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Mark Najarian

Expertise

electron microscopyfab solutionsSemiconductor

Education

B.S. in Chemistry at the University of California, Santa Barbara; M.S. in Nanoscale Materials Science and Engineering at the University of California, Berkeley

Mark Najarian

Product Marketing Manager, Semiconductor, Thermo Fisher Scientific

About Mark Najarian

Mark Najarian is a Product Marketing Manager, Semiconductor at Thermo Fisher Scientific, specializing in next-generation semiconductor fab solutions. He has worked in the semiconductor industry for approximately twenty years, supporting advanced node development, yield ramp, failure analysis, and process monitoring. In his current role, he focuses on in-line wafer metrology products that integrate focused ion beam and scanning electron microscopy methods to meet the evolving needs of semiconductor manufacturing.

Mark Najarian earned a B.S. in Chemistry at the University of California, Santa Barbara, and an M.S. in Nanoscale Materials Science and Engineering at the University of California, Berkeley. He has been granted several patents enabling advances in 3D SEM metrology. He is a contributing author to research featured in Nature and Advanced Materials and is recognized as a leader in the global semiconductor metrology community.

Expertise and focus

Mark’s expertise includes semiconductor process development, in-line metrology, and defect analysis using combined imaging and analytical tools. He works with solutions that deliver high-resolution insights directly in the fab, enabling fast, accurate three-dimensional metrology and defect characterization. His background spans critical workflows such as cross-sectioning, angled milling, and volume tomography through sequential imaging and analysis, which support decision-making for advanced logic, memory, and packaging technologies.

Scientific perspective

Mark brings a perspective that integrates a practical understanding of physical defects with the technical capabilities of advanced metrology systems. He focuses on how automated three-dimensional measurement and defect analysis can accelerate time-to-yield, improve process control, and strengthen confidence in results at scale. His work reflects a deep familiarity with semiconductor challenges as device features shrink and integration complexity increases, and how in-fab analytical solutions contribute to addressing these challenges.

Illuminating Semiconductors

3D NAND structure targeted memory array

How Advanced Metrology Workflows Solve Critical 3D NAND Structure Challenges

February 8, 2023

Read more How Advanced Metrology Workflows Solve Critical 3D NAND Structure Challenges
Anatomy of a 3D NAND Structure

What is 3D NAND Flash Memory?

February 9, 2021

Read more What is 3D NAND Flash Memory?

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