In our previous blog, we talked about how failure analysis has become a tedious and time-consuming job. FA engineers work with larger sample volumes and more complex device architectures, making it challenging to obtain precise data from every sample. FA engineers demand, fast, repeatable, high-quality milling and imaging to reduce bottlenecks caused by inefficient failure analysis workflows and increase time-to-data. The right instrument for the job is one that automates key workflows with high quality imaging to collect data from every sample.
Failure analysis of semiconductor samples with the Helios 5 PFIB DualBeam
Our new Thermo Fisher Scientific Helios 5 PFIB DualBeam FIB-SEM provides unique, site-specific, delayering and failure analysis workflows for advanced logic, 3D NAND, and 2.5/3D packaging. It also provides high speed, large area cross-sectioning, high-resolution TEM sample preparation, sub-nanometer low energy SEM performance, and automated deprocessing with end pointing for the shortest time to nanoscale information.
We also understand efficient sample analysis relies on optimum tool alignment to provide the highest performance under any circumstances. The SmartAlign feature included in the Helios 5 PFIB simplifies the process and eliminates the need to micro-monitor SEM alignments for automated delayering, TEM prep and slice and view cross-sectioning
Both automation and high-throughput, high-resolution analysis are crucial for time-strapped FA engineers and lab managers. The advanced capabilities of the Helios 5 PFIB speeds up time-to-data and increases productivity. Our webinar includes more details on how the Helios 5 PFIB enables higher sample throughput and better automation for semiconductor failure analysis, reducing your time-to-data to hours instead of days or weeks.
David Akerson is a Senior Global Market Development Manager for semiconductors at Thermo Fisher Scientific.
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