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Date: May 7, 2026
Time/Time zone: 1 p.m. to 6 p.m.
Location: Novotel Bangkok Future Park Rangsit
Starting in 2026, we are redefining our customer seminar experience with the launch of RISE, Revolutionary Innovation for Semiconductor Excellence, the next evolution of our legacy SPARK program. RISE is designed to meet the rapidly changing needs of the semiconductor industry, especially as AI-driven architectures, advanced packaging, and yield pressure reshape manufacturing and failure analysis strategies.
RISE reflects our strategic commitment to delivering high-impact, innovation-driven solutions that help you tackle emerging technical challenges. More than a seminar, RISE represents how we connect with you to reveal what matters, enable what’s critical, and innovate what’s next. By leveraging insights from our global installed base and real customer data, RISE focuses on improving productivity, yield, and time-to-value across regions and applications.
Under SPARK, we successfully introduced customers to NPIs (new product introductions) through concise product overviews, helping attendees quickly understand what was recently released and available. Building on that foundation, RISE expands the scope and depth into a true seminar-style experience, one that delivers immediately actionable outcomes, not just awareness.
RISE goes beyond introductions to feature real-world benchmarking of workflows and solutions, peer-led customer use-case presentations, and dedicated tracks focused on specific technologies and applications. These sessions dive deeply into today’s most pressing challenges, from AI and advanced packaging to yield optimization and production scaling, sharing best practices validated in leading labs worldwide.
Attendees leave RISE with field-proven methodologies, practical comparisons, and expert guidance they can apply immediately, along with enhanced opportunities to engage directly with Thermo Fisher specialists and industry peers. Join RISE to discover how leading semiconductor organizations are accelerating NPIs, improving yield, and deploying production-ready workflows with confidence.
| Start | End | Min | Topic |
|
01:00 pm |
60 | Registration |
01:00 pm |
01:10 pm |
10 | Opening |
01:10 pm |
02:00 pm |
50 | Rising EFA: Next-Generation Fault Isolation with Optical, eBeam & Thermal Technologies |
02:00 pm |
02:30 pm |
30 | From Rapid Screening to In-Depth Elemental Analysis: Phenom Desktop SEM & Apreo ChemiSEM in Action |
02:30 pm |
03:00 pm |
30 | Customer Invited Talk |
03:00 pm |
03:30 pm |
30 | Tea break |
03:30 pm |
04:00 pm |
30 | Accelerating Image-to-Data Workflows: 3D Metrology for Advanced Semiconductor Failure Analysis |
04:00 pm |
04:30 pm |
30 | Scios 3 FIB-SEM: Immediate Access to Complete Application Versatility |
04:30 pm |
05:00 pm |
30 | Redefining TEM Lamella Preparation: Helios 6 HD FIB-SEM Capabilities and Use Cases |
05:00 pm |
05:30 pm |
30 | Bridging Routine Failure Analysis and Advanced Materials Science: Talos F200E & Spectra TEM |
05:30 pm |
05:40 pm |
10 | Closing |