Focused ion beam scanning electron microscopy

FIB-SEM Instruments

Scientists and engineers in both academia and industry are constantly facing new challenges that require highly localized characterization of a wide range of samples and materials. The ongoing drive to improve the quality of these materials means that structural and compositional information at the nanoscale is frequently necessary. FIB-SEM instruments generate exactly this kind of data by combining the precise sample modification of FIB with the high-resolution imaging of SEM.

DualBeam instruments

Thermo Fisher Scientific is the industry leader in FIB-SEM technology with more than 30 years of experience with DualBeams. The technology's novel ability to reveal subsurface structural detail, by making precise cuts with a FIB and then imaging the exposed surface with a high-resolution SEM, has led to its acceptance by researchers and engineers in a wide variety of applications. With more than 2,000 Thermo Scientific systems installed around the world, our DualBeams continue to lead the market with cutting-edge capabilities built on technical innovation and a deep store of application knowledge gathered over years of collaborative development with our customers.

TriBeam instruments

The new TriBeam systems are our latest FIB-SEM innovation, featuring the addition of a femtosecond laser, which can cut many materials at rates that are orders of magnitude faster than a typical FIB. A large cross-section (hundreds of micrometers) can be created in less than five minutes. Because the laser has a different removal mechanism (ablation versus the ion sputtering of FIB), it can easily process challenging materials, such as non-conductive or ion-beam-sensitive samples. The extremely short duration of the femtosecond laser pulses introduces almost no artifacts such as heat impact, microcracking, melting, or those typical of traditional mechanical polishing. In most cases, the laser-milled surfaces are clean enough for direct SEM imaging and even for surface-sensitive techniques such as electron backscatter diffraction (EBSD) mapping.

We offer a broad product portfolio and advanced automation capabilities for applications such as transmission electron microscopy (TEM) sample preparation, subsurface and 3D characterization, nano-prototyping, and in situ experimentation.

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TEM sample preparation

TEM sample preparation is considered to be one of the most critical tasks in materials science research. However, it is also one of the most challenging and time-consuming. The latest technological innovations of DualBeam technology, along with our comprehensive software solutions and application expertise, enable fast and easy preparation of site-specific, high-quality S/TEM (scanning/transmission electron microscopy) samples for a wide range of materials. Thermo Scientific AutoTEM Software adds the capability for fully automated, unattended in situ TEM sample preparation, significantly increasing throughput and bringing you expert-level results regardless of your experience. Learn more about TEM sample prep.

3D Structural analysis

When combined with Thermo Scientific Auto Slice & View Software, DualBeam instruments provide 3D insight into sample structure by selectively removing (milling) the material for subsurface characterization. Digital reconstruction generates multi-modal 3D datasets that can consist of a variety of signals, including backscattered electron (BSE) imaging for maximum materials contrast, energy dispersive spectroscopy (EDS) for compositional information, and electron backscatter diffraction (EBSD) for microstructural and crystallographic information.

The SEM capability of DualBeam instruments offers nanoscale details across a wide range of working conditions, from structural information obtained at 30 keV in STEM mode to charge-free, detailed surface information at lower energies. With unique in-lens detectors, DualBeam systems are designed for simultaneous acquisition of angular/energy-selective secondary-electron and BSE data. Fast, accurate, and reproducible results are provided by our unique SEM column design, which features fully automated lens alignments.

Large-volume, millimeter-scale characterization

Thermo Scientific TriBeam systems are (plasma) FIB-SEM instruments combined with a femtosecond laser for ultrafast material removal and millimeter-scale 3D characterization with nanometer resolution. Learn more about TriBeam instruments. 

Nanoprototyping

As technology continues to miniaturize, the demand for nanoscale devices and structures is ever increasing. The challenge of converting the latest ideas and designs into valuable assets only continues to grow, and significant technical and financial barriers need to be overcome for successful prototyping of nanoscale devices.

