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Date: May 15, 2026
Time/Time zone: 9 a.m. to 6 p.m.
Location: Iconic Marjorie Hotel, Penang
Starting in 2026, Thermo Fisher Scientific is redefining our customer seminar experience with the launch of RISE (Revolutionary Innovation for Semiconductor Excellence), the next evolution of our legacy SPARK program. RISE is designed to meet the rapidly changing needs of the semiconductor industry, especially as AI-driven architectures, advanced packaging, and yield pressure reshape manufacturing and failure analysis strategies.
RISE reflects our strategic commitment to enabling high-impact, innovation-driven solutions that help you tackle emerging technical challenges. More than a seminar, RISE represents how we connect with you to reveal what matters, enable what’s critical, and innovate what’s next. By leveraging insights from our global installed base and real customer data, RISE focuses on improving productivity, yield, and time-to-value across regions and applications.
Under SPARK, we successfully introduced customers to NPIs (new product introductions) through concise product overviews, helping attendees quickly understand what was recently released and available. Building on that foundation, RISE expands the scope and depth into a true seminar-style experience, one that offers immediately actionable outcomes, not just awareness.
RISE goes beyond introductions to feature real-world benchmarking of workflows and solutions, peer-led customer use-case presentations, and dedicated tracks focused on specific technologies and applications. These sessions dive deeply into today’s most pressing challenges, from AI and advanced packaging to yield optimization and production scaling, sharing proven practices validated in leading labs worldwide.
Attendees leave RISE with field-proven methodologies, practical comparisons, and expert guidance they can apply immediately, along with enhanced opportunities to engage directly with Thermo Fisher specialists and industry peers. Join RISE to discover how leading semiconductor organizations are accelerating NPIs, improving yield, and deploying production-ready workflows with confidence.
Start |
End |
Min |
Topic |
9:00 a.m. |
10:00 a.m. |
60 |
Registration and welcome |
9:30 a.m. |
10:00 a.m. |
30 |
Networking Tea time |
10:00 a.m. |
10:10 a.m. |
10 |
Opening |
10:10 a.m. |
11:00 a.m. |
50 |
Rising EFA: Next-Generation Fault Isolation with Optical, eBeam, & Thermal Technologies |
11:00 a.m. |
11:30 a.m. |
30 |
Phenom Desktop SEM: Compact Power for Fast and Reliable Failure Analysis |
11:30 a.m. |
12:00 p.m. |
30 |
Accelerating Image-to-Data Workflows: 3D Metrology for Advanced Semiconductor Failure Analysis |
12:00 p.m. |
1:30 p.m. |
90 |
Lunch Break |
1:30 p.m. |
2:00 p.m. |
30 |
Scios 3 FIB-SEM: Immediate Access to Complete Application Versatility |
2:00 p.m. |
2:30 p.m. |
30 |
Customer Invited Talk |
2:30 p.m. |
3:00 p.m. |
30 |
Redefining TEM Lamella Preparation: Helios 6 HD FIB-SEM Capabilities and Use Cases |
3:00 p.m. |
3:30 p.m. |
30 |
Scaling Failure Analysis for AI Devices with Helios 5 Hydra+ |
3:30 p.m. |
4:00 p.m. |
30 |
Tea break |
4:00 p.m. |
4:30 p.m. |
30 |
Bridging Routine Failure Analysis and Advanced Materials Science: Talos F200E & Spectra TEM |
4:30 p.m. |
5:00 p.m. |
30 |
Inline PFIB-SEM for Advanced Node Manufacturing: Faster Development Insight, Reduced Yield Ramp Time, and Stable HVM Process Control |
5:00 p.m. |
5:30 p.m. |
30 |
RISE with Optis: Enabling Fully Automated, Fab-Integrated TEM Sample Preparation |
5:30 p.m. |
6:00 p.m. |
30 |
Closing |