The new Thermo Scientific Helios 5 DualBeam builds on the high-performance imaging and analysis capabilities of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of materials science researchers and engineers for a wide range of focused ion beam scanning electron microscopy (FIB-SEM) use cases – even on the most challenging samples. 

The Helios 5 DualBeam redefines the standard in high-resolution imaging with high materials contrast; fast, easy, and precise high-quality sample preparation for S/TEM imaging and atom probe tomography (APT) as well as the high-quality subsurface and 3D characterization. Building on the proven capabilities of the Helios DualBeam family, additional advancements to the new Helios 5 DualBeam were designed to ensure the system is optimized for a variety of manual or automated workflows. Those improvements include:

  • Greater ease-of-use: The Helios 5 DualBeam is the most accessible DualBeam for users of all experience levels. Operator training may be reduced from months to days and the system design is helping all operators to achieve consistent, repeatable results on a wide variety of advanced applications. 
  • Increased productivity: Advanced automation capabilities, increased robustness and stability enhancements in the Helios 5 DualBeam and Thermo Scientific AutoTEM 5 software can significantly increase the sample preparation throughput by allowing unattended and even overnight operation. 
  • Improved time to results: The Helios 5 DualBeam now includes FLASH, a new concept of tuning the image. With conventional microscopes, each time an operator needs to acquire an image, the microscope has to be carefully tuned by iterative alignments. With the Helios 5 DualBeam, a simple gesture across the screen will activate FLASH, which automatically adjusts these parameters. The automatic adjustments can significantly improve throughput, data quality, and simplify the acquisition of high-quality images.

The Thermo Scientific Helios 5 DualBeam is part of the fifth generation of the industry-leading Helios DualBeam family. It is carefully designed to meet the needs of scientists and engineers, combining the innovative Elstar electron column for extreme high-resolution imaging and the high materials contrast with the superior Thermo Scientific Tomahawk Ion Column for the fast, easy, and precise high-quality sample preparation. In addition to the advanced electron and ion optics, the Helios 5 DualBeam incorporates a suite of state of-the-art technologies that enables simple and consistent high-resolution S/TEM and atom probe tomography (APT) sample preparation, as well as the high-quality subsurface and 3D characterization, even on the most challenging samples.

Key Features

High-quality sample preparation

Site-specific sample preparation for S/TEM and APT analysis using the high-throughput Thermo Scientific Tomahawk Ion Column or the Thermo Scientific Phoenix Ion Column with unmatched low-voltage performance.

Fully automated

Fast and easy, fully automated, unattended, multi-site in situ and ex situ TEM sample preparation and cross-sectioning using optional AutoTEM 5 Software.

Shortest time to nanoscale information

For users with any experience level using best-in-class Elstar Electron Column featuring SmartAlign and FLASH technologies.

Next-generation UC+ monochromator technology

Reveal the finest details with the next-generation UC+ monochromator technology with higher current, enabling sub-nanometer performance at low energies.

Complete sample information

Sharp, refined and charge-free contrast obtained from up to six integrated in-column and below-the-lens detectors.

3D analysis

The high-quality, multi-modal subsurface and 3D information with the precise region-of-interest targeting using optional Thermo Scientific Auto Slice & View 4 (AS&V4) Software.

Rapid nanoprototyping

Fast, accurate and precise milling and deposition of complex structures with critical dimensions of less than 10 nm.

Precise sample navigation

Tailored to individual application needs thanks to the high stability and accuracy of the 150-mm piezo stage or the flexibility of the 110-mm stage, as well as the in-chamber Thermo Scientific Nav-Cam Camera.

Artifact-free imaging

Based on integrated sample cleanliness management and dedicated imaging modes such as DCFI and SmartScan Modes.


Specifications

Style Sheet for Products Table Specifications
  Helios 5 CX   Helios 5 UC   Helios 5 UX
Ion optics
  • Tomahawk HT Ion Column with superior high-current performance
  • Ion beam current range: 1 pA – 100 nA
  • Accelerating voltage range: 500 V – 30 kV
  • Two-stage differential pumping
  • Time-of-flight (TOF) correction
  • 15-position aperture strip
  • Max. horizontal field width: 0.9 mm at beam coincidence point
  • Minimum source lifetime: 1,000 hours

Phoenix Ion Column with superior high-current and low-voltage performance

  • Ion beam current range: 1 pA – 65 nA
  • Accelerating voltage range: 500 V – 30 kV
  • Two-stage differential pumping
  • Time-of-flight (TOF) correction
  • 15-position aperture strip
  • Max. horizontal field width: 0.7 mm at beam coincidence point
  • Minimum source lifetime: 1,000 hours
Electron optics

Elstar ultra-high-resolution field emission SEM column with:

  • Magnetic immersion objective lens
  • High-stability Schottky field emission gun to provide stable high-resolution analytical currents