Standard nanofabrication batch processes involve the combined use of different machines for each pattern layer. These instruments might include a spin coater for resist application, a lithography tool, wet chemistry for resist development, a plasma cleaner, and deposition or etching equipment for pattern transfer. The use of so many distinct tools results in a costly and time-consuming prototyping process. As researchers push nanotechnology towards smaller dimensions, these established procedures and recipes often no longer keep pace with the demands of rapid development.

Thermo Fisher Scientific offers a smart and efficient way of turning nanoscale designs into reality. The nanopatterning capabilities of our FIB-SEM systems can substantially reduce research and development time. Rapid prototyping with the FIB enables functionality testing before the final device layout is established for batch fabrication. Beam-induced deposition of different materials can be combined with FIB milling without the need for additional aligning lithography steps; patterns can be directly added to deposited structures or existing patterns can be modified. The final patterned substrates are immediately available for further processing or characterization. Together, these produce a robust prototyping workflow that enables you to quickly design, create, and inspect micro- and nanoscale functional prototype devices.

Electron Microscopy

Focused Ion Beam Scanning Electron Microscopes

FIB SEM instruments for automated structural analysis, TEM sample preparation, and nano-prototyping.

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Life Sciences

 

Materials Science

 

Semiconductors


Techniques

Life Sciences

 

Materials Science

 

Semiconductors


Tundra Cryo-TEM

  • Structural information at biologically relevant resolution
  • Space efficient and cost effective
  • Easy, iterative sample optimization
  • Unique AI algorithms for streamlined data collection

Krios G4 Cryo-TEM

  • Improved ergonomics
  • Fits more easily into new and existing labs
  • Maximized productivity and automation
  • Best image quality for high-resolution 3D reconstruction

Spectra Ultra TEM

  • New imaging and spectroscopy capabilities on the most beam sensitive materials
  • A leap forward in EDX detection with Ultra-X
  • Column designed to maintain sample integrity

Spectra 300 TEM

  • Highest-resolution structural and chemical information at the atomic level
  • Flexible high-tension range from 30-300 kV
  • Three lens condenser system

Spectra 200 TEM

  • High-resolution and contrast imaging for accelerating voltages from 30-200 kV
  • Symmetric S-TWIN/X-TWIN objective lens with wide-gap pole piece design of 5.4 mm
  • Sub-Angstrom STEM imaging resolution from 60 kV-200 kV

Glacios Cryo-TEM

  • Flexible Accelerating Voltage 80-200 kV
  • Industry-leading Autoloader for cryogenic sample manipulation
  • Small footprint
  • Enhanced ease-of-use

Talos Arctica TEM

  • Increased data acquisition speed
  • High data with robotic sample handling & automated loading
  • Unattended platform operation and automated data acquisition
  • Low cost of ownership with remote diagnostics and preventive service

Metrios AX TEM

  • Automation options to support quality, consistency, metrology, and reduced OPEX
  • Leverages machine learning for superior autofunctions and feature recognition
  • Workflows for both in-situ and ex-situ lamella preparation

Themis ETEM

  • Precise control and knowledge of sample temperature
  • Improved sample stability, navigation, and assisted sample drift correction in x, y, and z axes
  • Advancing high-quality imaging and movie acquisition functions

Talos L120C TEM

  • Increased stability
  • 4k × 4K Ceta CMOS camera
  • TEM magnification range from 25–650 kX
  • Flexible EDS analysis reveals chemical information

Talos F200i TEM

  • High-quality, high-resolution (S)TEM imaging and flexible EDS
  • Available with high-resolution, high-brightness (cold) field emission guns
  • Available with Dual EDS for highest analytical throughput

Talos F200S TEM

  • Precise chemical composition data
  • High-performance imaging and precise compositional analysis for dynamic microscopy
  • Features Velox Software for fast and easy acquisition and analysis of multimodal data

Talos F200X TEM

  • High-quality, high-resolution (S)TEM imaging and accurate EDS
  • Available with high-resolution, high-brightness (cold) field emission gun
  • Available with in-column Super-X G2 EDS with ultimate cleanliness

