Electrostatic discharge (ESD) causes localized increases in temperature that can damage small features and structures that make up today’s semiconductor devices and integrated circuits. As these structures and devices become smaller and more complex in design, isolating such electrical faults becomes more challenging. This means advanced and highly sensitive testing equipment is needed to ensure that these devices can survive electrostatic discharge. This equipment can also help to prove that devices are in compliance with national, international, and industry ESD test standards.

For example, the most common ESD compliance test, called human body model (HBM) testing, simulates the effect of a human discharging electrical energy into an electronic component. Another example is charged device model (CDM) testing, where a discharge is simulated coming from the device to an external point.

Thermo Fisher Scientific offers a range of equipment that suits all your ESD testing needs, including instruments for transmission-line pulse (TLP), HBM, and CDM testing. The exact tool required will depend on the size and complexity of the device, so be sure to visit our product pages on this website for more information.




ESD Semiconductor Qualification

Every electrostatic discharge (ESD) control plan is required to identify devices that are sensitive to ESD. We offer a complete suite of test systems to help with your device qualification requirements.


Semiconductor Materials and Device Characterization

As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.

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MK.4TE ESD and Latch-Up Test System

  • Rapid-relay-based operations—up to 2304 channels
  • Advanced device preconditioning with six separate vector drive levels
  • Fully compliant Latch-Up stimulus and device biasing

Orion3 Test System

  • Charged device model testing
  • Dual high resolution color cameras
  • Test densities to less than 0.4mm pitch

Celestron Test System

  • Wafer and package level TLP testing
  • High current TLP pulse generato
  • Can be interfaced with semiautomatic probers
  • Intuitive software for control and report generation


  • Testing per the latest industry standards
  • True system level ESD 150pF/330Ω network
  • 2 pin connection via wafer probes to any device
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Electron microscopy services for

To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

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