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The Thermo Scientific Helios 5 PXL Wafer DualBeam is a plasma focused ion beam scanning electron microscope (PFIB SEM) that redefines the standard for high-aspect-ratio through-stack metrology and structural verification. It features high-performance in-line metrology and process monitoring to quickly provide critical insights for process development and manufacturing engineers.

Designed to meet the in-line metrology and process control requirements of the fab, the Helios 5 PXL Wafer DualBeam significantly reduces time to data and enables the wafer to be returned to the line without being pulled and scrapped.

The Helios 5 PXL Wafer DualBeam is compatible with semiconductor factory automation, facilitating operator-free recipe-driven operations. This automation can support the high-throughput requirements of fab metrology and process monitoring – even on the most challenging structures.


Key Features

Fast time to data

Utilizing the patented Thermo Scientific Elstar Electron Column with the high-performance PFIB2.0 xenon plasma ion column, the Helios 5 PXL Wafer DualBeam delivers high-resolution, high-contrast imaging. Obtain exact dimensional measurements of high-aspect-ratio 3D through-stack structures, data that is not easily accessible to conventional in-line metrology tools.

Faster yield learning and increased productivity

Fast, precise, large-area wafer level deprocessing, diagonal milling and cross sectioning of high-aspect-ratio structures. Advanced automation capabilities identify potential issues, accelerating process development and minimizing manufacturing disruptions.

World-class service, knowledge, and expertise

The Helios 5 PXL Wafer DualBeam is backed by our world-class service, knowledge, and expertise in advanced metrology sample preparation and failure analysis.


Specifications

Xe+ Plasma FIB Column
  • PFIB beam current from 1 pA to 2.6 µA
  • Inductively coupled Xe+ plasma (ICP) >4000 hours
Elstar UHR Immersion Lens FESEM Column
  • Elstar electron gun with ultra-stable Schottky field emitter gun with UC+ monochromator technology
  • Electron beam resolution:
    • 0.9 nm @ 15 kV
    • 1.0 nm @ 1 kV
  • Electron source lifetime: 12 months
Gas delivery
  • Thermo Scientific MultiChem Integrated Gas Delivery System
    • Slots for up to 6 chemistries
  • Single gas injection system
    • Port for up to 3 independent GIS units
Wafer handling
  • Automated handling of 300 mm FOUP with EFEM (GEM300 compliant)
  • Manual loading of 300 mm, 200 mm & 150 mm wafers
Additional options
  • CAD navigation compatibility (NEXS and Synopsys Camelot)
  • Retractable directional backscatter detector (RDBS)*

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Resources

Applications

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Advanced Memory Technology

Modern data demands are driving innovation in 3D NAND, DRAM and other memory structures. Our memory analysis tools and workflows offer high-productivity characterization so that manufacturers can meet performance, latency, and capacity demands.

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Semiconductor Pathfinding and Development

Advanced electron microscopy, focused ion beam, and associated analytical techniques for identifying viable solutions and design methods for the fabrication of high-performance semiconductor devices.

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Yield Ramp and Metrology

We offer advanced analytical capabilities for defect analysis, metrology, and process control, designed to help increase productivity and improve yield across a range of semiconductor applications and devices.

Semiconductor Failure Analysis

Semiconductor Failure Analysis

Increasingly complex semiconductor device structures result in more places for failure-inducing defects to hide. Our next-generation workflows help you localize and characterize subtle electrical issues that affect yield, performance, and reliability.

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Physical and Chemical Characterization

Ongoing consumer demand drives the creation of smaller, faster, and cheaper electronic devices. Their production relies on high-productivity instruments and workflows that image, analyze, and characterize a broad range of semiconductor and display devices.

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ESD Semiconductor Qualification

Every electrostatic discharge (ESD) control plan is required to identify devices that are sensitive to ESD. We offer a complete suite of test systems to help with your device qualification requirements.