Talos F200C TEM

  • Flexible EDS analysis reveals chemical information
  • High-contrast, high-quality TEM and STEM imaging
  • Ceta 16 Mpixel CMOS camera provides large field of view and high read-out speed

ExSolve WTP DualBeam

  • Can prepare site-specific, 20 nm thick lamellae on whole wafers up to 300 mm in diameter
  • Addresses needs requiring automated, high-throughput sampling at advanced technology nodes

Helios 5 EXL DualBeam

  • Low-voltage performance for high sample preparation quality
  • Ultra-high-resolution immersion-lens field-emission SEM column
  • Automated handling of 300 mm FOUP with EFEM (GEM300 compliant)

Helios 5 DualBeam

  • Fully automated, high-quality, ultra-thin TEM sample preparation
  • High throughput, high resolution subsurface and 3D characterization
  • Rapid nanoprototyping capabilities

Helios 5 PFIB DualBeam

  • Gallium-free STEM and TEM sample preparation
  • Multi-modal subsurface and 3D information
  • Next-generation 2.5 μA xenon plasma FIB column

Helios 5 Hydra DualBeam

  • 4 fast switchable ion species (Xe, Ar, O, N) for optimized PFIB processing of a widest range of materials
  • Ga-free TEM sample preparation
  • Extreme high resolution SEM imaging

FIB-SEM and Laser Ablation

  • All tree beams have same coincident point for accurate and repeatable cut placement
  • Millimeter-scale cross sections with up to 15,000x faster material removal than a typical FIB
  • Statistically relevant deep subsurface and 3D data analysis

Aquilos 2 Cryo-FIB

  • Automation enables production of multiple lamellas
  • Target and extract your structure of interest with lift-out nano-manipulator
  • 3D visualization for high-resolution tomography

Scios 2 DualBeam

  • Full support of magnetic and non-conductive samples
  • High throughput subsurface and 3D characterization
  • Advanced ease of use and automation capabilities

Axia ChemiSEM

  • Live quantitative elemental mapping
  • High fidelity scanning electron microscopy imaging
  • Flexible and easy to use, even for novice users
  • Easy maintenance

Verios 5 XHR SEM

  • Monochromated SEM for sub-nanometer resolution over the full 1 keV to 30 keV energy range
  • Easy access to beam landing energies as low as 20 eV
  • Excellent stability with piezo stage as standard

Quattro ESEM

  • Ultra-versatile high-resolution FEG SEM with unique environmental capability (ESEM)
  • Observe all information from all samples with simultaneous SE and BSE imaging in every mode of operation

Prisma E SEM

  • Entry-level SEM with excellent image quality
  • Easy and quick sample loading and navigation for multiple samples
  • Compatible with a wide range of materials thanks to dedicated vacuum modes

Apreo 2 SEM

  • High-performance SEM for all-round nanometer or sub-nanometer resolution
  • In-column T1 backscatter detector for sensitive, TV-rate materials contrast
  • Excellent performance at long working distance (10 mm)

VolumeScope 2 SEM

  • Isotropic 3D data from large volumes
  • High contrast and resolution in high and low vacuum modes
  • Simple switch between normal SEM use and serial block-face imaging

Phenom Pharos G2 Desktop FEG-SEM

  • FEG source with 1 - 20 kV acceleration voltage range
  • <2.0 nm (SE) and 3.0 nm (BSE) resolution @ 20 kV
  • Optional fully integrated EDS and SE detector

Phenom XL G2 Desktop SEM

  • For large samples (100x100 mm) and ideal for automation
  • <10 nm resolution and up to 200,000x magnification; 4.8 kV up to 20 kV acceleration voltage
  • Optional fully integrated EDS and BSE detector

Phenom ParticleX Battery Desktop SEM

  • Versatile solution for high-quality, in-house analysis
  • Automated system and analysis of multiple samples
  • Testing 10x faster

Phenom ProX G6 Desktop SEM

  • High performance desktop SEM with integrated EDS detector
  • Resolution <6 nm (SE) and <8 nm (BSE); magnification up to 350,000x
  • Optional SE detector

