Style Sheet for Products Table Specifications

All semiconductor integrated circuits (ICs) are subject to environmental electrostatic discharge (ESD) throughout their lifecycles. Designers utilize multiple techniques to protect these sensitive electronic parts from the damage caused by an unintended ESD event. The industry has standardized methods for qualifying parts against a well-defined set of stress criteria, resulting in classifications that are then assigned to the individual parts. These classifications indicate the maximum stress that the part can experience without any latent or catastrophic failure.

Every ESD control plan is required to identify devices in your portfolio that are sensitive to ESD. To accomplish this, you need to classify the level of their sensitivity. A product’s susceptibility to ESD damage depends on its ability to either:

  • dissipate the discharge energy
  • withstand the levels of current

In the past, there were three main classifications based on three different ESD models:

ModelEquivalent circuitStandard
Human body model (HBM)100 pF @ 1.5 kΩANSI/ESDA/JEDEC JS-001
Charge device model (CDM)6.8 pF/55 pF modulesANSI/ESDA/JEDEC JS-002
Machine model (MM)200 pF @ 0ΩESD STM5.2/JEDEC JESD22A115

Recently, MM was eliminated as a standard test method, leaving HBM and CDM as the only ESD models used today.

Human body model

The most common model for qualifying parts is HBM. This model simulates discharge occurring between a human (e.g. a hand or finger) and a conductor (e.g. a metal rail). For this model, a 100 pF capacitor is discharged through a 1,500 Ω resistor to simulate the waveforms generated by a human body. The typical rise time of the current pulse (ESD) through a shorting wire averages 6 ns (6 x 10-9 s) and is slower for a higher resistance load. The peak current through a short circuit averages 0.67A for a 1000 V pre-charge.

The classifications that are assigned to parts during qualification are based on the maximum voltage stress that the part can survive with no damage (either latent or catastrophic). The following table is per ANSI/ESDA/JEDEC JS-001:

ClassVoltage range
Class 0Z< 50 V
Class 0A50 V to < 125 V
Class 0B125 V to < 250 V
Class 1A250 V to < 500 V
Class 1B500 V to < 1000 V
Class 1C1000 V to < 2000 V
Class 22000 V to < 4000 V
Class 3A4000 V to < 8000 V
Class 3B≥ 8000 V

Charged device model

In the CDM model, it is the device itself that becomes charged; this is typically induced triboelectrically by sliding out of a tube/bag/sorter/etc. When the charged part contacts a conductor at a different potential (e.g. a tabletop, hand, or metal tool) the device will rapidly discharge to that conductor and may result in subsequent device failure. The length of the discharge may be very short (less than 1 nanosecond), but the peak current can be quite high. The CDM model uses either a 6.8 pF or 55 pF verification module (coin) which simulates a peak current anywhere from 2 to 30 amps. The following table is per ANSI/ESDA/JEDEC JS-002:

ClassVoltage range
Class C0a< 125 V
Class C0b125 V to < 250 V
Class C1250 V to < 500 V
Class C2a500 V to < 750 V
Class C2b750 V to < 1000 V
Class C3≥ 1000 V*

* Testing above 1000V is not recommended, see Note 3 in the standard.

The standards committees strongly recommend that each component should be fully classified using both HBM and CDM. That means an item may be classified as both Class 2 (HBM) and Class C1 (CDM). These guidelines are typically used to:

  • Develop and measure suitable on-chip protection
  • Enable comparisons between devices (competitive)
  • Provide a system of ESD sensitivity classification to assist in the ESD design and monitoring requirements of the manufacturing and assembly environments
  • Have documented test procedures to ensure reliable and repeatable results

Please see our products page for a complete suite of test systems to help with your device qualification requirements.

 

ESD qualification workflow example

 

 

Techniques

ESD Compliance Testing

Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.

Learn more ›

ESD Compliance Testing

Electrostatic discharge (ESD) can damage small features and structures in semiconductors and integrated circuits. We offer a comprehensive suite of test equipment which verifies that your devices meet targeted ESD compliance standards.

Learn more ›

Samples


Semiconductor Materials and Device Characterization

As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.

Learn more ›


Products

Style Sheet for Instrument Cards Original

Talos F200E TEM

  • High-quality (S)TEM imaging of semiconductor and microelectronic devices
  • Precise, high-speed chemical characterization with EDS
  • Dedicated semiconductor-related applications

MK.4TE ESD and Latch-Up Test System

  • Rapid-relay-based operations—up to 2304 channels
  • Advanced device preconditioning with six separate vector drive levels
  • Fully compliant Latch-Up stimulus and device biasing

Celestron Test System

  • Wafer and package level TLP testing
  • High current TLP pulse generato
  • Can be interfaced with semiautomatic probers
  • Intuitive software for control and report generation

Orion3 Test System

  • Charged device model testing
  • Dual high resolution color cameras
  • Test densities to less than 0.4mm pitch

Pegasus

  • Testing per the latest industry standards
  • True system level ESD 150pF/330Ω network
  • 2 pin connection via wafer probes to any device
Style Sheet for Komodo Tabs
Style Sheet to change H2 style to p with em-h2-header class

Contact us

Style Sheet to change H2 style to p with em-h2-header class
Style Sheet for Support and Service footer
Style Sheet for Fonts
Style Sheet for Cards

Electron microscopy services for
semiconductors

To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

Learn more ›