Thermo Scientific NEXS Software goes far beyond a CAD viewer and stage driver by facilitating fault isolation, failure analysis, sample preparation and circuit edit. NEXS Software enables diverse workflows by providing CAD connectivity with Thermo Scientific analytical equipment.

NEXS Software directly reads/displays the mask data and drives the system stage accurately to fault or edit locations.

 


Key Features

  • Reads/displays GDS2 and OASIS mask data
  • Creates cache database for faster re-load, rendering and tracing (GDS only)
  • Connects to most Thermo Scientific tools used for EFA, PFA and Circuit Edit space
  • Supports overlaying CAD on microscope image
  • Auto-syncs position/magnification between NEXS and Circuit Edit system for a more seamless user experience
  • Annotates layout, navigates by text location point, and receives marked hotspot locations
  • Reads popular box, text and net trace formats (.vl, .dl, .hl)
  • Traces/highlights nets and cells
  • Reads software diagnostic callouts and scan chains from various formats (.vl, .sigps.txt, query.txt)

Specifications

Technical specifications

  • Windows® 10 – Runs on Thermo Scientific support PC (SPC)
  • 64-bit Linux OS – Can run on Linux server farm, network or local server
  • RAM and hard drive requirements vary with CAD database sizes

Database file formats supported

  • GDS2
  • Gnuzip compressed GDS2 (.gz) for Linux only
  • OASIS

Thermo Scientific equipment supported

  • PFA: Helios, Scios, Apreo, Prisma, Verios, Quattro
  • EFA: Meridian, WaferScan, ELITE, nProber
  • Circuit Edit: Centrios, Taipan, OptiFIB IV, V400 ACE

 


Applications

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Semiconductor Pathfinding and Development

Advanced electron microscopy, focused ion beam, and associated analytical techniques for identifying viable solutions and design methods for the fabrication of high-performance semiconductor devices.

Semiconductor Failure Analysis

Semiconductor Failure Analysis

Increasingly complex semiconductor device structures result in more places for failure-inducing defects to hide. Our next-generation workflows help you localize and characterize subtle electrical issues that affect yield, performance, and reliability.

Optical Fault Isolation

Increasingly complex designs complicate fault and defect isolation in semiconductor manufacturing. Optical fault isolation techniques allow you to analyze the performance of electrically active devices to locate critical defects that cause device failure.

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Circuit Edit

Advanced, dedicated circuit edit and nanoprototyping solutions, which combine novel gas-delivery systems with a broad portfolio of chemistries and focused ion beam technology, offer unparalleled control and precision for semiconductor device development.

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Optical Fault Isolation

Increasingly complex designs complicate fault and defect isolation in semiconductor manufacturing. Optical fault isolation techniques allow you to analyze the performance of electrically active devices to locate critical defects that cause device failure.

Learn more ›

Circuit Edit

Advanced, dedicated circuit edit and nanoprototyping solutions, which combine novel gas-delivery systems with a broad portfolio of chemistries and focused ion beam technology, offer unparalleled control and precision for semiconductor device development.

Learn more ›

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Electron microscopy services

To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

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