Design and develop semiconductor products to tolerate ESD events with a flexible TLP/VF-TLP test system. The Thermo Scientific™ Celestron™ Flexible Bench Top TLP/VF-TLP Test System provides reliable characterization of advanced semiconductor structures under a variety of stressors. The system can be configured for Transmission Line Pulse (TLP), Very Fast Transmission Line Pulse (VF−TLP), Human Body Model ESD and Machine Model ESD for testing at the wafer level and/or the package level. Optional probes can also be used to measure signals on pins or pads other than the ones being stressed.
The Celestron system software is the most comprehensive in the industry. During test operations, it displays recorded TLP pulse voltage and current waveforms, compiled pulsed I-V curve, leakage current measurements, and DC I-V curve trace data. The operator can select the range of test voltages (stress pulses), pulse polarity, leakage and curve trace parameters. The position and duration of the measurement window within the TLP pulse can also be selected and modified after the data is collected.