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Semiconductor devices are becoming more complex due to the demand for faster speeds, shorter time-to-yield, and time-to-market. Scanning transmission electron microscopy (S)TEM metrology has become a necessary element of all leading-edge wafer fabrication workflows, since highly specific measurements are needed to generate statistically relevant data with sub-angstrom accuracy. This data allows manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yield.

Thermo Fisher Scientific offers metrology workflows that are flexible enough to enable manual, semi-automated, or even fully automated solutions, depending on your needs. The Thermo Scientific Metrios AX System is the first TEM designed to provide the fast, precise measurements that semiconductor manufacturers need to develop and control their wafer fabrication processes. Learn more by visiting the Metrios product page below.


TEM metrology workflow example




Wafer analyzed with STEM metrology to assess the line roughness.
Example of the STEM metrology dimensions used to assess the line roughness (LER/LWR) on a 300 mm post-lithography (EUV exposure) and post-etch wafer. This mimics part of a multiple step patterning process used to produce gate fins for the 10 nm technology node.




Semiconductor research and development

Innovation starts with research and development. Learn more about solutions to help you understand innovative structures and materials at the atomic level.


Semiconductor materials characterization

Many factors impact yield, performance, and reliability. Learn more about solutions to characterize physical, structural, and chemical properties.


Semiconductor metrology

Manufacturing today’s complex semiconductors requires exact process controls. Learn more about advanced metrology and analysis solutions to accelerate yield learnings.


Semiconductor Materials and Device Characterization

As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.

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Talos F200E TEM

  • High-quality (S)TEM imaging of semiconductor and microelectronic devices
  • Precise, high-speed chemical characterization with EDS
  • Dedicated semiconductor-related applications

Metrios AX TEM

  • Automation options to support quality, consistency, metrology, and reduced OPEX
  • Leverages machine learning for superior autofunctions and feature recognition
  • Workflows for both in-situ and ex-situ lamella preparation

Helios 5 EXL DualBeam

  • Low-voltage performance for high sample preparation quality
  • Ultra-high-resolution immersion-lens field-emission SEM column
  • Automated handling of 300 mm FOUP with EFEM (GEM300 compliant)

Avizo Software
Materials Science

  • Support for multi-data/multi-view, multi-channel, time series, very large data
  • Advanced multi-mode 2D/3D automatic registration
  • Artifact reduction algorithms
Thermo Scientific Inspect 3D tomography software

Inspect 3D Software

  • Image processing tools and filters for cross-correlation
  • Feature tracking for image alignment
  • Algebraic reconstruction technique for iterative projection comparison

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Electron microscopy services for

To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

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