How can X-ray photoelectron spectroscopy support surface analysis?

X-ray photoelectron spectroscopy (XPS), or electron spectroscopy for chemical analysis (ESCA), is a common surface characterization tool used for a huge range of applications from the everyday (e.g., waterproofing fabrics or non-stick cookware coatings), to advanced R&D (e.g. clean energy materials, organic thin-film electronics, and bio-active surfaces). XPS measures the elemental composition, chemical, and electronic state of atoms on a material's surface to analyze its surface chemistry. 

  

XPS spectra are obtained by irradiating a solid surface with a beam of X-rays and measuring the kinetic energy of electrons that are emitted through the photoelectric effect (observed by Hertz in 1887 and explained by Einstein in 1905) from the material. A photoelectron spectrum is recorded by counting ejected electrons over a range of kinetic energies. The energies and intensities of photoelectron peaks enable identification and quantification of all surface elements, except for hydrogen. 

  

XPS offers a significant advantage in detecting subtle changes in the position of peaks that reflect the chemical state of surface elements, such as metallic or oxidized states, and diverse bonding states in polymers. The other key advantage to XPS is that the analysis depth is limited to a few nanometers due to the strong electron-matter interactions. Electrons lose energy quickly as they interact with matter, preventing their detection as part of a peak. This limits the depth from which the signal is detected to around 10 nm, depending on the material, which makes XPS extremely surface sensitive. 

Schematic of an XPS instrument. X-rays are created and monochromated to ensure good energy resolution before irradiating the sample. The created photoelectrons are focused into an analyzer and counted by a detector to create a spectrum.

Which type of materials can X-ray photoelectron spectroscopy instruments characterize?

Surface analysis contributes to the understanding of each of these material types and problems: 

Material types

  • Metals and oxides 
  • Polymers and plastics 
  • Ceramics 
  • Nanomaterials 
  • Semiconductors 
  • Glasses 
  • Bio-materials 
  • Fibers 

Problems

  • Quantitative chemical composition 
  • Characterization of unknown materials 
  • Contaminant identification 
  • Classification of defects and stains 
  • Coatings: thickness and conformity 
  • Optimization of material treatments 
  • Depth composition for layered materials 
  • Understanding interface chemistry 
Bar chart showing common properties and processes as a function of material depth or thickness, measured by the number of atomic layers.

Which techniques complement X-ray photoelectron spectroscopy?

Integration of additional surface analysis techniques on XPS instruments is common. The Thermo Scientific Nexsa G2 Surface Analysis System and the Thermo Scientific ESCALAB QXi XPS Microprobe can be configured to include complementary in situ analytical techniques such as ion scattering spectroscopy (ISS/LEIS), reflected electron energy loss spectroscopy (REELS), UV photoelectron spectroscopy (UPS), Raman spectroscopy, and Auger electron spectroscopy. Furthermore, the CISA correlative workflow allows for combining data from XPS instruments and scanning electron microscopes, enabling spectroscopy and imaging from samples transferred between instruments. 

Additional workflows for surface analysis techniques used to complement XPS, including ISS, REELS, UPS, Raman, and AES

X-Ray Photoelectron Spectroscopy Learning Center

XPS surface analysis references and resources

X-ray photoelectron spectroscopy research

Meet the scientists using X-ray photoelectron spectroscopy in their research

X-ray photoelectron spectroscopy instruments

Thermo Scientific K-Alpha X-ray Photoelectron Spectrometer System

Thermo Scientific Nexsa G2 Surface Analysis System

Thermo Scientific ESCALAB QXi X-ray Photoelectron Spectrometer Microprobe

For Research Use Only. Not for use in diagnostic procedures.