Phenom Pro G6 Desktop SEM

  • High performance desktop SEM
  • Resolution <6 nm (SE) and <8 nm (BSE); magnification up to 350,000x
  • Optional SE detector

Phenom Pure G6 Desktop SEM

  • Entry level desktop SEM
  • Resolution <15 nm; magnification up to 175,000x
  • Longlife CeB6 source

Phenom Perception GSR Desktop SEM

  • Dedicated automated GSR desktop SEM
  • Resolution <10 nm; magnification up to 200,000x
  • Longlife CeB6 source

Phenom ParticleX AM Desktop SEM

  • Versatile desktop SEM with automation software for Additive Manufacturing
  • Resolution <10 nm; magnification up to 200,000x
  • Optional SE detector

Phenom ParticleX TC Desktop SEM

  • Versatile desktop SEM with automation software for Technical Cleanliness
  • Resolution <10 nm; magnification up to 200,000x
  • Optional SE detector

Phenom ParticleX Steel Desktop SEM

  • SEM and EDS integrated
  • Ease of use
  • Sub-micrometer inclusions

ELITE System

  • Completely non-destructive
  • Quickly identifies defective component on assembly board for accurate dispositioning
  • Localizes defect in x-y with micrometer accuracy, with depth location accurate to 20 µm

Hyperion II System

  • Atomic Force Probing
  • Localize transistor faults
  • Integrated PicoCurrent (CAFM)

nProber IV System

  • Localize transistor and BEOL faults
  • Thermal nanoprobing (-40°C to 150°C)
  • Semi-automated operation

Meridian S System

  • Fault Diagnostic with Active Probe Technology
  • Static laser stimulation (SLS / OBIRCH) and photon emission options
  • Supports both micro-probing and probe card device stimulation

Meridian WS-DP System

  • High-sensitivity, low-noise, low-voltage photon emission detection with broadband DBX or InGaAs camera systems
  • Multi-wavelength laser scanning microscope for scan chain analysis, frequency mapping, transistor probing and isolation of faults

Meridian 7 System

  • Dynamic Optical Fault Isolation for 10nm node and below
  • High resolution visible and Infrared light
  • High-yield sample preparation to 5μm widely available

Meridian IV System

  • High sensitivity extended-wavelength DBX photon emission detection
  • Standard InGaAs photon emission detection
  • Laser Scanning Microscope with multiple wavelength options

Centrios Circuit Edit System

  • Superior image / milling resolution
  • Enhanced milling precision and control
  • Built on the Thermo Scientific Helios DualBeam platform

Centrios HX Circuit Edit System

  • Cutting-edge circuit editing for advanced semiconductor nodes with the latest FIB technology
  • Unparalleled milling precision and control with low landing energy to preserve sensitive circuits
  • Advanced navigation and ion beam placement accuracy

MK.4TE ESD and Latch-Up Test System

  • Rapid-relay-based operations—up to 2304 channels
  • Advanced device preconditioning with six separate vector drive levels
  • Fully compliant Latch-Up stimulus and device biasing

Orion3 Electrostatic Discharge Tester

  • Charged device model testing
  • Dual high resolution color cameras
  • Test densities to less than 0.4mm pitch

Celestron Test System

  • Wafer and package level TLP testing
  • High current TLP pulse generato
  • Can be interfaced with semiautomatic probers
  • Intuitive software for control and report generation

Pegasus ESD Test System

  • Testing per the latest industry standards
  • True system level ESD 150pF/330Ω network
  • 2 pin connection via wafer probes to any device

HeliScan microCT

  • Advanced helical scanning and iterative reconstruction technology
  • High resolution x-ray source (below 400 nm)
  • Process, analyze, and visualize samples

Nexsa

  • Micro-focus X-ray sources
  • Unique multi-technique options
  • Dual-mode ion source for monoatomic & cluster ion depth profiling

K-Alpha

  • High resolution XPS
  • Fast, efficient, automated workflow
  • Ion source for depth profiling

ESCALAB QXi XPS

  • High spectral resolution
  • Multi-technique surface analysis
  • Extensive sample preparation and expansion options

