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On-demand webinar
Duration: 31 minutes
In this webinar, we will introduce the Thermo Scientific Helios MX1 PFIB-SEM, which provides quick, high-resolution insights in the fab to support yield improvement and process control. With advanced automation, a selectable multi-ion species plasma FIB, and enhanced imaging capabilities, this next-generation 300 mm wafer DualBeam system meets the growing demands of advanced chip fabrication. Don’t miss this opportunity to explore how the system’s exceptional in-line 3D metrology and defect analysis capabilities are driving efficiency and precision in semiconductor manufacturing.
You will learn about:
- Plasma FIB technology—Understand the benefits of argon and xenon plasma ion species for quickly revealing structures buried beneath the wafer surface.
- 3D metrology and defect analysis—Learn the capabilities of the Helios MX1 PFIB-SEM for fab process control, including through volume critical dimension metrology and defect analysis of buried structures.
- Helios MX1 PFIB-SEM in the fab—Gain insights into how this system supports seamless fab integration including automated wafer handling, wafer processing, and data connectivity.
About the speaker
Mark Najarian, Product Marketing Manager, Thermo Fisher Scientific
Mark Najarian, MS, has been working in the semiconductor industry for approximately 20 years, supporting the development of advanced nodes, yield ramp, failure analysis, and process monitoring. He is currently a Product Marketing Manager specializing in fab solutions at Thermo Fisher Scientific. He is responsible for the next-generation in-line wafer DualBeam flagship metrology product, designed to meet the growing demands of semiconductor technology scaling inflections.