9:00 a.m. - 9:30 a.m.

30

Registration & Networking

 9:30 a.m. - 9:40 a.m.

10

Opening

 9:40 a.m. - 10:00 a.m.

20

Semiconductor Failure Analysis Workflow Innovation

10:00 a.m. - 11:00 a.m.

60

Introduction to Electrical Failure analysis techniques and Fault Localization Applications for Advanced Packaging and Power Device

11:00 a.m. - 12:00 p.m.

60

Introduction to Ga-based FIB Technology, Applications, and Automation for Enhanced Efficiency

12:00 p.m. - 1:00 p.m.

60

Lunch Break

 1:00 p.m. - 1:45 p.m.

45

TEM workflows for GaN/SiC power device applications

 1:45 p.m. - 2:45 p.m.

60

Enhancing Packaged Die Failure Analysis: Leveraging Ga-free FIB and Avizo for Advanced Insights and Efficiency

 2:45 p.m. - 3:00 p.m.

15

"Meet the experts" session kick-off

 3:00 p.m. - 3:30 p.m.

30

Tea Break

 3:30 p.m. - 5:30 p.m.

120

Meet the experts:
EFA: Dr. CC Tsao
Ga-based FIB and sample prep: Jason Chen and Yanjing Yang
Ga-free FIB and Advanced Packaging: Dr. Sam Lin
TEM: Dr. Emily Chen

 6:00 p.m. - 8:00 p.m.

120

Networking Dinner

*Agenda subject to change

Location: Nakorn Rangsit 3 | Novotel Bangkok Future Park Rangsit
Tuesday, 25th of June 2024
12:30 p.m. - 8:00 p.m. Indochina Time Zone

Time

Duration

Presentation Title/Activity

12:30 p.m. - 12:45 p.m.

15

Registration

12:45 p.m. - 1:00 p.m.

15

Opening

 1:00 p.m. - 1:30 p.m.

30

Fault localization techniques for advanced packaging and power semiconductor devices

 1:30 p.m. - 2:00 p.m. 

30

SEM applications, portfolio and automation: enhancing efficiency and precision

 2:00 p.m. - 2:20 p.m. 

20

Remote demo - Axia ChemiSEM Scanning Electron Microscope and automated in-situ quantitative EDS mapping

 2:20 p.m. - 2:50 p.m. 

30

Introducing the Thermo Scientific Helios 6 HD FIB-SEM and the AutoTEM lamella preparation workflow

 2:50 p.m. - 3:20 p.m. 

30

Tea break

 3:20 p.m. - 3:40 p.m. 

20

Unveiling the power of automation software: An introduction to iFast and AutoTEM

 3:40 p.m. - 4:10 p.m. 

30

Ga-free FIB workflows to accelerate packaged die failure analysis

 4:10 p.m. - 4:30 p.m. 

20

Introducing our state-of-the-art TEM portfolio: Metrios, Talos, and Spectra

 4:30 p.m. - 5:00 p.m. 

30

The XPS surface analysis for the semiconductor failure analysis & Automated particle analysis on the Desktop SEM for cleanliness analysis

 5:00 p.m. - 5:40 p.m. 

40

Semiconductor Visualization and Data Solutions (Avizo)

 5:40 p.m. - 6:00 p.m. 

20

Closing

 6:00 p.m. - 8:00 p.m. 

120

Networking dinner

 *Agenda subject to change