Electron beam resolution

  • At optimum working distance (WD):
    • 0.6 nm at 30 kV STEM
    • 0.6 nm at 15 kV
    • –1.0 nm at 1 kV
    • 0.9 nm at 1 kV with beam deceleration*
  • At coincident point:
    • 0.6 nm at 15 kV
    • 1.5 nm at 1 kV with beam deceleration* and DBS*
 

Elstar extreme high-resolution field emission SEM column with:

  • Magnetic immersion objective lens
  • High-stability Schottky field emission gun to provide stable high-resolution analytical currents
  • UC+ monochromator technology

Electron beam resolution

  • At optimum working distance (WD):
    • 0.6 nm at 30 kV STEM
    • 0.7 nm at 1 kV
    • 1.0 nm at 500 V (ICD)
  • At coincident point:
    • 0.6 nm at 15 kV
    • 1.2 nm at 1 kV
Electron beam parameter space
  • Electron beam current range: 0.8 pA to 176 nA
  • Accelerating voltage range: 200 V – 30 kV
  • Landing energy range: 20 eV – 30 keV
  • Maximum horizontal field width: 2.3 mm at 4 mm WD
 
  • Electron beam current range: 0.8 pA to 100 nA
  • Accelerating voltage range: 350 V – 30 kV
  • Landing energy range: 20 eV – 30 keV
  • Maximum horizontal field width: 2.3 mm at 4 mm WD
Detectors
  • Elstar in-lens SE/BSE detector (TLD-SE, TLD-BSE)
  • Elstar in-column SE/BSE detector (ICD)*
  • Elstar in-column BSE detector (MD)*
  • Everhart-Thornley SE detector (ETD)
  • IR camera for viewing sample/column
  • High-performance in-chamber electron and ion detector (ICE) for secondary ions (SI) and electrons (SE)*
  • Thermo Scientific In-chamber Nav-Cam Camera for sample navigation*
  • Retractable, low-voltage, high-contrast, directional, solid-state backscatter electron detector (DBS)*
  • Retractable STEM 3+ detector with BF/ DF/ HAADF segments*
  • Integrated beam current measurement
Stage and sample
  • Flexible 5-axis motorized stage:
  • XY range: 110 mm
  • Z range: 65 mm
  • Rotation: 360° (endless)
  • Tilt range: -15° to +90°
  • Max sample height: Clearance 85 mm to eucentric point
  • Max sample weight
  • 500g in any stage position
  • Up to 5 kg at 0° tilt (some restrictions apply)
  • Max sample size: 110 mm with full rotation (larger samples possible with limited rotation
  • Compucentric rotation and tilt
 
  • High-precision five-axis motorized stage with Piezo-driven XYR axis:
  • XY range: 150 mm
  • Z range: 10 mm
  • Rotation: 360° (endless)
  • Tilt range: -10° to +60°
  • XY repeatability: 1 μm
  • Max sample height: Clearance 55 mm to eucentric point
  • Max sample weight: 500 g (including sample holder)
  • Max sample size: 150 mm with full rotation (larger samples possible with limited rotation)
  • Compucentric rotation and tilt
Style Sheet for Techniques (LONG VERSION) and Media Gallery Tab
60kV HR-STEM image of highest-quality, ultra-thin lamella.
60 kV high-resolution STEM (HRSTEM) image of a high-quality, ultra-thin lamella (<100> SrTiO3) produced with Helios 5 UX DualBeam.
High-quality TEM lamella produced with Helios DualBeam.
High-quality TEM lamella produced with Helios DualBeam in less than one hour using AutoTEM 5 Software offering easiest and most automated TEM sample preparation workflow.
High-quality, high resolution 3D characterization of a ceramic sample acquired with a Helios DualBeam and reconstructed using Avizo. Data is segmented to analyze the distribution of different phases in the sample. Sample courtesy of KAIST.
Introducing&#x20;Helios&#x20;5&#x20;DualBeam

Introducing Helios 5 DualBeam

The new Thermo Scientific Helios 5 DualBeam builds on the high-performance imaging and analysis capabilities of the industry-leading Helios DualBeam family.

Register for our recorded webinar (~17 minutes) and learn how additional advancements to the new Helios 5 were designed to ensure the system is optimized for a variety of manual or automated workflows.

Register now

60kV HR-STEM image of highest-quality, ultra-thin lamella.
60 kV high-resolution STEM (HRSTEM) image of a high-quality, ultra-thin lamella (<100> SrTiO3) produced with Helios 5 UX DualBeam.
High-quality TEM lamella produced with Helios DualBeam.
High-quality TEM lamella produced with Helios DualBeam in less than one hour using AutoTEM 5 Software offering easiest and most automated TEM sample preparation workflow.
High-quality, high resolution 3D characterization of a ceramic sample acquired with a Helios DualBeam and reconstructed using Avizo. Data is segmented to analyze the distribution of different phases in the sample. Sample courtesy of KAIST.
Introducing&#x20;Helios&#x20;5&#x20;DualBeam

Introducing Helios 5 DualBeam

The new Thermo Scientific Helios 5 DualBeam builds on the high-performance imaging and analysis capabilities of the industry-leading Helios DualBeam family.

