Search Thermo Fisher Scientific
Search Thermo Fisher Scientific
Date: 1 July 2025
Time/Time zone: 9 a.m.–6 p.m. ICT
Location: Sheraton Hanoi Hotel, Vietnam
At SPARK Vietnam 2025, we will demonstrate the benefits of our latest innovative Thermo Scientific instruments and their use cases to your business, including the ELITE+ System, Compliance Test Solutions (CTS), Apreo ChemiSEM System, Helios 6 HD FIB-SEM, and the Talos (S)TEM. Discover groundbreaking advancements in materials science and semiconductor failure analysis solutions and learn about our specialized analytical workflow solutions tailored for memory, compound power, and advanced packaged device applications.
Experience how our electrical and physical failure analysis solutions empower you to evaluate defects, perform precise metrology, and uncover buried defects in even the most challenging semiconductor devices.
Bonus: Bring your samples for a FREE live demo of the Thermo Scientific Phenom Desktop SEM during SPARK Vietnam. Our experts will assist you in discovering the capabilities of this compact and user-friendly system. Don’t miss this opportunity!
| Start | End | Min | Topic |
9:00 a.m. |
9:45 a.m. |
45 | Registration and networking |
9:45 a.m. |
10:00 a.m. |
15 | Opening speech |
10:00 a.m. |
10:30 a.m. |
30 | ELITE System Innovations: Transforming FA with Next-Gen Features |
10:30 a.m. |
11:00 a.m. |
30 | Revolutionizing Failure Analysis with CTS: Tool Introduction and Practical Use Cases |
11:00 a.m. |
11:30 a.m. |
30 | Phenom Desktop SEM |
11:30 a.m. |
12:00 p.m. |
30 | Apreo ChemiSEM system: High-Resolution Imaging and Elemental Analysis |
12:00 p.m. |
1:30 p.m. |
90 | Lunch break |
1:30 p.m. |
2:00 p.m. |
30 | Helios 6 HD FIB-SEM: Advanced TEM Sample Preparation for High-Precision and High-Productivity Semiconductor Analysis |
2:00 p.m. |
2:30 p.m. |
30 | The Latest Updates of Helios 5 Plasma FIB and Applications |
2:30 p.m. |
3:15 p.m. |
45 | Talos F200E (S)TEM: The Standard Lab-Based S/TEM Solution for Semiconductor FA and R&D Applications |
3:15 p.m. |
3:45 p.m. |
30 | Tea break |
3:45 p.m. |
4:15 p.m. |
30 | The Next Generation of Multi-Modality Image Analysis Solution: AI and Machine Learning Evolution |
4:15 p.m. |
5:15 p.m. |
60 | Applications of Next-Gen High-Throughput XPS in Semiconductor Surface Analysis |
5:15 p.m. |
5:30 p.m. |
15 | Closing |