The Thermo Scientific Celestron transmission line pulse/very fast transmission line pulse (TLP/VF-TLP) Test System can be configured for both Standard TLP and VF-TLP for testing at the wafer and/or package level. Optional probes can be used to measure signals on pins or pads other than the ones being stressed. The Celestron system software is the most comprehensive in the industry and utilizes graphics to assist in system setup and connection to the device under test (DUT). During test operations, it displays the recorded TLP pulse voltage and current waveforms, compiled pulsed I-V curve, leakage current measurements, and DC I-V curve trace data. The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.
The Thermo Scientific Celestron TLP/VF-TLP Test System can be configured for Standard TLP and VF-TLP for testing at the wafer level and/or package level. Optional probes can also be used to measure signals on pins or pads other than the ones being stressed.
The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected, and modified after the data is collected.
High current TLP pulse generator.
Can be interfaced with semiautomatic probers.
|Standard TLP configuration||Pulse widths from 30 to 500ns|
Integrated in the pulser box, the standard TLP Pulse width is 100ns
Additional pulse widths can be added externally through a cable change ranging from 30 to 500ns
Optional computer controlled pulse width with 3 selectable pulse widths
|Rise times available|
Standard rise time is 200ps
Optional rise times from 500ps to 10ns
Controlled by optional external rise time filters
2ns and 10ns external rise time filter included
Optional computer controlled rise time with 3 selectable rise times
Note: 500 MHz or faster oscilloscope is required for TLP measurements
1 GHz or grater scope is recommended for measurements with rise times of less than 1ns
|Support of all TLP configurations|
Optional changing of configuration for 25 to 500 ohm delivery impedances
Support for all configurations described in the ESD Association’s TLP Standard Test Method
Both wafer level and package testing at all impedances
|Standard TLP / VF-TLP configuration||Integrated system controller|
No need for a dedicated computer
Windows® operating system
|Integrated source/meter unit|
Curve Tracing to ± 200V
Leakage measurements down to 50pA
DUT failure detection based on leakage or voltage with forced current or both
|Transmission Line Pulse|
(TLP / VF-TLP)
Designed in compliance with the current ESD Association Standard Test Method Documents (ANSI/ESD STM 5.5.1-2016)
|Standard VF-TLP configuration||Pulse widths from 1.2 to 10ns|
Selected by cable change at front of system
Standard widths are 1.2, 2.5 and 5ns (others optional)
|Rise times from 200ps to 2ns|
Controlled by optional filters
Standard rise times are 200 and 300ps
2ns external rise time fi ler included
|Maximum pulse current|
15A into a 50 ohm load
Approximately 30A into a short circuit
|Maximum open circuit voltage|
Every electrostatic discharge (ESD) control plan is required to identify devices that are sensitive to ESD. We offer a complete suite of test systems to help with your device qualification requirements.
ESD Compliance Testing
Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.
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