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Repeatable, ultra-high-volume semiconductor TEM preparation
The Thermo Scientific Helios 6 HXS FIB-SEM provides top-tier automation and accuracy for high-volume semiconductor TEM preparation through several advancements. It features automated navigation and precise positioning for TEM preparation site setup, along with automated thinning enhanced by machine learning-assisted endpointing. Additionally, it includes AI training capability for fine-tuning and refining automation models to specific device types, automated material handling, and automated data connectivity. The Helios 6 HXS supports TEM sample preparation as part of the Thermo Scientific Vulcan Automated Lab.
Equipped with innovative hardware and Thermo Scientific AutoTEM 6 Professional Software, the Helios 6 HXS FIB-SEM enables fully automated TEM sample preparation, capable of producing sub-20 nm thin lamella with production-grade accuracy. Thermo Fisher Scientific collaborates closely with customers to meet the increasing demand for high-quality TEM sample preparation, keeping pace with advancements in semiconductor technology.
Precise, automated TEM sample preparation for metrology
Proven on a selected group of devices, the automated workflow offers sub-nanometer targeting accuracy for TEM lamella below 20 nm enabled by AI-powered end-pointing techniques, the new Osprey FIB column, and the new fully digital scanning and defection engine. The new engine provides improved cut placement accuracy for FIB activities, with rotational accuracy improved by 10× times compared to its predecessor. Improved orthogonality and magnification consistency for both FIB and SEM systems is also realized.
Robust automation of FIB SEM workflows
Proven on a selected group of devices, the Helios 6 HXS FIB-SEM offers more than 95% robustness for the automated Weld-To-Grid workflow and over 90% robustness for the fully automated thinning workflow to the target thickness. This impressive improvement in automation workflow robustness is attributed to several hardware and software innovations. These include the highly stable Osprey FIB column optimized for low-KV performance, fully automated FIB alignment required for automation workflows, a new Dual Lamella Carrier Holder with improved stability and flipping accuracy, a new Thermo Scientific MultiChem Gas Deposition System with enhanced stability, and the new Thermo Scientific EasyLift NanoManipulator.
Graph highlighting lamella output performance.
Enhanced semiconductor sample handling of TEM lamella
The new Helios 6 HXS EFEM (Equipment Front End Module) is an innovative material handling system designed for the Helios 6 HXS FIB-SEM in the Thermo Scientific Vulcan Automated Lab. This automated sample delivery and loading system enables operator-free loading and unloading of samples for lamella preparation and lamella carriers (LCs), which are used to transport TEM lamella. This system is compatible with E177 5-finger LCs.
Material arrives at the EFEM using the lab AMHS system. This workflow is compatible with an overhead track (OHT) or autonomous mobile robot (AMR). Upon arrival, samples and empty LCs are automatically loaded into the microscope and processed without manual intervention.
After sample preparation is completed, lamella carriers with site-specific TEM lamella are automatically retrieved and sent to the Thermo Scientific Metrios 6S (S)TEM for imaging using the lab AMHS system.
Automated material and grid handling systems for the Vulcan Automated Lab.
Automated FIB SEM sample preparation with data connectivity
Data connectivity facilitates seamless communication between your manufacturing execution system (MES) and the workflow control software, including interfacing with the OHT or AMR material handling system. The workflow control software is used to create sample preparation jobs for the Helios 6 HXS FIB-SEM.
Perform Instrument Service and Support Program from Thermo Fisher Scientific
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