Vitrobot System

  • Fully Automated Sample vitrification
  • Blotting Device
  • Semi-Automated Grid Transfer
  • High Sample Throughput

Amira Software

  • Support for multi-data/view/channel
  • Interactive high-quality visualization
  • Machine Learning-based segmentation
  • Intuitive recipe creation

Athena Software

  • Ensure traceability of images, data, metadata and experimental workflows
  • Simplify your imaging workflow
  • Improve collaboration
  • Secure and manage data access

Auto Slice and View 4.0 Software

  • Automated serial sectioning for DualBeam
  • Multi-modal data acquisition (SEM, EDS, EBSD)
  • On-the-fly editing capabilities
  • Edge based cut placement

AutoScript 4 Software

  • improved reproducibility and accuracy
  • Unattended, high throughput imaging and patterning
  • Supported by Python 3.5-based scripting environment

AutoTEM 5 Software

  • Fully automated in situ S/TEM sample preparation
  • Support of top-down, planar and inverted geometry
  • Highly configurable workflow
  • Easy to use, intuitive user interface

Avizo Software

  • Support for multi-data/multi-view, multi-channel, time series, very large data
  • Advanced multi-mode 2D/3D automatic registration
  • Artifact reduction algorithms

Smart EPU Software

  • Microscope-embedded solution for single particle acquisition
  • Optimized for high-throughput particle collection, providing real-time image analysis
  • Includes components for scheduling, data acquisition, and decision algorithms

Embedded CryoSPARC Live

  • Real-time, multidimensional feedback on sample quality and instrument settings
  • Adjust imaging and processing based on real-time information
  • Fully integrated with Smart EPU Software

iFast Software

  • Macro recorder for faster recipe creating
  • Runner for unattended overnight operation
  • Alignment tools: Image recognition and edge finding

Inspect 3D Software

  • Image processing tools and filters for cross-correlation
  • Feature tracking for image alignment
  • Algebraic reconstruction technique for iterative projection comparison

Maps Software

  • Acquire high-resolution images over large areas
  • Easily find regions of interest
  • Automate image acquisition process

NEXS Software

  • Auto-syncs position/magnification between NEXS and Circuit Edit system for a more seamless user experience
  • Connects to most Thermo Scientific tools used for EFA, PFA and Circuit Edit space

Pergeos Software
Rocks and Minerals

  • Visualize, process, and analyze rock imagery data
  • Perform multi-scale imaging analysis from pore to core
  • Calculate geological and petrophysical properties

Tomography 5 Software

  • Automated multi-site batch tomography
  • Automatic cassette mapping
  • Dose symmetric tilt scheme for optimal electron dose
  • Fully integrated with Selectris Imaging Filters

Velox Software

  • An experiments panel on the left side of the processing window.
  • Live quantitative mapping
  • Interactive detector layout interface for reproducible experiment control and setup

3D Reconstruction

  • Intuitive user interface, maximum employability
  • Intuitive fully automated user interface
  • Based on 'shape from shading' technology, no stage tilt required

AsbestoMetric

  • Automated tool for image acquisition, fiber detection and reporting
  • Assisted EDX analysis with fiber revisiting
  • ISO standard report on asbestos analysis

Elemental Mapping

  • Fast and reliable information on the distribution of elements within the sample or the selected line
  • Easily exported and reported results

FiberMetric

  • Save time by automated measurements
  • Fast and automated collection of all statistical data
  • View and measure micro and nano fibers with unmatched accuracy

Nanobuilder

  • CAD-based prototyping
  • Fully automated job execution, stage navigation, milling, and deposition
  • Automated alignment and drift control

ParticleMetric

  • Integrated software for online and offline analysis
  • Correlating particle features such as diameter, circularity, aspect ratio and convexity
  • Creating image datasets with Automated Image Mapping

Phenom Programming Interface

  • Customize your SEM to fit your workflow
  • Increase efficiency and save time with automated processes
  • Control imaging settings and stage navigation