Techniques

Nanoprobing

As device complexity increases, so does the number of places defects have to hide. Nanoprobing provides the precise localization of electrical faults, which is critical for an effective transmission electron microscopy failure analysis workflow.

Learn more ›

Optical Fault Isolation

Increasingly complex designs complicate fault and defect isolation in semiconductor manufacturing. Optical fault isolation techniques allow you to analyze the performance of electrically active devices to locate critical defects that cause device failure.

Learn more ›

Thermal Fault Isolation

Uneven distribution of local power dissipation can cause large, localized increases in temperature, leading to device failure. We offer unique solutions for thermal fault isolation with high-sensitivity lock-in infrared thermography (LIT).

Learn more ›

Semiconductor TEM Imaging and Analysis

Thermo Scientific transmission electron microscopes offer high-resolution imaging and analysis of semiconductor devices, enabling manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yields.

Learn more ›

TEM Metrology

Advanced and automated TEM metrology routines deliver significantly greater precision than manual methods. This allows users to generate large amounts of statistically relevant data, with sub-angstrom-level specificity, that is free of operator bias.

Learn more ›

Sample Preparation of Semiconductor Devices

Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.

Learn more ›

SEM Metrology

Scanning electron microscopy provides accurate and reliable metrology data at nanometer scales. Automated ultra-high-resolution SEM metrology enables faster time-to-yield and time-to-market for memory, logic, and data storage applications.

Learn more ›

Semiconductor Analysis and Imaging

Thermo Fisher Scientific offers scanning electron microscopes for every function of a semiconductor lab, from general imaging tasks to advanced failure analysis techniques requiring precise voltage-contrast measurements.

Learn more ›

Device Delayering

Shrinking feature size, along with advanced design and architecture, results in increasingly challenging failure analysis for semiconductors. Damage-free delayering of devices is a critical technique for the detection of buried electrical faults and failures.

Learn more ›

ESD Compliance Testing

Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.

Learn more ›

Nanoprobing

As device complexity increases, so does the number of places defects have to hide. Nanoprobing provides the precise localization of electrical faults, which is critical for an effective transmission electron microscopy failure analysis workflow.

Learn more ›

Optical Fault Isolation

Increasingly complex designs complicate fault and defect isolation in semiconductor manufacturing. Optical fault isolation techniques allow you to analyze the performance of electrically active devices to locate critical defects that cause device failure.

Learn more ›

Thermal Fault Isolation

Uneven distribution of local power dissipation can cause large, localized increases in temperature, leading to device failure. We offer unique solutions for thermal fault isolation with high-sensitivity lock-in infrared thermography (LIT).

Learn more ›

Semiconductor TEM Imaging and Analysis

Thermo Scientific transmission electron microscopes offer high-resolution imaging and analysis of semiconductor devices, enabling manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yields.

Learn more ›

TEM Metrology

Advanced and automated TEM metrology routines deliver significantly greater precision than manual methods. This allows users to generate large amounts of statistically relevant data, with sub-angstrom-level specificity, that is free of operator bias.

Learn more ›

Sample Preparation of Semiconductor Devices

Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.

Learn more ›

SEM Metrology

Scanning electron microscopy provides accurate and reliable metrology data at nanometer scales. Automated ultra-high-resolution SEM metrology enables faster time-to-yield and time-to-market for memory, logic, and data storage applications.

Learn more ›

Semiconductor Analysis and Imaging

Thermo Fisher Scientific offers scanning electron microscopes for every function of a semiconductor lab, from general imaging tasks to advanced failure analysis techniques requiring precise voltage-contrast measurements.

Learn more ›

Device Delayering

Shrinking feature size, along with advanced design and architecture, results in increasingly challenging failure analysis for semiconductors. Damage-free delayering of devices is a critical technique for the detection of buried electrical faults and failures.

Learn more ›

ESD Compliance Testing

Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.

Learn more ›

Contact us

Electron microscopy services for
semiconductors

To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

Learn more ›

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