The Thermo Scientific Helios G4 EXL is the newest generation of Thermo Fisher Scientific's full-wafer DualBeam (FIB-SEM) system and has been designed to satisfy 7nm node and beyond TEM sample preparation challenges. This system is capable of producing sub 10nm thick lamella samples in exactly the right location to capture point defects and isolate pre-defined structures for monitoring.

This system includes the Thermo Scientific Phoenix focused ion beam column that enables revolutionary low kV performance for bleeding edge TEM sample preparation. The high-performance Elstar electron column now includes the same UC monochromatic technology found on small chamber systems for improved resolution and TEM sample end-pointing.     

Significant automation enhancements make generation of ultrathin TEM samples routine and consistent. Thermo Scientific iFast automation software combines wafer and defect navigation with recipe definition and execution in a single, fullyintegrated program, ensuring efficiency and consistency among operators with varying levels of expertise. In situ TEM sample preparation has been greatly simplified with Thermo Scientific Auto LX Software, a technology for automated sample liftout and placement on the TEM grid. Auto LX Software includes workflows for both planar and inverted TEM sample preparation. Additionally, a fully automated ex situ TEM sample preparation workflow allows 50nm thin samples with tight thickness control and precise lamella placement.

Key Features

Available with fab compatible Automated FOUP Loader (AFL) option 

An optional Automated FOUP Loader (AFL) allows the Helios G4 EXL DualBeam system to be located inside the semiconductor wafer fab, where it can be used to extract ultrathin samples of targeted structures and defects for examination in a high-resolution transmission electron microscope (TEM). Moving the Helios G4 EXL inside the fab and closer to the wafer process line (near-line) can deliver critical information up to three times faster than laboratory-based analysis of cleaved wafer pieces, enabling acceleration of the development of new processes and the yield ramp to high-volume production.

iFast Semiconductor Wafer Navigation

Navigation for semiconductor applications has been greatly enhanced to allow workflows to run in a more automated, robust and routine manner. Defect Navigation has been integrated into the iFast framework to allow for efficient processing of sites imported via defect files. Wafer maps & site plans can be constructed in iFast and each site processed via automated recipes. Cell navigation functionality previously delivered through a stand-alone application has been integrated into iFast for improved ease of use.Our proprietary Cell Navigator software automatically locates the proverbial needle in a haystack. This software has the ability to navigate to a single SRAM bit in a 50nm lateral field.

MultiChem Gas Delivery System

The most advanced beam chemistry solution for DualBeams provides more precisely controlled deposition and etching capabilities and can be utilized with automated applications. The MultiChem is a compact 6-injection line gas delivery system with advanced, integrated process control capabilities. Individual heating and gas flow control valves on each injection line are used to precisely manage the quantity of gas injected. Motorized injection needle and saved position presets allow a user to position the needle accurately for optimized, reproducible gas delivery on the sample surface.

EasyLift NanoManipulator

Ther Thermo Scientific EasyLift's low-drift, high-precision movements allow simple and consistent creation of traditional TEM lamella or ultra-thin lamella using the inverted thinning technique. The EasyLift is integrated with the microscope's xT software to provide a simple, intuitive method for lift-out and transfer of TEM samples to a grid, all within the DualBeam chamber. Highly accurate and fast motorized rotation makes the EasyLift ideally suited for high speed inverted or plan view sample preparation. Functionality includes simple "click and drag" movement enabled by EasyLift's full integration with the Helios G4 EXL DualBeam's user interface.


Specifications

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Elstar UHR Immersion Lens FESEM Column
  • Elstar electron gun with:
    • Ultra-stable Schottky field emitter gun with UC+ monochromator technology
  • Electron beam resolution:
    • 1.0 nm @ 15 kV
    • 0.9 nm @ 1 kV
  • Electron source lifetime: 12 months

Phoenix Ion Column

  • Superior high current performance, with up to 65 nA max beam current
  • Lowest voltage (500 V) for ultimate sample preparation quality
  • Ion beam resolution @ coincident point:
    • 4.0 nm @ 30 kV using preferred statistical method
  • Ion source: 1000 hours guaranteed

Detectors

  • Elstar in-lens SE detector (TLD-SE)
  • Elstar in-lens BSE detector (TLD-BSE)
  • High performance ion conversion and electron (ICE) detector for secondary ions (SI) and electrons (SE)

Sample Handling

  • 300mm five-axis stage
  • Automated FOUP Loader for automated loading of 300mm wafers
    • ISO Class 1 EFEM with pre-aligner
    • GEM300 factory automation functionality
Key Accessories
  • EasyLift integrated in situ TEM lamella sample lift-out
  • Beam chemistry
    • Range of deposition and etch chemistries
    • Chemistries can be delivered with MultiChem and/or conventional gas injection
  • Optical microscope with 920um FOV
  • 30 kV STEM detector with BF/DF/HAADF segments (option)
  • Oxford EDS (option)
Software Options
  • iFast Semiconductor Wafer Navigation
    • Auto LX for automated In-situ TEM sample liftout (option)
    • Integrated defect navigation based on KLARF 1.2 and 1.8 standards
    • User defined wafer maps & site plans
  • Stand-alone cell navigator (MultiChem compatible)
  • CAD navigation
  • Thermo Scientific Microscope Data Services Software
    • Web database program that provides an intuitive view into the status and performance of processes run on the Helios
  • G4 EXL with iFast software.
  • Thermo Scientific RAPID remote diagnostic support
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Applications

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Semiconductor Pathfinding and Development

Advanced electron microscopy, focused ion beam, and associated analytical techniques for identifying viable solutions and design methods for the fabrication of high-performance semiconductor devices.

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Yield Ramp and Metrology

We offer advanced analytical capabilities for defect analysis, metrology, and process control, designed to help increase productivity and improve yield across a range of semiconductor applications and devices.

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Semiconductor Failure Analysis

Increasingly complex semiconductor device structures result in more places for failure-inducing defects to hide. Our next-generation workflows help you localize and characterize subtle electrical issues that affect yield, performance, and reliability.

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Physical and Chemical Characterization

Ongoing consumer demand drives the creation of smaller, faster, and cheaper electronic devices. Their production relies on high-productivity instruments and workflows that image, analyze, and characterize a broad range of semiconductor and display devices.


Techniques

Semiconductor TEM Imaging and Analysis

Thermo Fisher Scientific transmission electron microscopes offer high-resolution imaging and analysis of semiconductor devices, enabling manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yields.

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TEM Metrology

Advanced and automated TEM metrology routines deliver significantly greater precision than manual methods. This allows users to generate large amounts of statistically relevant data, with sub-angstrom-level specificity, that is free of operator bias.

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Sample Preparation of Semiconductor Devices

Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.

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Semiconductor TEM Imaging and Analysis

Thermo Fisher Scientific transmission electron microscopes offer high-resolution imaging and analysis of semiconductor devices, enabling manufacturers to calibrate toolsets, diagnose failure mechanisms, and optimize overall process yields.

Learn more ›

TEM Metrology

Advanced and automated TEM metrology routines deliver significantly greater precision than manual methods. This allows users to generate large amounts of statistically relevant data, with sub-angstrom-level specificity, that is free of operator bias.

Learn more ›

Sample Preparation of Semiconductor Devices

Thermo Scientific DualBeam systems provide accurate TEM sample preparation for atomic-scale analysis of semiconductor devices. Automation and advanced machine learning technologies produce high-quality samples, at the correct location, and a low cost per sample.

Learn more ›

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