Copper silicide, 99.5% (metals basis)

Copper silicide thin film is used for passivation of copper-based chips, where it serves to suppress diffusion and electromigration and serves as a diffusion barrier. It is involved in the direct process, the industrial route to organosilicon compounds.

This Thermo Scientific Chemicals brand product was originally part of the Alfa Aesar product portfolio. Some documentation and label information may refer to the legacy brand. The original Alfa Aesar product / item code or SKU reference has not changed as a part of the brand transition to Thermo Scientific Chemicals.