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This SPARK Seminar will also provide excellent networking and collaboration opportunities.
Through your participation in this year’s SPARK Seminar, we aim to help you understand the defect analysis and metrology challenges facing the global semiconductor industry.
Time |
Duration |
Presentation Title/Activity |
9:00 a.m. - 9:30 a.m. |
30 |
Registration & Networking |
9:30 a.m. - 9:40 a.m. |
10 |
Opening |
9:40 a.m. - 10:00 a.m. |
20 |
Semiconductor Failure Analysis Workflow Innovation |
10:00 a.m. - 11:00 a.m. |
60 |
Introduction to Electrical Failure analysis techniques and Fault Localization Applications for Advanced Packaging and Power Device |
11:00 a.m. - 12:00 p.m. |
60 |
Introduction to Ga-based FIB Technology, Applications, and Automation for Enhanced Efficiency |
12:00 p.m. - 1:00 p.m. |
60 |
Lunch Break |
1:00 p.m. - 1:45 p.m. |
45 |
TEM workflows for GaN/SiC power device applications |
1:45 p.m. - 2:45 p.m. |
60 |
Enhancing Packaged Die Failure Analysis: Leveraging Ga-free FIB and Avizo for Advanced Insights and Efficiency |
2:45 p.m. - 3:00 p.m. |
15 |
"Meet the experts" session kick-off |
3:00 p.m. - 3:30 p.m. |
30 |
Tea Break |
3:30 p.m. - 5:30 p.m. |
120 |
Meet the experts: |
6:00 p.m. - 8:00 p.m. |
120 |
Networking Dinner |
*Agenda subject to change
Time |
Duration |
Presentation Title/Activity |
12:30 p.m. - 12:45 p.m. |
15 |
Registration |
12:45 p.m. - 1:00 p.m. |
15 |
Opening |
1:00 p.m. - 1:30 p.m. |
30 |
Fault localization techniques for advanced packaging and power semiconductor devices |
1:30 p.m. - 2:00 p.m. |
30 |
SEM applications, portfolio and automation: enhancing efficiency and precision |
2:00 p.m. - 2:20 p.m. |
20 |
Remote demo - Axia ChemiSEM Scanning Electron Microscope and automated in-situ quantitative EDS mapping |
2:20 p.m. - 2:50 p.m. |
30 |
Introducing the Thermo Scientific Helios 6 HD FIB-SEM and the AutoTEM lamella preparation workflow |
2:50 p.m. - 3:20 p.m. |
30 |
Tea break |
3:20 p.m. - 3:40 p.m. |
20 |
Unveiling the power of automation software: An introduction to iFast and AutoTEM |
3:40 p.m. - 4:10 p.m. |
30 |
Ga-free FIB workflows to accelerate packaged die failure analysis |
4:10 p.m. - 4:30 p.m. |
20 |
Introducing our state-of-the-art TEM portfolio: Metrios, Talos, and Spectra |
4:30 p.m. - 5:00 p.m. |
30 |
The XPS surface analysis for the semiconductor failure analysis & Automated particle analysis on the Desktop SEM for cleanliness analysis |
5:00 p.m. - 5:40 p.m. |
40 |
Semiconductor Visualization and Data Solutions (Avizo) |
5:40 p.m. - 6:00 p.m. |
20 |
Closing |
6:00 p.m. - 8:00 p.m. |
120 |
Networking dinner |
*Agenda subject to change