PoroMetric

  • Correlate pore features such as area, aspect ratio, major and minor axis
  • Acquire images directly from the Desktop SEM
  • Statistical data with high-quality images

ProSuite

  • Automated collection of images
  • Real-time remote control
  • Standard applications included: Automated Image Mapping + Remote User Interface

Quartz PCI/CFR

  • SEM imaging traceability compliant with 21 CFR Part 11
  • Compatible with the Phenom XL and Phenom Pro desktop SEMs
  • Windows 10 64-bit operating system support

μHeater

  • Ultra-fast heating solution for in situ high resolution imaging
  • Fully integrated
  • Temperatures up to 1200 °C

μPolisher

  • Potential to enable large number of novel, unexplored applications
  • Very low energy milling
  • Small spot size for precise local surface treatment

Selectris and Selectris X Imaging Filters

  • Designed for high stability and atomic resolution imaging
  • Straightforward operation
  • Paired with the latest generation Thermo Scientific Falcon 4 Direct Electron Detector

Ceta D Camera

  • Optimum performance at any high tension (20–300 kV)
  • Compatible with post-column filters and spectrometers
  • Movie acquisition for dynamic studies

Falcon 4i Detector

  • High thorughput for more images per hour
  • Unsurpassed imaging quality with high DQE
  • Lossless data compression with EER

Charge Reduction Sample Holder

  • Up to 8 times higher magnification
  • Faster sample preparation
  • Non conductive samples can be imaged in their natural state

Electrical Feedthrough Sample Holder

  • Connect electrical probes to the sample for in situ measurements
  • Sample can be height adjusted from 0–25 mm manually
  • Measurements of probe currents

Eucentric Sample Holder

  • Eucentric tilting and compucentric rotation on a desktop SEM
  • Fast time-to-image with sample loading < 1 minute
  • Real-time 3D sample visualization module

Filter Inserts

  • Filter residue analysis and asbestos analysis
  • Available in two models which support 47 mm (1.85 inch) and 25 mm (1 inch) filters
  • Use on Phenom Desktop SEM

Metallurgical Sample Holder

  • Designed to support resin-mounted samples
  • Preferred solution for metallurgy and when working with inserts
  • Sample size up to 32 mm diameter and 30 mm height

Micro Tool Sample Holder

  • Quick and fast clamping
  • Tilting and rotation allow for easy sample positioning
  • No extra tooling required for sample loading

Motorized Tilt & Rotation Sample Holder

  • Tilt range -10° to +45°
  • Continuous 360° compucentric rotation
  • Controlled by dedicated Motion Control ProSuite application

Nebula Particle Disperser

  • Standard method for uniform dry powder dispersion
  • Avoids particle clusters
  • Used with Phenom Desktop SEM

Resin Mount Inserts

  • A unique sample holder concept
  • Available in 3 models for supporting standard sized samples of 25 mm (~1 inch), 32 mm (~1 ¼ inch) and 40 mm (~1 ½ inch) diameter

Standard Sample Holder

  • Compact stage allowing analysis of samples of up to 100 mm x 100 mm
  • Can be extended with 3 types of resin or metallurgical mount inserts
  • Used with Phenom Desktop SEM

Sample Holder Inserts

  • Faster cross-sectional imaging of coatings and multilayer samples
  • Easy clamping without the need for screws or extra tools
  • Eliminates the need for screws and tools to clamp the sample

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Tensile Sample Holder

  • Determine batch quality
  • Determine manufacturing consistencys
  • Aid the design process

Temperature Controlled Sample Holder

  • Temperature range -25 °C to +50 °C
  • Temperature accuracy ±1.5 °C
  • Temperature display resolution 0.1 °C



Resources

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3D reconstruction of an automotive oil filter casing, acquired with the Helios Hydra DualBeam and Auto Slice & View 4 Software for automated serial sectioning. Horizontal field width = 350 µm.
3D reconstruction of an automotive oil filter casing, acquired with the Helios Hydra DualBeam and Auto Slice & View 4 Software for automated serial sectioning. Horizontal field width = 350 µm.
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