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The Thermo Scientific Scios 3 FIB-SEM is designed for advanced applications in material microstructure characterization, 3D materials analysis, and TEM sample preparation. With advanced FIB technology and innovative automation, the Scios 3 FIB-SEM facilitates precise and efficient sample preparation and analyses even on complex materials. This makes it a powerful tool for researchers seeking detailed insights into materials properties, composition, and structural integrity at the nanometer scale.
The Scios 3 FIB-SEM is highly effective for studying coatings, providing detailed cross-sectional imaging and analysis that is essential for assessing coating thickness, uniformity, and adhesion quality. Auto Cross Section (AXS) Software automates the cross-sectioning and imaging process, enhancing efficiency and ensuring reproducibility. This system is particularly useful for detecting defects and inconsistencies in coatings, which is crucial for quality control and maintenance in industrial applications.
The Scios 3 FIB-SEM possesses a powerful toolset to characterize metals and alloys. Apart from preparation of lamella and 3D reconstruction of material microstructure, it features proprietary in situ experimentation capabilities, including a high-vacuum heating stage that allows you to conduct clean heating experiments up to 1,100°C, minimizing oxidation and ensuring high-quality imaging. It integrates temperature logging with image data, enabling seamless recording of all experimental data, including images and videos. Additionally, the stage enhances analytical performance by improving the backscatter signal for electron backscatter diffraction (EBSD) analysis, allowing for high-quality EBSD maps at temperatures up to 900°C.
From logic and analog circuits to packaged and power devices, even mature technology nodes present unique challenges that require highly capable, flexible FIB-SEM systems to prepare and analyze sub-surface defects, structures, and materials. With (S)TEM preparation, 3D volume acquisition, and cross-sectioning automation platforms, failure analysis labs can maximize their system utilization with unattended sample preparation and support users of different experience levels. The high-resolution SEM column and optimized detection system reveal material contrast of defects and device structures, and when paired with low-kV FIB performance allows for a high success rate in (S)TEM sample polishing and end-pointing.
For Research Use Only. Not for use in diagnostic procedures.