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Adam Stokes

Expertise

Failure AnalysisPlasma Focused Ion BeamSemiconductor

Dr. Adam Stokes

Senior Product Marketing Manager, Thermo Fisher Scientific

About Adam Stokes

Adam Stokes is a Senior Product Marketing Manager with 13 years of experience in electron microscopy. His technical expertise centers on plasma focused ion beam (PFIB) techniques for advanced failure analysis, as well as millimeter-to-nanoscale device characterization and the identification of critical microstructure–property relationships. He holds a PhD in Materials Science from the Colorado School of Mines.

Expertise and focus

Adam’s expertise centers on PFIB workflows used in semiconductor failure analysis and advanced device characterization. His background includes large volume material removal, cross sectioning, advanced lamella preparation, and three-dimensional analysis applied to complex semiconductor structures. He has worked with a range of preparation techniques that support downstream analysis such as transmission electron microscopy and atom probe tomography, enabling detailed investigation of defects, interfaces, and process-related variations in semiconductor devices.

Scientific perspective

Adam’s scientific perspective is shaped by his doctoral research in materials science together with his ongoing engagement with semiconductor characterization challenges. He understands how plasma focused ion beam methods can be used to access buried features and complex architectures at relevant length scales, and how these capabilities support yield learning, process development, and device reliability analysis. His work reflects a focus on connecting advanced preparation and analysis techniques with the evolving needs of semiconductor technology development.

Illuminating Semiconductors

Physical and electrical failure analysis for power devices

Physical and Electrical Failure Analysis of Power Semiconductor Devices

June 18, 2025

Read more Physical and Electrical Failure Analysis of Power Semiconductor Devices
NProber Success Rate

Semiconductor Nanoprobing Boosts TEM Analysis Success Rates on Advanced Logic Devices

July 1, 2024

Read more Semiconductor Nanoprobing Boosts TEM Analysis Success Rates on Advanced Logic Devices
Wide Bandgap Failure Analysis

Failure Analysis of Wide Bandgap (WBG) Semiconductor Devices: Techniques and Root-Cause Insights

June 11, 2024

Read more Failure Analysis of Wide Bandgap (WBG) Semiconductor Devices: Techniques and Root-Cause Insights
Semiconductor ablation solution for Helios PFIB

New Ablation Solution for Advanced Semiconductor Packaging Increases Helios PFIB Throughput and Precision

September 28, 2022

Read more New Ablation Solution for Advanced Semiconductor Packaging Increases Helios PFIB Throughput and Precision
Advanced semiconductor packaging chip stack

Advanced Semiconductor Packaging: Bringing Stacked Chips Together

June 28, 2022

Read more Advanced Semiconductor Packaging: Bringing Stacked Chips Together
3D semiconductor reconstruction

How 3D Semiconductor Reconstruction with FIB-SEM Reveals Hidden Defects and Critical Dimensions

May 24, 2022

Read more How 3D Semiconductor Reconstruction with FIB-SEM Reveals Hidden Defects and Critical Dimensions
Failure analysis of semiconductor devices

How to Improve Quality and Yield with Early Failure Analysis of Semiconductor Devices

December 2, 2021

Read more How to Improve Quality and Yield with Early Failure Analysis of Semiconductor Devices
Display technology

Mapping the Evolving World of Information Display Technology

October 13, 2021

Read more Mapping the Evolving World of Information Display Technology
Time-resolved image of semiconductor fault isolation

Enhancing Semiconductor Fault Isolation With Time-resolved Laser-assisted Device Alteration

September 16, 2021

Read more Enhancing Semiconductor Fault Isolation With Time-resolved Laser-assisted Device Alteration
Environmental interference from construction causing image distortion

How to Mitigate Environmental Interference During Semiconductor Failure Analysis

June 2, 2021

Read more How to Mitigate Environmental Interference During Semiconductor Failure Analysis

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