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Fluids used in semiconductor manufacturing may require rigorous control of particulates, gels, dissolved gases, and trace metal ions across the entire fabrication flow from incoming water treatment and ultrapure water (UPW) generation to high-purity chemical delivery, chemical mechanical planarization (CMP) slurry management, and point-of-use filtration. Even sub-ppb contaminants at the wafer surface can induce defects. As device geometries shrink toward sub-5 nm nodes, particulate count, metal ion concentrations, and dissolved gas levels that were acceptable at earlier nodes can become defect-generating. The wide range of process fluids often requires filtration technologies to address chemical compatibility, extractables and leachables, and contaminant retention.
Learn about our liquid filtration solutions for semiconductors and dissolved gas control, as listed below by process application.
Semiconductor manufacturing often requires consistent contamination control across three technical capability areas: particle and nanoparticle removal, dissolved gas control, and metal ion reduction.
The industrial filtration portfolio includes products to help address particle filtration, nanoparticle removal, metal ion reduction, and dissolved gas control requirements encountered in semiconductor and microelectronics manufacturing.
Product links on this page currently direct to Solventum.com. Product information will soon be available on Thermofisher.com as part of our ongoing integration.
Semiconductor liquid filtration is a set of process-specific liquid purification disciplines used throughout semiconductor fabrication, distinct from general industrial filtration in its tolerance for contamination. The principal disciplines are particle and nanoparticle removal from UPW, high-purity chemicals, and CMP slurries. Residual contamination at the wafer surface translates directly to device defects and yield loss.
Key filtration technologies and their primary process applications include:
UPW rinses wafer surfaces and cleans components after chemical exposure throughout semiconductor manufacturing. Residual particles, metal ions, TOC, bacteria, or dissolved gases that reach the wafer surface can introduce defects that affect device performance and yield. UPW quality requirements tighten as technology nodes advance, and multi-stage filtration combined with dissolved gas control is required throughout UPW production and distribution to maintain specification.
CMP filtration may control LCPs in slurry. Oversized particles cause micro-scratches and surface defects that reduce yield and increase rework costs. Filtration applied at the blending station, day tank, distribution loop, and CMP tool POU helps maintain the slurry particle-size distribution within specification. For application-specific guidance on CMP slurry filtration, connect with a Thermo Fisher Scientific specialist.
Intended use of the products mentioned on this page vary. For specific intended use statements, please refer to the Instructions for Use for the product.