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October 14, 2025, beginning at 13:30
October 15, 2025, beginning at 9:00
Innovations in failure analysis tools and techniques are introduced to the market every year. To stay relevant and agile with evolving technologies and productivity demands, understanding how to leverage new solutions or your existing systems and how to address gaps in your toolsets is critical to achieving your goals.
The European Failure Analysis SPARK Seminar is a landmark event for engineers working in the semiconductor industry who want to learn how leading vendors and labs are working together to get more useful data with expanded applications, as well as introducing key capabilities.
Attend this two-day, in-person seminar for the opportunity to network with our experts and your peers:
- Learn how a complete electrical to physical analysis workflow with advanced capabilities is executed.
- Discover how applications development can improve the data you get from your instrumentation.
- Watch live demonstrations of enhanced analytical capabilities and features that can streamline your work.
Who should attend?
Engineers executing and relying on data from the failure analysis and characterization of semiconductor devices and materials using electrical, optical, and electron optical analysis instruments.
Antoine Reverdy – Applications Engineer, Sector Technologies
Garrett Benson – Applications Engineer, Thermo Fisher Scientific
Martin Schneider – Product Specialist, Thermo Fisher Scientific
Melissa Mullen – Marketing Manager, Thermo Fisher Scientific
Thijs Kempers – Chief Executive Officer, Eurofins MASER
Vojtech Schanilec – Product Manager, Thermo Fisher Scientific
13:30 – Arrival
14:00 – Seminar Welcome
14:20 – Frontiers of Characterization:
Dynamic vs. Static Laser Voltage Probing
14:50 – Optical Failure Analysis Techniques in Action
15:10 – Laser Voltage Probing - Live Demonstration
15:40 – Break
16:10 – From the Inside Out:
Lock-in Thermography and OBIRCH in FA Workflows
16:40 – Uncovering the Hidden:
Precise Sample Preparation in FA Workflows
17:00 – Physical Failure Analysis Techniques in Action
17:30 – Networking Dinner
9:00 – Arrival
9:30 – Discover the Ground Truth: TEM Analysis in FA Workflows
10:00 – TEM Analysis - Live Demonstration
10:20 – Break
10:50 – Invited Topic with NXP Semiconductors
11:20 – Eurofins MASER Facility Tour
12:00 – Networking Lunch
Recommended nearby hotels:
What will you learn?
A complete failure analysis workflow requires multiple disciplines and expertise. Increase the depth of your knowledge of electrical fault localization, optical fault isolation, focused ion beam sample preparation, and advanced electron microscopy. At the same time, gather context beyond your area of focus, including the analysis that comes before and after your work, and the critical components of increased connectivity and efficiency.
Why attend in person?
Networking, collaboration, and organic discussion are best achieved in a face-to-face environment. While we encourage attending large-scale conferences as well, we believe that focused seminars can offer more tailored material and in-depth engagements. You will also tour Eurofins MASER’s extensive facility, offering valuable perspective on the tools and experience needed for full-scale reliability testing and failure analysis.
What if my organization isn’t planning to invest in instrumentation?
Whether your failure analysis is sourced externally or you have plans to introduce a new system to your lab, this seminar will provide valuable insight on how to get more complete data from the resources you have and help identify what capabilities you may need. We will cover expanded use-cases and techniques for both electrical and physical analysis, to give you the comprehensive understanding and context to make decisions and improve your results.
What expenses are required?
The seminar is free to registrants and includes a networking dinner and lunch over the two-day schedule. The agenda is set over one afternoon and one morning to allow for same-day travel and potentially only one night of accommodation, reducing overall cost.