PFIB-SEM | Helios MX1 | Semiconductor Analysis Resources

Resources for semiconductor analysis with the Helios MX1 PFIB-SEM

Welcome to our dedicated resource page for the latest insights into fab process control with the Thermo Scientific Helios MX1 PFIB-SEM. Whether you're an experienced professional or new to the field, this is your go-to destination for up-to-date information on emerging trends and technologies. Our resources are designed to help you navigate the complex world of metrology and defect analysis with ease, offering in-depth technical discussions and practical guidance. Take a moment to explore and discover the valuable content we offer.

Helios MX1 PFIB-SEM videos

Datasheets

Helios MX1 PFIB-SEM datasheet

The Helios MX1 PFIB-SEM is designed for acquiring rapid through volume critical dimension profiles and defect analysis of 300 mm wafers. Featuring a multi-ion source plasma FIB, ultra-high-resolution SEM, and powerful automation, it is well-suited for memory, logic, and advanced packaging applications.

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Helios MX1 PFIB-SEM publications

Blog: Helios MX1 PFIB-SEM: Addressing fab process control needs with plasma FIB technology

Read the viewpoint from our VP/GM Semiconductor on how Helios MX1 PFIB-SEM plasma FIB technology can address unmet needs in semiconductor fabs.

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Blog: Advanced Semiconductor Packaging: Bringing Stacked Chips Together

Learn more about the challenges in advanced packaging and how our electrical and physical failure analysis systems support fault isolation and defect characterization.