The Thermo Scientific Helios 5 Laser PFIB System combines the best-in-class monochromated Elstar Scanning Electron Microscopy (SEM) Column with a plasma focused ion beam (PFIB) and a femtosecond laser to produce a high-resolution imaging and analysis tool with in-situ ablation capability, offering unprecedented material removal rates for fast millimeter-scale characterization at nanometer resolution.

Statistically relevant subsurface and 3D characterization

The femtosecond laser can cut many materials at rates orders of magnitude faster than a typical gallium FIB; a large (100s of micrometers) cross-section can be created within 5 minutes. As the laser has a different removal mechanism (ablation vs the ion sputtering of FIB), it can easily process challenging materials, such as non-conductive or ion-beam sensitive samples.

High-quality large volume analysis

The extremely short duration of the femtosecond laser pulses introduces almost no artifacts such as heat impact, microcracking, melting, or those typical of traditional mechanical polishing. In most cases, the laser-milled surfaces are clean enough for direct SEM imaging and even for surface-sensitive techniques such as electron backscatter diffraction (EBSD) mapping.

Built on the proven Helios 5 PFIB platform, this instrument incorporates a suite of state-of-the-art technologies to provide high-performance, high-resolution transmission electron microscopy (TEM) and atom probe tomography (APT) sample preparation and extremely high-resolution SEM imaging with precise materials contrast.

Key Features

Fast material removal

Millimeter-scale cross sections with up to 15,000x faster material removal than a typical gallium focused ion beam.

Statistically relevant subsurface and 3D data analysis

Acquire data for much larger volumes within a shorter amount of time.

Accurate and repeatable cut placement

The same coincident point for all 3 beams (SEM/PFIB/laser) enables accurate and repeatable cut placement and 3D characterization.

Fast characterization of deep subsurface features

Extraction of subsurface TEM lamella or chunks for 3D analysis.

High throughput processing of challenging materials

Includes non-conductive or ion-beam-sensitive samples.

Fast and easy characterization of air-sensitive samples

No need to transfer samples between different instruments for imaging and cross-sectioning.

Shares all capabilities of the Helios 5 PFIB platform

High-quality gallium-free TEM and APT sample preparation and high-resolution imaging capabilities.


Specifications

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Femtosecond-laser specifications
Laser integration
  • Fully integrated in the chamber with the same coincident point for all 3 beams (SEM/PFIB/laser), enabling accurate and repeatable cut placement and 3D characterization.
Laser Output
First Harmonic
  • Wavelength

1030 nm (IR)

 
  • Pulse duration

<280 fs

Second Harmonic
  • Wavelength

515 nm (green)

 
  • Pulse duration

<300 fs

Optics  
Coincident point
  • Working distance= 4 mm (Same as SEM/FIB)
Objective lens
  • Variable (motorized)
Polarization
  • Horizontal/vertical
Repetition rate
  • 1 kHz – 1 MHz
Position accuracy
  • <250 nm
Protective shutter
  • Automated SEM/PFIB protective shutter
Software
  • Laser control software
  • Laser 3D serial sectioning workflow
  • Laser 3D serial sectioning workflow with EBSD
  • Laser scripting with optional Thermo Scientific AutoScript 4 Software
Safety
  • Interlocked laser enclosure (Class 1 laser safety)
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On demand webinar: Discover the all new Helios 5 Laser PFIB

Register for our recorded webinar and learn how the combination of fs-Laser and PFIB provides mm-scale subsurface and 3D analysis at nm resolution and enables new workflows such as fast characterization of air sensitive samples and multi-scale correlative microscopy with deep subsurface sample extraction. 

Register now

Solder bump 3D reconstruction created with plasma FIB laser SEM tool
3D reconstruction of a solder bump acquired with the Helios 5 Laser PFIB System.
GPU stack cross section created with plasma FIB laser SEM tool.
Large area cross-section of a GPU stack created with the Helios 5 Laser PFIB System. A fast polishing step with the plasma FIB allows you to resolve fine details at the nanometer scale.
Nylon sample cross section created with laser on a plasma FIB laser SEM tool.
Cross-section of a nylon sample. This material is challenging for FIB milling as it is non-conductive and beam sensitive, but it can easily be processed with the femtosecond laser.
Carbon fiber reinforced composite 3D reconstruction created with plasma FIB laser SEM tool.
Large-volume 3D reconstruction of a carbon-fiber-reinforced epoxy composite. The data was acquired using the Helios 5 Laser PFIB System, then processed and visualized with Avizo Software.
Steel sample cross section produced with laser on a plasma FIB laser SEM tool.
Large area (0.6 mm) cross-section of an additive manufacturing steel, milled by the femtosecond laser in less than 5 minutes.
Nickel superalloy sample 3D reconstruction, data obtained with plasma FIB laser SEM tool.
Large volume 3D EBSD reconstruction of a nickel superalloy sample. The data was acquired with the Helios 5 Laser PFIB System.
Glass fiber cross section produced with laser on a plasma FIB laser SEM tool.
Cross-sections of glass fibers. The femtosecond laser offers improved processing performance for challenging (non-conductive, thermally sensitive, shock-sensitive) materials such as this.
Solid state battery cross section produced with a plasma FIB laser SEM tool.
Large-area cross-section of a packaged solid-state battery. The Helios 5 Laser PFIB System enables fast characterization of air-sensitive materials by combining millimeter-scale cross-sectioning with high-resolution SEM imaging in the same vacuum chamber, eliminating the need for sample transfer.