Register for our recorded webinar (~17 minutes) and learn how additional advancements to the new Helios 5 were designed to ensure the system is optimized for a variety of manual or automated workflows.

Register now

Applications

Process&#x20;Control_Thumb_274x180_144DPI

Process Control
 

Modern industry demands high throughput with superior quality, a balance that is maintained through robust process control. SEM and TEM tools with dedicated automation software provide rapid, multi-scale information for process monitoring and improvement.

 

Quality&#x20;Control_Thumb_274x180_144DPI

Quality Control
 

Quality control and assurance are essential in modern industry. We offer a range of EM and spectroscopy tools for multi-scale and multi-modal analysis of defects, allowing you to make reliable and informed decisions for process control and improvement.

 

Fundamental&#x20;Materials&#x20;Research_R&amp;D_Thumb_274x180_144DPI

Fundamental Materials Research

Novel materials are investigated at increasingly smaller scales for maximum control of their physical and chemical properties. Electron microscopy provides researchers with key insight into a wide variety of material characteristics at the micro- to nano-scale.

 

S/TEM Sample Preparation

DualBeam microscopes enable the preparation of high-quality, ultra-thin samples for S/TEM analysis. Thanks to advanced automation, users with any experience level can obtain expert-level results for a wide range of materials.

Learn more ›

3D Materials Characterization

Development of materials often requires multi-scale 3D characterization. DualBeam instruments enable serial sectioning of large volumes and subsequent SEM imaging at nanometer scale, which can be processed into high-quality 3D reconstructions of the sample.

Learn more ›

Nanoscale Prototyping

As technology continues to miniaturize, the demand for nanoscale devices and structures is ever increasing. 3D nanoprototyping with DualBeam instruments helps you to quickly design, create, and inspect micro- and nanoscale functional prototypes.

Learn more ›

APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

Learn more ›

Cross-sectioning

Cross sectioning provides extra insight by revealing sub-surface information. DualBeam instruments feature superior focused ion beam columns for high-quality cross sectioning. With automation, unattended high-throughput processing of samples is possible.

Learn more ›

In Situ experimentation

Direct, real-time observation of microstructural changes with electron microscopy is necessary to understand the underlying principles of dynamic processes such as recrystallization, grain growth, and phase transformation during heating, cooling, and wetting.

Learn more ›

Multi-scale analysis

Novel materials must be analyzed at ever higher resolution while retaining the larger context of the sample. Multi-scale analysis allows for the correlation of various imaging tools and modalities such as X-ray microCT, DualBeam, Laser PFIB, SEM and TEM.

Learn more ›

S/TEM Sample Preparation

DualBeam microscopes enable the preparation of high-quality, ultra-thin samples for S/TEM analysis. Thanks to advanced automation, users with any experience level can obtain expert-level results for a wide range of materials.

Learn more ›

3D Materials Characterization

Development of materials often requires multi-scale 3D characterization. DualBeam instruments enable serial sectioning of large volumes and subsequent SEM imaging at nanometer scale, which can be processed into high-quality 3D reconstructions of the sample.

Learn more ›

Nanoscale Prototyping

As technology continues to miniaturize, the demand for nanoscale devices and structures is ever increasing. 3D nanoprototyping with DualBeam instruments helps you to quickly design, create, and inspect micro- and nanoscale functional prototypes.

Learn more ›

APT Sample Preparation

Atom probe tomography (APT) provides atomic-resolution 3D compositional analysis of materials. Focused ion beam (FIB) microscopy is an essential technique for high-quality, orientation, and site-specific sample preparation for APT characterization.

Learn more ›

Cross-sectioning

Cross sectioning provides extra insight by revealing sub-surface information. DualBeam instruments feature superior focused ion beam columns for high-quality cross sectioning. With automation, unattended high-throughput processing of samples is possible.

Learn more ›

In Situ experimentation

Direct, real-time observation of microstructural changes with electron microscopy is necessary to understand the underlying principles of dynamic processes such as recrystallization, grain growth, and phase transformation during heating, cooling, and wetting.

Learn more ›

Multi-scale analysis

Novel materials must be analyzed at ever higher resolution while retaining the larger context of the sample. Multi-scale analysis allows for the correlation of various imaging tools and modalities such as X-ray microCT, DualBeam, Laser PFIB, SEM and TEM.

Learn more ›


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To ensure optimal system performance, we provide you access to a world-class network of field service experts, technical support, and certified spare parts.

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