Lab Vacuum Oven

Drying under vacuum allows liquids to evaporate at temperatures below the regular boiling point. Benefits include:

  • Faster drying, since liquids evaporate at lower temperatures.
  • Dry thermic instable materials very gently, at low temperatures (great for pharma/food drying applications).
  • Reduce capillary forces and completely dry intermediate or finished products (great for electronics).
  • Dry under inert gas atmosphere, e.g. to avoid oxidation processes. 

Offered with various temperature ranges and sizes, Thermo Scientific vacuum ovens are designed with safety, reliability and efficiency in mind—and offer features that tailor to your specific applications. Choose from several different product lines - from basic to high end.


Good – better – best approach, with feature and control options.

Vacutherm Vacuum Oven
Precise, fast heating and heat transfer minimizes operation time. Compliant with the highest level of requirements for heating applications under a vacuum. 
Lindberg Blue

Microprocessor control with overtemperature protection for safety, this multipurpose line covers most heating and drying applications under vacuum which require good temperature performance.

Hi Temp
Overtemperature protection for peace of mind at a high degree. Standard line with basic control, good for standard work.
Vacuum
Entry level option for everyday drying and heating applications in a reduced atmosphere. Basic controls with choice of hydraulic bimetallic thermostat and LED. 

Select the oven that's best for your application

 

Vacutherm

Lindberg/Blue M

Hi-Temp Models

Standard Models

 
Temperature range Ambient
+10/+15° to 200°/300°/400°C  
Ambient +6° to 260°C Ambient +10°/50° to 280°C Ambient +5° to 220°C 
Available sizes 25/53/128L
(0.88/1.87/4.52 cu. ft.)
18.6/42.5/127.4L
(0.65/1.5/4.5 cu. ft.)
18.4/42.4L
(0.65/1.5 cu. ft.)
12.5/19.8/65L
(0.44/0.7/2.3 cu. ft.)
Features PID control, digital display, analog control with dial thermometer,  overtemperature cut-out, inert gas connection (on large models) PID control, adjustable overtemperature protection, inert gas connection Electronic control, fixed overtemperature protection, on/off timer (large models only), inert gas connection Analog control with dial thermometer,  overtemperature cut-out, inert gas connection (on large models)
Sample applications
  • Gentle drying of heat-sensitive materials
  • Fast drying
  • Residue-free drying of intricately designed parts
  • Elimination of oxidation associated with heat treatment
  • Targeted recovery of degassed products
  • Drying of powders
  • Drying at high temperatures
  • Drying
  • Curing
  • Outgassing
  • Aging
  • Process control
  • Heating and drying in inert gas atmosphere
  • Higher temperature drying / heating
  • General drying
  • Conditioning
  • Curing
  • Desiccating
  • Annealing
  • Moisture tests
  • Drying
  • Curing
  • Vacuum embedding
  • Plating applications

Support

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