Copper etchant - FAQs

Copper etchant has an etch rate of 1 mil/minute at 40 degrees C (etches 1 oz copper in 90 seconds).

Undercutting of the etchant can be reduced by increasing the rate of stirring or agitation.

No, it is a ready-to-use solution. Dilution will only be necessary if you want to reduce the etch rate.

The etch rate of the etchant can be reduced by adding 1 part deionized water to 2 parts etchant. This will reduce the etch rate approximately 50%.

The etch rate of the etchant will be increased by increasing the rate of stirring or agitation.