Helios Hydra PFIB-SEM Applications

Complex semiconductor device structures result in more places for defects to hide. Our advanced workflows leverage electrical and physical failure analysis methods to localize, prepare, and identify the root causes of failures. Physical failure analysis relies on destructive, but extremely precise techniques, like S/TEM preparation, cross- sectioning and serial sectioning for large volumes, and even planar deprocessing to reveal the target region for analysis.

Learn more about failure analysis solutions to meet your needs.

Novel materials are investigated at increasingly smaller scales for  maximum control of their physical and chemical properties. Electron  microscopy provides researchers with key insight into a wide variety  of material characteristics at the micro- to nanoscale.

Modern industry demands high throughput with superior quality, a  balance that is maintained through robust process control. SEM and  TEM tools with dedicated automation software provide rapid, multi-scale information for process monitoring and improvement. Quality  control and assurance are essential in modern industry. We offer a  range of EM and spectroscopy tools for multi-scale and multi-modal  analysis of defects, allowing you to make reliable and informed  decisions for process control and improvement.

Discover remarkable insights across length scales, from tissues to proteins. Explore subcellular structures at high resolution through advanced volume EM imaging and generate optimal lamella for subsequent visualization using cryo electron tomography (cryo-ET). Whether you work with cryo-preserved or resin-embedded specimens, the Helios Hydra Plasma-FIB can provide a platform that takes you from 3D tissue structure to lamella preparation and lift-out in a single platform.