On demand webinar: Discover the all new Helios 5 Laser PFIB

Register for our recorded webinar and learn how the combination of fs-Laser and PFIB provides mm-scale subsurface and 3D analysis at nm resolution and enables new workflows such as fast characterization of air sensitive samples and multi-scale correlative microscopy with deep subsurface sample extraction. 

Register now

Solder bump 3D reconstruction created with plasma FIB laser SEM tool
3D reconstruction of a solder bump acquired with the Helios 5 Laser PFIB System.
GPU stack cross section created with plasma FIB laser SEM tool.
Large area cross-section of a GPU stack created with the Helios 5 Laser PFIB System. A fast polishing step with the plasma FIB allows you to resolve fine details at the nanometer scale.
Nylon sample cross section created with laser on a plasma FIB laser SEM tool.
Cross-section of a nylon sample. This material is challenging for FIB milling as it is non-conductive and beam sensitive, but it can easily be processed with the femtosecond laser.
Carbon fiber reinforced composite 3D reconstruction created with plasma FIB laser SEM tool.
Large-volume 3D reconstruction of a carbon-fiber-reinforced epoxy composite. The data was acquired using the Helios 5 Laser PFIB System, then processed and visualized with Avizo Software.
Steel sample cross section produced with laser on a plasma FIB laser SEM tool.
Large area (0.6 mm) cross-section of an additive manufacturing steel, milled by the femtosecond laser in less than 5 minutes.
Nickel superalloy sample 3D reconstruction, data obtained with plasma FIB laser SEM tool.
Large volume 3D EBSD reconstruction of a nickel superalloy sample. The data was acquired with the Helios 5 Laser PFIB System.
Glass fiber cross section produced with laser on a plasma FIB laser SEM tool.
Cross-sections of glass fibers. The femtosecond laser offers improved processing performance for challenging (non-conductive, thermally sensitive, shock-sensitive) materials such as this.
Solid state battery cross section produced with a plasma FIB laser SEM tool.
Large-area cross-section of a packaged solid-state battery. The Helios 5 Laser PFIB System enables fast characterization of air-sensitive materials by combining millimeter-scale cross-sectioning with high-resolution SEM imaging in the same vacuum chamber, eliminating the need for sample transfer.

Applications

Process Control_Thumb_274x180_144DPI

Process Control
 

Modern industry demands high throughput with superior quality, a balance that is maintained through robust process control. SEM and TEM tools with dedicated automation software provide rapid, multi-scale information for process monitoring and improvement.

 

Quality Control_Thumb_274x180_144DPI

Quality Control
 

Quality control and assurance are essential in modern industry. We offer a range of EM and spectroscopy tools for multi-scale and multi-modal analysis of defects, allowing you to make reliable and informed decisions for process control and improvement.

 

Fundamental Materials Research_R&amp;D_Thumb_274x180_144DPI

Fundamental Materials Research

Novel materials are investigated at increasingly smaller scales for maximum control of their physical and chemical properties. Electron microscopy provides researchers with key insight into a wide variety of material characteristics at the micro- to nano-scale.

 

3D Materials Characterization

Development of materials often requires multi-scale 3D characterization. DualBeam instruments enable serial sectioning of large volumes and subsequent SEM imaging at nanometer scale, which can be processed into high-quality 3D reconstructions of the sample.

Learn more ›

S/TEM Sample Preparation

DualBeam microscopes enable the preparation of high-quality, ultra-thin samples for S/TEM analysis. Thanks to advanced automation, users with any experience level can obtain expert-level results for a wide range of materials.

Learn more ›

APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

Learn more ›

Cross-sectioning

Cross sectioning provides extra insight by revealing sub-surface information. DualBeam instruments feature superior focused ion beam columns for high-quality cross sectioning. With automation, unattended high-throughput processing of samples is possible.

Learn more ›

In Situ experimentation

Direct, real-time observation of microstructural changes with electron microscopy is necessary to understand the underlying principles of dynamic processes such as recrystallization, grain growth, and phase transformation during heating, cooling, and wetting.

Learn more ›

Multi-scale analysis

Novel materials must be analyzed at ever higher resolution while retaining the larger context of the sample. Multi-scale analysis allows for the correlation of various imaging tools and modalities such as X-ray microCT, DualBeam, Laser PFIB, SEM and TEM.

Learn more ›

3D Materials Characterization

Development of materials often requires multi-scale 3D characterization. DualBeam instruments enable serial sectioning of large volumes and subsequent SEM imaging at nanometer scale, which can be processed into high-quality 3D reconstructions of the sample.

Learn more ›

S/TEM Sample Preparation

DualBeam microscopes enable the preparation of high-quality, ultra-thin samples for S/TEM analysis. Thanks to advanced automation, users with any experience level can obtain expert-level results for a wide range of materials.

Learn more ›

APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

Learn more ›

Cross-sectioning

Cross sectioning provides extra insight by revealing sub-surface information. DualBeam instruments feature superior focused ion beam columns for high-quality cross sectioning. With automation, unattended high-throughput processing of samples is possible.

Learn more ›

In Situ experimentation

Direct, real-time observation of microstructural changes with electron microscopy is necessary to understand the underlying principles of dynamic processes such as recrystallization, grain growth, and phase transformation during heating, cooling, and wetting.

Learn more ›

Multi-scale analysis

Novel materials must be analyzed at ever higher resolution while retaining the larger context of the sample. Multi-scale analysis allows for the correlation of various imaging tools and modalities such as X-ray microCT, DualBeam, Laser PFIB, SEM and TEM.

Learn more ›

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