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Semiconductor devices are becoming more complex due to the demand for faster speeds, shorter time-to-yield, and time-to-market. Scanning transmission electron microscopy (S)TEM metrology has become a necessary element of all leading-edge wafer fabrication workflows, since highly specific measurements are needed to generate statistically relevant data with sub-angstrom accuracy. This data allows manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yield.

Thermo Fisher Scientific offers metrology workflows that are flexible enough to enable manual, semi-automated, or even fully automated solutions, depending on your needs. The Thermo Scientific Metrios AX System is the first TEM designed to provide the fast, precise measurements that semiconductor manufacturers need to develop and control their wafer fabrication processes. Learn more by visiting the Metrios product page below.


TEM metrology workflow example




Wafer analyzed with STEM metrology to assess the line roughness.
Example of the STEM metrology dimensions used to assess the line roughness (LER/LWR) on a 300 mm post-lithography (EUV exposure) and post-etch wafer. This mimics part of a multiple step patterning process used to produce gate fins for the 10 nm technology node.




Semiconductor Pathfinding and Research

Advanced electron microscopy, focused ion beam, and associated analytical techniques for identifying viable solutions and design methods for the fabrication of high-performance semiconductor devices.


Physical and Chemical Characterization

Ongoing consumer demand drives the creation of smaller, faster, and cheaper electronic devices. Their production relies on high-productivity instruments and workflows that image, analyze, and characterize a broad range of semiconductor and display devices.


Yield Ramp and Metrology

We offer advanced analytical capabilities for defect analysis, metrology, and process control, designed to help increase productivity and improve yield across a range of semiconductor applications and devices.


Semiconductor Materials and Device Characterization

As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.

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Talos F200E TEM

  • High-quality (S)TEM imaging of semiconductor and microelectronic devices
  • Precise, high-speed chemical characterization with EDS
  • Dedicated semiconductor-related applications

Metrios AX TEM

  • Automation options to support quality, consistency, metrology, and reduced OPEX
  • Leverages machine learning for superior autofunctions and feature recognition
  • Workflows for both in-situ and ex-situ lamella preparation

ExSolve WTP DualBeam

  • Can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300 mm in diameter
  • Addresses needs requiring automated, high-throughput sampling at advanced technology nodes

Avizo Software
Materials Science

  • Support for multi-data/multi-view, multi-channel, time series, very large data
  • Advanced multi-mode 2D/3D automatic registration
  • Artifact reduction algorithms
Thermo Scientific Inspect 3D tomography software

Inspect 3D Software

  • Image processing tools and filters for cross-correlation
  • Feature tracking for image alignment
  • Algebraic reconstruction technique for iterative projection comparison

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Electron microscopy services for

To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

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