The electronics market is under constant consumer pressure to develop smaller, faster, cheaper, and more energy-efficient devices. This requires semiconductor designs that have smaller and smaller structural dimensions, with shorter time-to-yield and time-to-market. Unfortunately, most common technologies and workflows are inadequate for characterizing these smaller features.

As a result, novel and high productivity transmission electron microscope (TEM) workflows are needed to image and analyze the next generation of semiconductor device structures. Advanced characterization of these devices can help you deliver on necessary performance, predict and control structural, physical, and chemical properties, as well as correlate your characterization data to parametric test results.

Thermo Fisher Scientific offers workflows for the high-productivity characterization of parameters that directly affect device yield, performance, and reliability. This includes physical, structural, and chemical properties. Click through to the pages below to learn more about our range of products and to gain a deeper understanding of how these workflows can meet your specific needs.


Semiconductor device characterization workflow examples

 

 

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Techniques

Nanoprobing

As device complexity increases, so does the number of places defects have to hide. Nanoprobing provides the precise localization of electrical faults, which is critical for an effective transmission electron microscopy failure analysis workflow.

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Semiconductor TEM Imaging and Analysis

Thermo Fisher Scientific transmission electron microscopes offer high-resolution imaging and analysis of semiconductor devices, enabling manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yields.

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Sample Preparation of Semiconductor Devices

Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.

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Semiconductor Analysis and Imaging

Thermo Fisher Scientific offers scanning electron microscopes for every function of a semiconductor lab, from general imaging tasks to advanced failure analysis techniques requiring precise voltage-contrast measurements.

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Thermal Fault Isolation

Uneven distribution of local power dissipation can cause large, localized increases in temperature, leading to device failure. We offer unique solutions for thermal fault isolation with high-sensitivity lock-in infrared thermography (LIT).

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APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

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Semiconductor Laser Ablation

Laser ablation provides high-throughput milling of semiconductor devices for imaging and analysis with electron microscopy, while still preserving sample integrity. Access large-volume 3D data and optimize milling conditions to best suit your sample type.

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Device Delayering

Shrinking feature size, along with advanced design and architecture, results in increasingly challenging failure analysis for semiconductors. Damage-free delayering of devices is a critical technique for the detection of buried electrical faults and failures.

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Nanoprobing

As device complexity increases, so does the number of places defects have to hide. Nanoprobing provides the precise localization of electrical faults, which is critical for an effective transmission electron microscopy failure analysis workflow.

Learn more ›

Semiconductor TEM Imaging and Analysis

Thermo Fisher Scientific transmission electron microscopes offer high-resolution imaging and analysis of semiconductor devices, enabling manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yields.

Learn more ›

Sample Preparation of Semiconductor Devices

Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.

Learn more ›

Semiconductor Analysis and Imaging

Thermo Fisher Scientific offers scanning electron microscopes for every function of a semiconductor lab, from general imaging tasks to advanced failure analysis techniques requiring precise voltage-contrast measurements.

Learn more ›

Thermal Fault Isolation

Uneven distribution of local power dissipation can cause large, localized increases in temperature, leading to device failure. We offer unique solutions for thermal fault isolation with high-sensitivity lock-in infrared thermography (LIT).

Learn more ›

APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

Learn more ›

Semiconductor Laser Ablation

Laser ablation provides high-throughput milling of semiconductor devices for imaging and analysis with electron microscopy, while still preserving sample integrity. Access large-volume 3D data and optimize milling conditions to best suit your sample type.

Learn more ›

Device Delayering

Shrinking feature size, along with advanced design and architecture, results in increasingly challenging failure analysis for semiconductors. Damage-free delayering of devices is a critical technique for the detection of buried electrical faults and failures.

Learn more ›

Samples


Semiconductor Materials and Device Characterization

As semiconductor devices shrink and become more complex, new designs and structures are needed. High-productivity 3D analysis workflows can shorten device development time, maximize yield, and ensure that devices meet the future needs of the industry.

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Products

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Spectra 300

  • Highest-resolution structural and chemical information at the atomic level
  • Flexible high-tension range from 30-300 kV
  • Three lens condenser system

Talos F200X TEM

  • High resolution/throughput in STEM imaging and chemical analysis
  • Add in situ sample holders for dynamic experiments
  • Features Velox Software for fast and easy acquisition and analysis of multimodal data

Metrios AX TEM

  • Automation options to support quality, consistency, metrology, and reduced OPEX
  • Leverages machine learning for superior autofunctions and feature recognition
  • Workflows for both in-situ and ex-situ lamella preparation

ExSolve WTP DualBeam

  • Can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300 mm in diameter
  • Addresses needs requiring automated, high-throughput sampling at advanced technology nodes

Helios 5 DualBeam

  • Fully automated, high-quality, ultra-thin TEM sample preparation
  • High throughput, high resolution subsurface and 3D characterization
  • Rapid nanoprototyping capabilities

Helios G4 PFIB DualBeam

  • Gallium-free STEM and TEM sample preparation
  • Multi-modal subsurface and 3D information
  • Next-generation 2.5 μA xenon plasma FIB column

Scios 2 DualBeam

  • Full support of magnetic and non-conductive samples
  • High throughput subsurface and 3D characterization
  • Advanced ease of use and automation capabilities

Verios 5 XHR SEM

  • Monochromated SEM for sub-nanometer resolution over the full 1 keV to 30 keV energy range
  • Easy access to beam landing energies as low as 20 eV
  • Excellent stability with piezo stage as standard

Quattro ESEM

  • Ultra-versatile high-resolution FEG SEM with unique environmental capability (ESEM)
  • Observe all information from all samples with simultaneous SE and BSE imaging in every mode of operation

Prisma E SEM

  • Entry-level SEM with excellent image quality
  • Easy and quick sample loading and navigation for multiple samples
  • Compatible with a wide range of materials thanks to dedicated vacuum modes

Apreo 2 SEM

  • High-performance SEM for all-round nanometer or sub-nanometer resolution
  • In-column T1 backscatter detector for sensitive, TV-rate materials contrast
  • Excellent performance at long working distance (10 mm)

Phenom ProX Desktop SEM

  • High performance desktop SEM with integrated EDS detector
  • Resolution <8 nm (SE) and <10 nm (BSE); magnification up to 150,000x
  • Optional SE detector
 
 

ELITE System

  • Completely non-destructive
  • Quickly identifies defective component on assembly board for accurate dispositioning
  • Localizes defect in x-y with micrometer accuracy, with depth location accurate to 20 µm

Hyperion II System

  • Atomic Force Probing
  • Localize transistor faults
  • Integrated PicoCurrent (CAFM)

nProber IV

  • Localize transistor and BEOL faults
  • Thermal nanoprobing (-40°C to 150°C)
  • Semi-automated operation

AutoTEM 5

  • Fully automated in situ S/TEM sample preparation
  • Support of top-down, planar and inverted geometry
  • Highly configurable workflow
  • Easy to use, intuitive user interface

Auto Slice and View 4.0 Software

  • Automated serial sectioning for DualBeam
  • Multi-modal data acquisition (SEM, EDS, EBSD)
  • On-the-fly editing capabilities
  • Edge based cut placement

Ifast Software

  • Macro recorder for faster recipe creating
  • Runner for unattended overnight operation
  • Alignment tools: Image recognition and edge finding

Inspect 3D Software

  • Image processing tools and filters for cross-correlation
  • Feature tracking for image alignment
  • Algebraic reconstruction technique for iterative projection comparison

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Electron microscopy services for
semiconductors

To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

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