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View additional product information for Nickel etchant for evaporated nickel films - FAQs (044586.LV, 044586.R0)
5 product FAQs found
Nickel etchant for evaporated nickel films has an etch rate of 25 Å/second at 30 degrees C.
Undercutting of the etchant can be reduced by increasing the rate of stirring or agitation.
No, it is a ready-to-use solution. Dilution will only be necessary if you want to reduce the etch rate.
The etch rate of the etchant can be reduced by adding 1 part deionized water to 2 parts etchant. This will reduce the etch rate approximately 50%.
The etch rate of the etchant will be increased by increasing the rate of stirring or agitation.